News – Page 1419 – EEJournal

Green Hills Expands Support for the Latest Freescale Automotive Processor Families

May 29, 2014

SANTA BARBARA, CA – May 28, 2014 — Green Hills Software, the largest independent software vendor for the Internet of Things, today announced the industry’s first combined support for the latest Freescale® Semiconductor automotive processor families – the Qorivva® MPC5xxx targeting engine and body applications and the MAC57Dxx family targeting digital instrument clusters. The Green Hills development suite seamlessly spans both the Power Architecture® and ARM® Cortex® architectures with the MULTI® IDE and multicore debugger, optimizing compilers, TimeMachine™ trace suite and processor probes, enabling carmakers and their Tier 1 software developers to lower the cost and complexity of creating software compliant … Read More → "Green Hills Expands Support for the Latest Freescale Automotive Processor Families"

Jim Hogan leads discussion on the IoT as a system — what are EDA concerns @ DAC’14?

May 29, 2014

What:

A discussion event on the IoT as a system……..how to define it, design for it, build it.

(This is a private event, i.e., not a part of the DAC program.)

Who:

• Jim Hogan, moderator, Vista Ventures, LLC
• Bernard Murphy, CTO, Atrenta
• Frank Schirrmeister, Group Director, System Development Suite, Cadence
• Gary Smith, … Read More → "Jim Hogan leads discussion on the IoT as a system — what are EDA concerns @ DAC’14?"

Cima NanoTech and Amdolla Group Announce Industry’s First Non-ITO Film-Based 42” Multi-Touch Module

May 29, 2014

SINGAPORE–(BUSINESS WIRE)–Cima NanoTech, a smart nanomaterials company specializing in high performance transparent conductive films, announced today the industry’s first ultra responsive, non-ITO film-based, 42-inch projected capacitive multi-touch module for large format touch applications. The module was built by Amdolla Group, a leader in advanced touch module manufacturing, using Cima NanoTech’s highly conductive, silver nanoparticle-based, SANTE® FS200 touch films. This product is targeted at applications including self-service kiosks, interactive tabletops, widescreen interactive digital signage, interactive flat panel displays, and other applications that require … Read More → "Cima NanoTech and Amdolla Group Announce Industry’s First Non-ITO Film-Based 42” Multi-Touch Module"

InvenSense Hosts 2014 Developers Conference At The Santa Clara Convention Center, June 11-12, 2014

May 28, 2014

SAN JOSE, California, May 28, 2014 – InvenSense, Inc. (NYSE: INVN), the leading provider of MotionTracking™ system on chip (SoC) and Sound devices, announced it is hosting the Read More → "InvenSense Hosts 2014 Developers Conference At The Santa Clara Convention Center, June 11-12, 2014"

Tech Trailblazers kicks off Enterprise Tech Startup Index

May 28, 2014

London, UK – Thursday, 15th May 2014 – The only independent global enterprise tech startup awards, the Tech Trailblazers, today announced the start of its research program to look at the challenges faced by, and the opportunities available to, the enterprise technology startup community around the world.

The research, which will run online until May 30^th, will explore regional expansion, funding, marketing, sales and channel strategy, recruitment and other key trends within this vibrant and exciting part of the startup space. All participants will be entered into a prize … Read More → "Tech Trailblazers kicks off Enterprise Tech Startup Index"

Sidense Presenting at Design Automation Conference (DAC) in San Francisco

May 28, 2014

Ottawa, Canada and Santa Clara, Calif. —

What

Sidense will be presenting at both the TSMC booth (#1801) and ChipEstimate.com booth (#1533) at the Design Automation Conference in San Francisco.

Sidense’s presentation, “1T-OTP NVM for Advanced Process Nodes,” will discuss NVM requirements for critical semiconductor industry market segments and describe an embedded one-time programmable (OTP) memory subsystem targeting advanced process nodes from 40nm down to FinFET.

Where

Moscone Center

747 Howard St.

Allegro DVT showcases its HEVC/H.265 Video Encoder IP at DAC 2014.

May 28, 2014

Grenoble, France – May 28, 2014 . At DAC 2014, Allegro DVT will perform a live demonstration of its HEVC/H.265 encoder IP core. The demonstration will be conducted on a prototyping platform, demonstrating the features and video quality of our HEVC/H.265 encoder IP.

High Efficiency Video Coding (HEVC), alias H.265, is the next generation video standard, which brings 50% bitrate savings compared to equivalent H.264/AVC encodings. HEVC is expected to be the mainstream video standard for the next decade, as it technically supersedes all other video formats.

Allegro DVT HEVC/H.265 encoder IP core supports Main and Main10 … Read More → "Allegro DVT showcases its HEVC/H.265 Video Encoder IP at DAC 2014."

Agilent Technologies Genesys 2014 Delivers Breakthrough Modulated RF Analysis for Circuit, System Design

May 28, 2014

SANTA CLARA, Calif., May 27, 2014 – Agilent Technologies Inc. (NYSE: A) today announced the latest release of Genesys 2014, its industry-leading, affordable RF simulation and synthesis software. Designed for circuit and system designers, the Agilent EEsof EDA software features breakthrough modulated RF analysis as well as enhancements to its powerful, custom-filter direct synthesis technology.

Using Genesys 2014, designers can now simulate digitally modulated RF signals like those found in today’s defense and consumer wireless applications as easily as they do traditional analog RF signals. Unlike other simulators that provide … Read More → "Agilent Technologies Genesys 2014 Delivers Breakthrough Modulated RF Analysis for Circuit, System Design"

Real Intent Unveils New Release of Ascent Lint for Early Verification of Digital Designs

May 28, 2014

SUNNYVALE, Calif. – May 22, 2014 – Real Intent, Inc., a leading provider of EDA software products today announced the 2014 version of its Ascent Lint product, the industry’s fastest and most accurate tool for early verification of digital designs, with significant new enhancements for users. In addition it announced the tight integration of Ascent Lint within MATLAB® and Simulink®, the market-leading technical computing software from Read More → "Real Intent Unveils New Release of Ascent Lint for Early Verification of Digital Designs"

2kVAC Isolated 1.5W Low Noise µModule Converters in 9mm x 11.25mm x 4.92mm BGA Package Are UL60950 Recognized

May 28, 2014

MILPITAS, CA – May 28, 2014 – Linear Technology Corporation introduces the LTM8057 and Read More → "2kVAC Isolated 1.5W Low Noise µModule Converters in 9mm x 11.25mm x 4.92mm BGA Package Are UL60950 Recognized"