News – Page 1391 – EEJournal

3.3V/5V 20Mbps RS-485 Transceiver Family Provides ±60V Fault Protection for Improved System Reliability

February 10, 2016

Fremont, CA – February 10, 2016 – Exar Corporation (NYSE: EXAR), a leading supplier of analog mixed-signal products serving the industrial, high-end consumer and infrastructure markets, introduces a new family of ±60V fault protected RS-485/RS-422 (TIA-485/TIA-422) transceivers able to withstand direct shorts and achieve overvoltage protection with no external components. Designed for improved performance in noisy industrial environments and increased tolerance to system faults, these transceivers simplify design in building automation, HVAC networks, energy metering, process control and other industrial automation applications.

At initial … Read More → "3.3V/5V 20Mbps RS-485 Transceiver Family Provides ±60V Fault Protection for Improved System Reliability"

RUTRONIK SMART: New low power Bluetooth module from Panasonic for IoT applications

February 10, 2016

Cleveland / Ispringen (Germany), February 10, 2016 – The new PAN1760 Series Bluetooth Smart module v4.1 with integrated antenna and embedded GATT profile is a cost-effective, low-power, true system-on-chip (SoC) solution. This nanopower module for the Internet of Things, launched by Panasonic Automotive & Industrial Systems, is available at distributor Rutronik.

The PAN1760 module is suitable for low energy Bluetooth applications such as data transfer to smartphones and tablets, wireless health monitoring, smart home, general industry, and portable applications without host … Read More → "RUTRONIK SMART: New low power Bluetooth module from Panasonic for IoT applications"

Orbotech Collaborates with Nippon Mektron to Optimize Digital Flexible Printed Circuit Board Manufacturing

February 10, 2016

YAVNE, Israel, February 10, 2016 ? ORBOTECH LTD. (NASDAQ: ORBK) today announced that, Nippon Mektron Mektec, the world’s most dominant maker of flexible printed circuit boards (FPCBs), is deploying Orbotech direct imaging (DI) and automated optical inspection (AOI) systems in multiple factories. These systems will significantly improve current and future smartphone manufacturing by facilitating the creation of flex inspections and high-throughput production capability.

< … Read More →

Open Interconnect Consortium Helps Developers Tackle Internet of Things with New Developer Toolkit

February 10, 2016

February 10, 2016. Portland, Oregon – Today, the Open Interconnect Consortium (OIC) announced the availability of an important update for developers that will help organizations swiftly navigate the OIC’s resources to quickly take advantage of the technologies and infrastructure developed, furthering standardization for the Internet of Things (IoT).

“IoT puts a lot of pressure on developers to create applications that work seamlessly. IoT technologies can be tricky and difficult to implement in a real world use case,” said Mike Richmond, executive director at the Open Interconnect Consortium. “With this updated developer … Read More → "Open Interconnect Consortium Helps Developers Tackle Internet of Things with New Developer Toolkit"

Cima NanoTech Debuts Large Interactive Touch Screens with European Customers at ISE 2016

February 9, 2016

Amsterdam, February 9, 2016 – Cima NanoTech, a developer and manufacturer of transparent conductive film solutions, is showcasing industry leading interactive touch screen products enabled by its SANTE® ProTouch™ module for the first time in Europe at ISE 2016. Backed by proven customer traction in the US and Asia, with touch screen displays enabled by SANTE ProTouch modules already out in the market, the company is increasing its footprint in Europe. Products on show include an interactive touch screen embedded in a coffee table as well as devices from customers such as Anoto, a global leader in digital writing and drawing solutions, and … Read More → "Cima NanoTech Debuts Large Interactive Touch Screens with European Customers at ISE 2016"

AVX Introduces A New Series of Conductive Polymer Chip Capacitors for Demanding Automotive Applications

February 9, 2016

FOUNTAIN INN, S.C. (February 9, 2015) – AVX Corporation, a leading manufacturer of passive components and interconnect solutions, has introduced the robust new TCQ Series automotive conductive polymer chip capacitors. Qualified to the Automotive Electronics Council’s AEC-Q200 specification for passive components, the TCQ Series meets the AEC’s challenging 125°C lifetime stability test and humidity bias testing at 85°C and 85% relative humidity for up to 1,000 hours.

“The AEC-Q200 lifetime stability and humidity bias tests are notoriously difficult for polymer capacitors to pass due to inherent material limitations. As such, we based our new TCQ Series … Read More → "AVX Introduces A New Series of Conductive Polymer Chip Capacitors for Demanding Automotive Applications"

Ampleon and HAS University collaborate on full spectrum lighting research for horticultural applications

February 9, 2016

Nijmegen, The Netherlands – 9 February 2016. Ampleon today announced that it has entered into a collaborative research project with the HAS University of Applied Sciences in Den Bosch, The Netherlands into the use of full spectrum lighting for horticultural applications. In addition the project will validate and summarize current research and investigations that are available.

Lighting plays an increasing role in horticulture, both for urban farming, for cultivation without daylight, and increasingly also in greenhouses. Until now the focus has mainly been on higher … Read More → "Ampleon and HAS University collaborate on full spectrum lighting research for horticultural applications"

Kalray To Launch High Speed I/O Processors

February 9, 2016

Santa Clara Calif., – February 9, 2016 – Kalray Inc., the pioneer in many-core processing, today in conjunction with the Linley Data Center Conference, announced general availability of KONIC-80, a programmable smart NIC based on Bostan, its second generation many-core processor, by March, 2016. Kalray’s solutions deliver features for today’s network, security, and storage acceleration requirements. The Linley Data Center Conference takes place at the Hyatt Regency Hotel, Santa Clara, Calif., from February 9-10.

“Bostan’s unique architecture provides high computing performance with real time processing and low power consumption,” said Jag Bolaria, principal analyst at The Linley Group. </ … Read More → "Kalray To Launch High Speed I/O Processors"

Trustonic simplifies security for mobile and IoT apps developers

February 9, 2016

CAMBRIDGE, UK – 8 February 2016: Trustonic, the leading provider of hardware-enabled security for smart devices announces Trustonic Hybrid Protection (THP). App developers can now more easily utilize the most advanced security capabilities available on a given device. THP makes it easier for developers to design in security from the start, and to deploy these enhanced services across the widest range of mobile and IoT devices.

Trustonic Hybrid Protection (THP) is an adaptable security solution bringing together the best of software and hardware secured solutions into one hybrid product. Trustonic combines its advanced hardware enabled security solutions found in over 500 … Read More → "Trustonic simplifies security for mobile and IoT apps developers"

Microsoft Selects TechBlocks as a key Go-to-Market Partner for their Internet of Things (IoT) Initiatives

February 9, 2016

TORONTO, Feb. 9, 2016 /CNW/ – TechBlocks is proud to be chosen by Microsoft as one of the Red Carpet Program partners for Microsoft Azure Internet of Things (IoT) offerings. The IoT Red Carpet program is a worldwide invitation only Microsoft program for selected Microsoft partners intended to help them develop and grow their practices through accelerated development of solutions and services based upon Microsoft Azure IoT.

The Red Carpet Program is a worldwide initiative in which Microsoft has carefully selected … Read More → "Microsoft Selects TechBlocks as a key Go-to-Market Partner for their Internet of Things (IoT) Initiatives"

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