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PULS to showcase Decentralised Field Power supplies and Industrial Wireless Charging at IntraLogisteX 2026

18th – 19th March - NEC Birmingham - Stand 707
February 19, 2026

PULS, an innovation leader in power supply technology, announces its participation at IntraLogisteX in Birmingham, where it will showcase its expanding range of decentralised field power supplies for intralogistics and material handling, and demonstrate its industrial wireless charging solutions for mobile robotics. The event provides machine builders, system integrators and industrial automation teams with the opportunity to explore practical approaches to scalable DC … Read More → "PULS to showcase Decentralised Field Power supplies and Industrial Wireless Charging at IntraLogisteX 2026"

CEA-Leti Validates First Ultra-Fast, Battery-Operated EPR Spectrometer at Chip Scale

ISSCC Paper Presents New 22 nm IC That Delivers Record Scan Speed, Wide Spectral Coverage, and High Sensitivity—Moving Electron Paramagnetic Resonance into Portable Systems
February 18, 2026

SAN FRANCISCO — Feb. 18, 2026 — Researchers at CEA-Leti and CEA-IRIG-SyMMES* have validated a chip-scale electron paramagnetic resonance (EPR) spectrometer that achieves unprecedented scan speed, spectral span, and sensitivity from a battery-operated integrated circuit. By replacing the bulky electromagnets used in conventional EPR instruments with an ultra-fast frequency-scanned architecture, the system enables high-performance paramagnetic sensing in portable and space-constrained environments where traditional systems cannot operate.

*SyMMES, the Molecular Systems and (Nano)Materials for Energy and Health Laboratory, is one of IRIG’s joint research units (UMR 5819). It brings together staff from CEA, the French National … Read More → "CEA-Leti Validates First Ultra-Fast, Battery-Operated EPR Spectrometer at Chip Scale"

CEA Demonstrates First Dynamically Routed Electro-Optical Router for Photonic Interposers

ISSCC 2026 Presentation Shows a 28 nm CMOS Router Achieving 18 ns Frame-Level Optical Path Setup
February 18, 2026

SAN FRANCISCO — Feb. 18, 2026 — Researchers from CEA-List and CEA-Leti today unveiled at ISSCC  the first electro-optical router with dynamic, frame-level optical routing integrated with CMOS control logic, marking a major step toward practical optical networking inside advanced chiplet-based packages.

Their paper, “A 3.19pJ/bit Electro-Optical Router with 18ns Setup Frame-Level Routing and 1-6 Wavelength Flexible Link Capacity for Photonic Interposers”, demonstrates an electro-optical router implemented in 28 nm CMOS on a photonic interposer, capable of establishing optical paths in 18 nanoseconds. It dynamically selects one-to-six wavelengths per link, and achieves an energy efficiency of 3.19 pJ/bit … Read More → "CEA Demonstrates First Dynamically Routed Electro-Optical Router for Photonic Interposers"

e-con Systems Launches DepthVista Helix 3D CW iToF Camera for Robotics and Industrial Automation

February 18, 2026

California & Chennai (February 17, 2026): e-con Systems®, a global leader in embedded vision solutions, launches DepthVista Helix 3D Continuous Wave iToF Camera, a high-performance depth camera engineered to deliver reliable and accurate 3D perception for wide range of industrial robotics applications, including Autonomous Mobile Robots (AMRs), pick-and-place, bin-picking, palletization and depalletization robots, industrial safety and automation, and smart agriculture.

