News – Page 1358 – EEJournal

Fast Processor Model of Renesas RL78 CPU Released by Imperas for Open Virtual Platforms

May 31, 2016

OXFORD, United Kingdom, 31 May 2016 – Imperas™ and eSOL TRINITY announced today the release of the Open Virtual Platforms™ (OVP™) Fast Processor Model for the Renesas RL78 CPU. Example virtual platforms have also been released, as well as support for the new model in the Imperas M*SDK™ advanced software development tools. The model of the RL78 was developed by eSOL TRINITY, Imperas’ partner in Japan, providing technical support for Imperas customers as well as services for embedded software development.

Cadence Delivers Rapid Adoption Kits Based on a 10nm Reference Flow for New ARM Cortex-A73 CPU and ARM Mali-G71 GPU

May 31, 2016

Highlights:

• Cadence RAKs are based on the latest innovative digital implementation and signoff technologies optimized to work with the performance-leading ARM® Artisan® physical IP and ARM POP™ IP for ARM Cortex®-A73 and ARM Mali™-G71, enabling designers to meet challenging PPA goals
• ARM used Cadence digital and signoff tools to design the ARM Cortex-A73 CPU and the ARM Mali-G71 GPU, resulting in a reference flow from which the RAKs are derived
• Collaboration enables designers to achieve overall PPA goals and accelerated time to market with Cadence digital, … Read More → "Cadence Delivers Rapid Adoption Kits Based on a 10nm Reference Flow for New ARM Cortex-A73 CPU and ARM Mali-G71 GPU"

Semtech Supports Microchip in Delivering Industry’s First All-in-One Evaluation Kit Based on LoRa™ Technology

May 31, 2016

CAMARILLO, Calif., May 31, 2016 – Semtech Corporation (Nasdaq: SMTC), a leading supplier of analog and mixed-signal semiconductors, today announced that Microchip Technology Inc. (Nasdaq: MCHP) has released an all-in-one LoRa™ technology evaluation kit that includes the required components to create a low-power wide-area network (LPWAN) for either Europe or North America.

The evaluation kit gives Internet of … Read More → "Semtech Supports Microchip in Delivering Industry’s First All-in-One Evaluation Kit Based on LoRa™ Technology"

Zuken Introduces Perfect Springback Routing in CADSTAR 17

May 31, 2016

31 May 2016 – Munich, Germany and Westford, MA, USA – Zuken announces industry-leading routing enhancements in the latest version of its Read More → "Zuken Introduces Perfect Springback Routing in CADSTAR 17"

sureCore 40nm Ultra-Low Voltage SRAM Proves World Beating Low Voltage Operation in Silicon

May 31, 2016

Sheffield, England – May 31, 2016 – sureCore Ltd., the Low Power SRAM IP leader, today revealed that its latest Ultra-Low Voltage SRAM IP effectively operates at a record-setting 0.6V across process, voltage and temperature. The results are silicon-proven on TSMC’s 40nm Ultra Low Power CMOS process technology.

sureCore’s newest IP delivers an impressive operating voltage range from 0.6V to 1.21V. It provides an unprecedented 20MHz cycle time at 0.6V scaling to over 300MHz at 1.21V. This performance opens new capabilities for cutting edge wearable and Internet of Things applications.

Test chip results revealed an up to 80% … Read More → "sureCore 40nm Ultra-Low Voltage SRAM Proves World Beating Low Voltage Operation in Silicon"

Eliminate the Need for Battery Characterization and Speed Time to Market with ModelGauge™ m5

May 31, 2016

San Jose, CA—May 31, 2016—Implementing pack-side battery gauges in portable devices is now easier and more secure with the ModelGauge™ m5 portfolio of MAX17201/MAX17205 and MAX17211/MAX17215 from Maxim Integrated Products, Inc. (NASDAQ: MXIM).

Tektronix Expands Serial Standards Testing on DPO70000SX Oscilloscopes

May 27, 2016

BEAVERTON, Ore. May 24, 2016 – Tektronix, a leading worldwide provider of measurement solutions, is bringing support for serial bus standards testing to the new DPO70000SX family of ultra-high performance oscilloscopes. Featuring patented Asynchronous Time Interleaving (ATI) signal acquisition technology, the DPO70000SX platform offers industry-best signal fidelity and performance coupled with a scalable architecture that offers “room to grow” as signal speeds continue to increase.

As engineering teams prepare for next generation standards in the rapidly growing … Read More → "Tektronix Expands Serial Standards Testing on DPO70000SX Oscilloscopes"

Imec and Holst Centre Present Multi-Standard Low-Power Wide-Area Radio Chip

May 27, 2016

Leuven (Belgium) – May 24, 2016 – The world-leading nanoelectronics research centers imec and Holst Centre (set up by imec and TNO), presented a low-power wide-area (LPWA) multi-standard radio chip today at imec’s annual technology forum in Brussels (ITF Brussels 2016). The new radio chip is a best-in-class product, which can operate with a lower level of power consumption than any other radio chip technology released to date for long range connectivity in sensor networks. The sub-GHz radio chip’s technology can serve a multitude of protocols including IEEE 802.15.4g/k, W-MBUS, KNX-RF, as well as the popular LoRa and SIGFOX networks, … Read More → "Imec and Holst Centre Present Multi-Standard Low-Power Wide-Area Radio Chip"

MicroEJ Presentation at Embedded TechCon: Software Virtualization Lessons for Extreme IoT Portability and Scale

May 27, 2016

Nantes, France, May 25, 2016 – IoT developers must cope with even more constraints than embedded developers (e.g., small footprints, low power considerations, faster prototyping to meet shorter time-to-market windows, connectivity to cloud platforms) and yet still produce top-quality, scalable, portable IoT software. The comprehensive IoT solution portfolio from MicroEJ® – MicroEJ Application Store, MicroEJ Studio, MicroEJ SDK, and MicroEJ OS – meets these challenges by enabling application-driven uses and business models on low-cost, resource-constrained embedded and IoT devices.

From 3:00-3:55pm on Wednesday, June 8th, Vincent Perrier, Chief Product Officer of MicroEJ, will give a presentation on an approach to … Read More → "MicroEJ Presentation at Embedded TechCon: Software Virtualization Lessons for Extreme IoT Portability and Scale"

4DSP’s New FMC120 Advances Embedded MIMO Technology in the FMC form factor

May 27, 2016

May 26, 2016 — AUSTIN, TX, USA – 4DSP announced the release of a new FPGA Mezzanine Card (FMC – VITA 57.1) for applications that require high sampling rates, density, and dynamic range analog I/O in their Digital Signal Processing systems. The all new FMC120 provides four simultaneous 16-bit A/D channels up to 1Gsps and four simultaneous 16-bit D/A channels up to 1.25Gsps. The FMC120 design is based on Texas Instruments’ ADS54J60 Analog-to-Digital converter and Texas Instruments’ DAC39J84 Digital-to-Analog converter. The FMC120 is designed to be used in convection and conduction cooled environments. When paired with the latest … Read More → "4DSP’s New FMC120 Advances Embedded MIMO Technology in the FMC form factor"