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Novel artificial muscles move with sound

November 3, 2025

Researchers at ETH Zurich have developed artificial muscles that contain microbubbles and can be controlled with ultrasound. In the future, these muscles could be deployed in technical and medical settings as gripper arms, tissue patches, targeted drug delivery, or robots.

It might look like a simple material experiment at first glance, as a brief ultrasound stimulation induces a thin strip of silicone to start bending and arching. But that’s just … Read More → "Novel artificial muscles move with sound"

Magnachip Launches 650V Super Junction TOLL Package Products with Integrated Kelvin Source

October 30, 2025

– New Package Lineup Targets Premium Consumer Electronics and High-Power/High-Current Markets

– Additional SJ MOSFET TOLL products are planned to be released for AI Data Centers

Seoul, October 29, 2025 – Magnachip Semiconductor Corporation (NYSE: MX, “Magnachip”) today announced the release of two new 650V Super Junction MOSFET (SJ MOSFET) products, adopting the TO-Leadless (TOLL) package, that are designed to meet the high-power and high-current requirements of premium consumer electronics such as premium TVs, gaming monitors, AI laptop adaptors, and chargers.

Current Magnachip products with TOLL packaging, such as … Read More → "Magnachip Launches 650V Super Junction TOLL Package Products with Integrated Kelvin Source"

EMASS Advances ECS-DoT Deployment Through Collaboration with Arrow Electronics

Collaboration established to advance Ultra-Low-Power Edge AI Integration
October 30, 2025

SINGAPORE (Oct. 29, 2025) – EMASS, a Nanoveu subsidiary with next-generation semiconductor technology; and Arrow Electronics, a global provider of technology solutions have announced a collaboration to propel the deployment of EMASS’ ECS-DoT SoC, designed for ultra-low-power edge AI solutions across drones, wearables, industrial IoT and smart sensing devices.

The collaboration combines Arrow’s global engineering reach, design-for-manufacture expertise, distribution and supply-chain services with EMASS’s milliwatt-class, on-device AI technology to help customers build and ship always-on products faster.

EMASS and Arrow are developing enhanced SDKs, developer tools and reference designs to expand the edge AI ecosystem. The … Read More → "EMASS Advances ECS-DoT Deployment Through Collaboration with Arrow Electronics"

Abaco Systems Launches NVB2000xX and NVB500xX XMC Graphics and GPGPU Cards Featuring NVIDIA RTX Pro™ Blackwell Architecture

October 30, 2025

Huntsville, Ala., October 29, 2025 – Abaco Systems announces the launch of its new NVB2000xX and NVB500xX XMC Graphics and GPGPU cards, powered by the NVIDIA RTX Pro™ Blackwell GPU. As the first architecture to support GDDR7 memory, NVIDIA Blackwell delivers significant advancements in bandwidth, signal integrity, and power efficiency, making it ideal for demanding embedded environments.

To meet diverse performance needs, Abaco offers two configurations based … Read More → "Abaco Systems Launches NVB2000xX and NVB500xX XMC Graphics and GPGPU Cards Featuring NVIDIA RTX Pro™ Blackwell Architecture"

NXP Improves Battery Health Monitoring with EIS Capable Battery Management Chipset

October 30, 2025
  • NXP unveils industry-first, battery management system (BMS) chipset with built-in Electrochemical Impedance Spectroscopy (EIS) using precise hardware-based synchronization of all battery cell measurements within a single high-voltage battery pack
  • Brings lab-grade diagnostics into vehicles, enhancing battery health insights and expanding NXP’s electrification portfolio with advanced monitoring capabilities
  • Simplified and cost-efficient battery cell monitoring allows automakers track battery health, improve electric vehicle (EV) safety, and support fast charging

EINDHOVEN, The Netherlands, October 29, 2025 – NXP Semiconductors N.V. (NASDAQ: NXPI) today announced its industry-first Electrochemical Impedance Spectroscopy (EIS) battery … Read More → "NXP Improves Battery Health Monitoring with EIS Capable Battery Management Chipset"

Silicon carbide power modules in new EasyPACK™ C package enhance efficiency and lifetime of industrial applications

October 29, 2025

Munich, Germany – 29 October – Industrial applications such as fast DC electric vehicle (EV) charging, megawatt charging, energy storage systems and uninterruptible power supplies operate under harsh conditions and fluctuating load profiles. These systems demand high efficiency, robust power cycling capability and long lifetime. To meet these requirements, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is launching EasyPACK™ C, the next generation of its EasyPACK package family. The first products in this new package are silicon carbide (SiC) power modules that integrate Infineon’ … Read More → "Silicon carbide power modules in new EasyPACK™ C package enhance efficiency and lifetime of industrial applications"

New QSMP-23 module offers cost-optimised STM32 MPU platform to boost machine learning edge computing

QFN-style 27mm2 SoM features dual ARM Cortex-A35, NPU, VPU & GPU to combine ML edge processing with powerful multimedia capabilities
October 29, 2025

Oxfordshire, UK, October 2025: Direct Insight, the UK-based technical systems integrator focused on system-on-module (SoM) solutions, can now deliver and support development for cost-optimised ML edge computing applications with Read More → "New QSMP-23 module offers cost-optimised STM32 MPU platform to boost machine learning edge computing"

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