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Calling all tech start-ups to enter – Discovering Start-Ups 2014 Competition

July 9, 2014

08.07.14 Cambridge, UK: Cambridge Wireless and Silicon SouthWest are calling on innovative tech start-ups and digital entrepreneurs from across the UK to enter the Discovering Start-Ups 2014 competition. With extraordinary start-up stories coming from hi-tech hubs like Cambridge’s Silicon Fen and Shoreditch’s Silicon Roundabout, the annual competition provides a showcase for disruptive newcomers to the wireless technology industry and demonstrates that the UK start-up scene has everything it takes to successfully compete with Silicon </ … Read More → "Calling all tech start-ups to enter – Discovering Start-Ups 2014 Competition"

Indium Corporation Announces RMA-155 Pb-Free Solder Paste

July 9, 2014

Indium Corporation recently released RMA-155 Pb-Free Solder Paste. RMA-155 is the best solder paste for customers who are required to use RMA materials, but who need the performance benefits of modern Pb-free solder paste technology. 

RMA-155 was designed for balanced performance, making it ideal for high-complexity boards with a variety of component sizes, as well as simple assemblies. Compatible with both SnPb and SAC alloys, RMA-155 delivers consistent transfer efficiencies, excellent response-to-pause, and a strong oxidation barrier, even for long and hot profiles. It is halogen-free, resists graping … Read More → "Indium Corporation Announces RMA-155 Pb-Free Solder Paste"

KLA-Tencor Introduces Inspection and Review Portfolio for Leading IC Technologies

July 8, 2014

SAN FRANCISCO, Calif., July 7, 2014—Today at SEMICON West, KLA-Tencor Corporation (NASDAQ: KLAC) announced four new systems—the 2920 Series, Puma™ 9850, Surfscan® SP5 and eDR™-7110—that provide advanced defect inspection and review capability for the development and production of 16nm and below IC devices. The 2920 Series broadband plasma patterned wafer, Puma 9850 laser scanning patterned wafer, and Surfscan SP5 unpatterned wafer defect inspection systems deliver enhanced sensitivity and significant throughput gains. By enabling discovery and monitoring of yield-critical defects, these inspectors support chipmakers’ integration of complex structures, novel materials and … Read More → "KLA-Tencor Introduces Inspection and Review Portfolio for Leading IC Technologies"

Synopsys Expands Verification IP Portfolio with Compliance Test Suites

July 8, 2014

MOUNTAIN VIEW, Calif., July 8, 2014 /PRNewswire/ — Synopsys, Inc. (NASDAQ: SNPS), a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced the availability of key protocol compliance test suites. Delivered as SystemVerilog source code to ease integration and enable re-use across multiple projects, the test suites are complete, self-contained and design-proven testbenches that eliminate the task of developing a verification environment and tests for protocol compliance verification. Furthermore, having test suites in source code enables end-users to easily customize or extend compliance … Read More → "Synopsys Expands Verification IP Portfolio with Compliance Test Suites"

ADLINK Announces Rugged SWaP-optimized 6U VPX Radar Solution

July 8, 2014

San Jose, CA – July 8, 2014  – ADLINK Technology, Inc., a leading global provider of cloud-based services, intelligent gateways and embedded building blocks for edge devices that enable the Internet of Things (IoT), today announced the VPX6000, a rugged 6U VPX blade featuring a dual processor design based on quad-core 4th generation Intel® Core™ i7-4700EQ processors. The VPX6000 is a high performance blade designed to meet MIL-STD-810F for harsh environments and provide the high availability required for mission-critical applications, including radar, sonar, UAV and UGV in defense and aerospace. 

The two CPU sub-systems are connected by a … Read More → "ADLINK Announces Rugged SWaP-optimized 6U VPX Radar Solution"

Mentor Graphics Expands Automotive Portfolio, Acquires XS Embedded to Reduce Time to Start of Production (SOP)

July 8, 2014

WILSONVILLE, Ore., July 8, 2014 /PRNewswire/ — Mentor Graphics Corporation (NASDAQ: MENT) today announced the acquisition ofXS Embedded GmbH (XSe), a technology leader in the creation of automotive system architectures and hardware reference platforms. XSe … Read More → "Mentor Graphics Expands Automotive Portfolio, Acquires XS Embedded to Reduce Time to Start of Production (SOP)"

Imec and its Partners Achieve Record Efficiency for Large Area Industrial Crystalline-silicon n-PERT Solar Cell

July 8, 2014

SEMICON WEST/INTERSOLAR NORTH AMERICA (Booth #SH2311), San Francisco — July 7, 2014 — Nano-electronics research center imec, reported today an n-type PERT crystalline silicon (Si) solar cell fabricated on a large area wafer (15.6cm x 15.6 cm) reaching a top conversion efficiency of 21.5 percent (calibrated at ISE Callab). This is the highest efficiency achieved for this type of solar cell on an industrial large area wafer size. This result will accelerate the adoption of n-type PERT (Passivated Emitter, Rear Totally diffused) solar cells in the industry as it clearly shows the potential for improved conversion efficiencies for next generation standard two side … Read More → "Imec and its Partners Achieve Record Efficiency for Large Area Industrial Crystalline-silicon n-PERT Solar Cell"

Synopsys Cuts Area of DesignWare NVM IP for Automotive Grade 0 Applications by 75 Percent

July 8, 2014

MOUNTAIN VIEW, Calif., July 8, 2014 /PRNewswire/ —

Highlights:

  • Synopsys DesignWare® AEON® Trim Non-Volatile Memory (NVM) IP for high-voltage processes offers 75 percent smaller IP area compared to existing reprogrammable NVM IP solutions, reducing the cost and size of high-reliability automotive ICs
  • Meets stringent automotive Grade 0 temperature (-40C to 150C) and AEC-Q100 quality requirements
  • Faster programming times and specialized test modes reduce NVM test time by 3X compared to alternative IP offerings
  • Reprogrammable NVM with 15+ year data … Read More → "Synopsys Cuts Area of DesignWare NVM IP for Automotive Grade 0 Applications by 75 Percent"

InvenSense To Acquire Movea, A Leading Provider Of Ultra-Low Power Motion And Data Fusion Software Platforms And Trusted Positioning, Inc., A Leader In Indoor/Outdoor Location Technology

July 8, 2014

SAN JOSE, California, July 7, 2014 – InvenSense, Inc. (NYSE: INVN), the leading provider of intelligent sensor solutions, announced that it has signed a definitive agreement to acquire Movea, a privately-held company that is a leading provider of software for ultra-low power location, activity tracking and context sensing. Movea’s products, technology and IP cover a broad range of signal processing and data fusion technology applied to consumer mobile (smartphones and tablets), TV interaction and wearable sports & fitness applications. Movea’s world class team is dedicated to context analysis using both motion … Read More → "InvenSense To Acquire Movea, A Leading Provider Of Ultra-Low Power Motion And Data Fusion Software Platforms And Trusted Positioning, Inc., A Leader In Indoor/Outdoor Location Technology"

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