This new camera is based on a 1.2MP onsemi Hyperlux ID … Read More → "e-con Systems Launches DepthVista Helix 3D CW iToF Camera for Robotics and Industrial Automation"

TASKING Delivers Advanced Worst-Case Timing Coupling Analysis and Mitigation for Multicore Designs

The enhanced TASKING integrated toolchain combines compile, debug, and test capabilities to automate the measurement, assessment, and optimization of hidden timing interference in multicore SoCs for safety- and security-critical applications
February 18, 2026

MUNICH – February 18, 2026 – TASKING, a global leader in high-performance embedded software development tools, today announced enhancements to its unified toolchain that provide greater in-depth timing analysis of real-time, multicore embedded systems. With the integration of TASKING’s compiler technology, BlueBox debuggers, winIDEA IDE, and the LDRA tool suite, developers can more accurately assess complex timing issues such as worst-case execution time (WCET) as outlined by industry standards. By accelerating and simplifying complex timing coupling analysis, TASKING helps OEMs reduce the risks and costs associated with certifying mission-critical multicore systems, including applications in aerospace, automotive, industrial, and robotics such as collaborative … Read More → "TASKING Delivers Advanced Worst-Case Timing Coupling Analysis and Mitigation for Multicore Designs"

Vishay Intertechnology AEC-Q200 Qualified Thick Film Chip Resistors Feature Ultra Compact 0201 Case Size

Devices Save Space While Maintaining High Reliability in Automotive, Industrial, and Telecommunications Applications
February 18, 2026

MALVERN, Pa. — Feb. 18, 2026 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new series of AEC-Q200 qualified thick film chip resistors in the ultra compact 0201 case size. Offering a miniature footprint of just 0.6 mm by 0.3 mm by 0.23 mm, the CRCW0201-AT e3 series devices provide designers with a reliable, space-saving solution for automotive, industrial, and telecommunications applications.

Compared to devices in the next-larger 0402 case size, the resistors released today are available at a competitive price, while reducing PCB requirements by 50 %. For designers, this supports the ongoing downsizing trend in modern electronics, while maintaining stable electrical performance and high … Read More → "Vishay Intertechnology AEC-Q200 Qualified Thick Film Chip Resistors Feature Ultra Compact 0201 Case Size"

Renesas Develops SoC Technologies for Automotive Multi-Domain ECUs Essential for the SDV Era

February 18, 2026
  • Scalability and functional safety enabled by chiplet technology
  • Auto-grade quality for large, modern AI NPUs
  • Advanced power control for higher performance, improved power efficiency and safety
  • New technology presented at the ISSCC 2026 in San Francisco

TOKYO, Japan and SAN FRANCISCO, Calif., February 18, 2026 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, has developed three System-on-Chip (SoC) technologies for automotive multi-domain electronic control units (ECUs). They feature advanced AI processing capabilities and chiplet functions, serving as the core technology platform for next-generation automotive electrical/electronic (E/E) architectures. … Read More → "Renesas Develops SoC Technologies for Automotive Multi-Domain ECUs Essential for the SDV Era"

NXP Semiconductors i.MX 91 Processors, Now Available from Mouser Electronics, Support IoT, Edge, Smart Home, Industrial Applications, and More

February 18, 2026

February 17, 2026 – Mouser Electronics, Inc., the authorized global distributor with the newest electronic components and industrial automation products, is now shipping the new energy-efficient i.MX 91 applications processors from NXP® Semiconductors. The i.MX 91 processors enable the rapid development of Linux-based edge devices for smart home, consumer, Read More → "NXP Semiconductors i.MX 91 Processors, Now Available from Mouser Electronics, Support IoT, Edge, Smart Home, Industrial Applications, and More"

Ceva Highlights Breakthrough Year for AI Licensing and Physical AI Adoption in 2025

February 18, 2026

ROCKVILLE, MD., – February 17, 2026 – Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP for the smart edge, today announced that 2025 marked a breakthrough year for its artificial intelligence (“AI”) licensing business, with 10 NeuPro™ neural processing unit (“NPU”) agreements signed and with AI contributing more than 20% of annual licensing revenue in 2025.

As AI expands beyond the cloud into real-world devices, demand is accelerating for optimized, power-efficient neural processing architectures supporting both edge and hybrid AI models. This shift is driving broader adoption of on-device AI inference across diversified smart edge markets and further positions Ceva as … Read More → "Ceva Highlights Breakthrough Year for AI Licensing and Physical AI Adoption in 2025"

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