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Altran and AdaCore Release Next-Generation Static Verification Toolset

Altran and AdaCore announce the release of the SPARK Pro 14.0 integrated development and verification environment. This product marks a major step forward in software verification technology, providing users with more powerful and easier to use tools that support the latest version of the SPARK language, SPARK 2014. SPARK Pro 14.0 offers an integrated approach to the entire software development and verification lifecycle – bringing software specification, coding, testing and unit verification by proof within a single integrated framework.

SPARK Pro 14.0 has been completely re-engineered to use the latest compiler and proof technology, providing advanced verification of an … Read More → "Altran and AdaCore Release Next-Generation Static Verification Toolset"

Abracon Announces Relaunch of Its MEMS Oscillators Series

Historically, reference oscillators used to clock a phase lock loop (PLL) circuit or provide a reference signal to any timing related circuit have predominantly utilized quartz crystals as the core resonators. The degree of difficulty associated with reducing the form factor of these devices, while controlling costs has been challenging. Furthermore, for wider temperature range solutions requiring tighter stabilities, crystal oscillators still tend to cost more than what the market is willing to bear. The newest generation of MEMS oscillators effectively addresses both challenges.

Microelectromechanical System (MEMS) based devices were first manufactured in the mid-1960s. Since … Read More → "Abracon Announces Relaunch of Its MEMS Oscillators Series"

Connectivity Package Links Concept Engineering, Verific Design Automation Tools

Freiburg, Germany, and ALAMEDA, CALIF. –– May 1, 2014 –– Electronic Design Automation (EDA) component software leaders Concept Engineering and Verific Design Automation today announced immediate availability of a connectivity package that links Concept Engineering’s NlviewTM schematic generator and visualization engine with Verific’s netlist database.

VVDI-Link gives Nlview, used within EDA tools to automatically create and visualize schematics for different levels of electronic circuits, direct access to the Verific database of industry-standard, IEEE-compliant SystemVerilog and VHDL parsers. It is available from Concept … Read More → "Connectivity Package Links Concept Engineering, Verific Design Automation Tools"

ESCATEC installs PCB router to increase quality and precision of contract manufacturing

Heerbrugg, Switzerland – 29 April 2014 – ESCATEC, one of Europe’s leading contract design and manufacturing companies, has installed an Elite EM-5700N PCB Separator.  This milling machine enables PCBs to be automatically separated from each other after production.  The camera vision system provides a cutting accuracy of 100 microns providing customers with a very high quality of PCB finish.

“Here in Switzerland, we specialize in high quality products so being able to provide this level of precision and finish is important to customers,” explained Dr. Martin Muendlein, ESCATEC Switzerland’s Engineering Manager.  “Normally such machines require a special jig to … Read More → "ESCATEC installs PCB router to increase quality and precision of contract manufacturing"

Standex-Meder Electronics Unveils KSK-1A35/1 Reed Switch

Standex-Meder Electronics, a leading manufacturer of sensors and magnetic components, announces the release of the world’s smallest high-voltage switch: the KSK-1A35/1 miniature reed switch.

At a maximum glass length of 10.5 and an overall lead length of 34.5mm, the KSK-1A35/1 can work with applications that may require the extra sensitivity of an ultra-miniature reed switch, while also providing an operating sensitivity range of 20 to 35 Ampere-turns (AT). With outstanding electrical characteristics like a switching voltage of up to 1000 volts of direct or alternating current, … Read More → "Standex-Meder Electronics Unveils KSK-1A35/1 Reed Switch"

Xilinx Kintex UltraScale FPGAs are First 20nm Devices to Achieve PCI Express Compliance

SAN JOSE, Calif.May 1, 2014 /PRNewswire/ — Xilinx, Inc. (NASDAQ: XLNX) today announced that its Kintex® UltraScale™ FPGAs are the first 20nm devices to achieve PCI Express® compliance and are now listed on the PCI-SIG® integrator’s list. The Kintex UltraScale FPGAs, with integrated Endpoint blocks for PCI Express enabling high performance applications, passed rigorous electrical, protocol, and interoperability tests at the latest PCI-SIG event held … Read More → "Xilinx Kintex UltraScale FPGAs are First 20nm Devices to Achieve PCI Express Compliance"

Indium10.1 Pb-Free Solder Paste Provides Lowest Voiding Levels for Large Ground Planes

Indium Corporation’s Indium10.1 Solder Paste is a Pb-free halogen-containing solder paste with the lowest levels of voiding for QFNs, BGAs, and pads with large ground planes. 

The oxidation-inhibiting properties of Indium10.1 promote industry-leading head-in-pillow and graping resistance, with complete coalescence, even after long reflow profiles. The exceptional soldering ability of Indium10.1 makes it the best solution for components with less-than-ideal solderability and challenging RF shield metallizations. 

Indium10.1 enables the lowest cost of ownership to PCB assembly manufacturers through an all-around balanced performance in both high … Read More → "Indium10.1 Pb-Free Solder Paste Provides Lowest Voiding Levels for Large Ground Planes"

Agilent Technologies Acquires Electrothermal Analysis Technology from Gradient Design Automation

SANTA CLARA, Calif., April 30, 2014 – Agilent Technologies Inc. (NYSE: A) today announced its acquisition of electrothermal analysis technology from Gradient Design Automation, the maker of HeatWave electrothermal analysis software. Agilent EEsof EDA now has sole ownership of Gradient’s core technology and will serve customers of both the integrated Advanced Design System software solution and Gradient’s HeatWave solution.

The electrothermal analysis technology allows designers to identify and correct thermal problems during integrated circuit development.

“Thermal management is one of the toughest challenges facing modern IC … Read More → "Agilent Technologies Acquires Electrothermal Analysis Technology from Gradient Design Automation"

TI delivers most robust single- and dual-channel gate drivers for automotive applications with Industry’s fastest propagation delays

DALLAS (April. 30, 2014) – Texas Instruments (TI) (NASDAQ:TXN) today introduced six, AEC-Q100-qualified gate drivers with industry’s fastest propagation delays of less than 15 nanoseconds. The UCC275xx-Q1 family of single- and dual-channel gate drivers provides the highest power efficiency, reliability and flexibility compared to existing solutions for automotive applications, such as powertrain, bi-directional converters (12- to 48-V and 12- to 400-V input), onboard charging, traction inverters, advanced driver assistance systems (ADAS), safety, headlamps and instrumentation clusters. For more information and samples, visit:  www.ti.com/ucc27531q1-pr</ … Read More → "TI delivers most robust single- and dual-channel gate drivers for automotive applications with Industry’s fastest propagation delays"

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