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ADLINK Introduces AmITX-SL-G Embedded Board with 6th Generation Intel® Core™ Processor

March 15, 2016

San Jose, CA – March 15, 2016 – ADLINK Technology, Inc., a leading global provider of cloud- based services, intelligent gateways, and embedded building blocks for edge devices that enable the Internet of Things (IoT), introduces the AmITX-SL-G, a compact embedded computing platform equipped with high-performance, low-power 6th generation Intel® Core™ i7/i5/i3 processors. The AmITX-SL-G design follows the Form, Fit, Function principle for scalable development, reducing time-to-market for embedded applications.

The latest Mini-ITX combines the new 6th generation Intel® Core™ i7/i5/i3 processors and Intel® Q170/H110 chipsets with one of the industry’s most versatile form factors. … Read More → "ADLINK Introduces AmITX-SL-G Embedded Board with 6th Generation Intel® Core™ Processor"

Mentor Graphics Enhances Support for TSMC 7nm Design Starts and 10nm Production

March 15, 2016

WILSONVILLE, Ore., March 15, 2016— Mentor Graphics Corporation (NASDAQ: MENT) today announced further enhancements and optimizations to the Calibre® platform and Analog FastSPICE™ (AFS) platform by completing TSMC 10nm FinFET V1.0 certification. In addition, the Calibre and Analog FastSPICE platforms are ready for early design starts and IP design on TSMC’s 7nm FinFET process based on the most current Design Rule Manual (DRM) and SPICE model.

To help mutual customers prepare their designs for advanced manufacturing processes,  Mentor has made improvements for 10nm … Read More → "Mentor Graphics Enhances Support for TSMC 7nm Design Starts and 10nm Production"

myDevices Announces Pi Day Project Competition

March 14, 2016

LOS ANGELES, March 14, 2016—myDevices, the Internet of Things (IoT) solutions company that “simplifies the connected world,” today announced a Raspberry Pi Call for Projects – in honor of Pi Day – in which makers will  build and submit creative IoT projects using myDevices’ Cayenne and Raspberry Pi.

Raspberry Pi Day Call for Projects

myDevices is sponsoring a Pi Day competition, in which the maker of the winning project will be provided an all-expenses paid trip* to demonstrate their project in myDevices’ booth at Maker Faire in San Mateo on May 21 … Read More → "myDevices Announces Pi Day Project Competition"

Dialog Semiconductor’s Bluetooth Smart SoC Provides Connectivity for Misfit Shine 2™ Fitness Tracker

March 14, 2016

London, United Kingdom – March 14, 2016 – Dialog Semiconductor plc (FWB:DLG), a provider of highly integrated power management, AC/DC power conversion, solid state lighting (SSL) and Bluetooth® Smart technology, today announced its latest design win in a consumer wearable device. The Misfit Shine 2 fitness and sleep monitor uses the Dialog DA14581 SmartBond™ Bluetooth Smart System-on-Chip (SoC) to connect to smartphones and other Bluetooth-enabled devices. Misfit merged with Fossil Group, a global design, marketing, and distribution company specializing in consumer lifestyle and fashion accessories, in December 2015.

< … Read More → "Dialog Semiconductor’s Bluetooth Smart SoC Provides Connectivity for Misfit Shine 2™ Fitness Tracker"

Renesas Electronics Delivers New Lineup of Intelligent Power Devices with Low On-Resistance as Replacement for Relays in Automotive Applications to Contribute to Reduced Vehicle Weight

March 14, 2016

Düsseldorf, March 14, 2016 – Renesas Electronics, a premier supplier of advanced semiconductor solutions, today announced the availability of six new intelligent power devices (IPDs) for automotive motor and heater control applications. The devices provide an extremely reliable, high-performance solution compared with mechanical relays that switch the current flow on and off in electronic control units (ECUs).

An IPD is a power IC device that integrates in a single package … Read More → "Renesas Electronics Delivers New Lineup of Intelligent Power Devices with Low On-Resistance as Replacement for Relays in Automotive Applications to Contribute to Reduced Vehicle Weight"

TSMC Certifies Synopsys IC Compiler II for 10-nm FinFET Production and 7-nm Early Design Starts

March 14, 2016

MOUNTAIN VIEW, Calif., March 14, 2016 /PRNewswire/ —

Highlights:

  • IC Compiler II momentum is accelerated with TSMC certification at 10-nm
  • Broad and deep collaboration made certification possible in significantly less time than previous technology nodes
  • Advanced Waveform Propagation technology in the Galaxy Design Platform enables ultra-low voltage design in the new technology nodes

Synopsys, Inc. (Nasdaq: SNPS) today announced that TSMC has completed the certification for its most advanced 10-nanometer (nm) FinFET v1.0 technology node for … Read More → "TSMC Certifies Synopsys IC Compiler II for 10-nm FinFET Production and 7-nm Early Design Starts"

VisualSim Power Analyzer generates cycle-accurate power measurement for SoC, memory and systems from a system-level model

March 14, 2016

Highlights:

  • Power measurement at the system-level with VisualSim provides designer the ability to refine their architecture for higher performance with longer battery life
  • Instantaneous and Average power consumption reports of individual resources and full system

Sunnyvale, CA. – March 14, 2016 – Mirabilis Design Inc., an Electronic System-Level Modeling and Simulation Company, announced the immediate availability of the VisualSim Power Analyzer library. The VisualSim Power Analyzer is the first use-case driven power analysis software for both systems and semiconductors. The power equations and state-machine are fully integrated into all the major library blocks in the … Read More → "VisualSim Power Analyzer generates cycle-accurate power measurement for SoC, memory and systems from a system-level model"

Low-Power Electric Motors Can Now Dissipate Even Less Power with New Intelligent Power Modules from STMicroelectronics

March 14, 2016

Geneva, March 14, 2016 – STMicroelectronics has expanded its Intelligent Power Module portfolio with the introduction of the SLLIMM™[1] -nano 2nd series, adding higher power levels and new package options that are especially suited to increasing the efficiency and reducing cost. The new SLLIMM-nano devices suit compressors, pumps, and fans in domestic appliances such as refrigerators and washing machines, and any low-power motors working up to 20 kHz in hard-switching circuits in an application power … Read More → "Low-Power Electric Motors Can Now Dissipate Even Less Power with New Intelligent Power Modules from STMicroelectronics"

Synopsys Announces Broad IP Portfolio for TSMC 16FFC Process

March 14, 2016

MOUNTAIN VIEW, Calif., March 14, 2016 /PRNewswire/ —

Highlights:

  • DesignWare interface and analog IP portfolio for TSMC 16FFC process includes USB 3.1/3.0/2.0, USB Type C 3.1/DisplayPort 1.3, DDR4/3, LPDDR4, PCI Express 4.0/3.1/2.1, SATA 6G, HDMI 2.0, MIPI M-PHY and D-PHY, and data converters
  • High-speed, high-density and ultra-high-density logic libraries, memory compilers and High-Performance Core Design Kits deliver superior performance, power and area on TSMC 16FFC
  • STAR Memory System® provides efficient diagnostics and repair of FinFET-based memories, while STAR Hierarchical System automates hierarchical testing for SoCs</ … Read More → "Synopsys Announces Broad IP Portfolio for TSMC 16FFC Process"
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