News – Page 1329 – EEJournal

Bluetooth Smart mesh network lighting platform claims to be 5x faster than competing solutions by combining Bluetooth Smart and proprietary 2.4GHz

January 29, 2015

Developed by Finnish lighting specialist, Casambi, this award-winning third-party platform based on the dual-protocol Nordic nRF51822 SoC is designed to bring smart lighting to mainstream consumers by making it easy to install, simple to use, and affordable, and can be integrated directly into LED smart bulbs and drivers, as well as lighting fixtures.

Oslo, Norway – January 29, 2015 – Ultra low power (ULP) RF specialist Nordic Semiconductor ASA (OSE: NOD) today announces that Finnish smart lighting specialist, Casambi Technologies Oy, is employing the Nordic nRF51822 System-on-Chip (SoCs) to provide the Bluetooth® Smart (formerly known as Bluetooth … Read More → "Bluetooth Smart mesh network lighting platform claims to be 5x faster than competing solutions by combining Bluetooth Smart and proprietary 2.4GHz"

New Artesyn Embedded Technologies Compact ATCA System Platform Offers Highest Power and Cooling Performance

January 28, 2015

Artesyn Embedded Technologies today announced the Centellis^® 2100, a two-slot 40G AdvancedTCA^® (ATCA^®) system platform designed to support the latest high performance payload blades. With power and cooling support for up to 400 W per slot and up to 500 W in a single slot configuration, the new Centellis 2100 enables systems integrators to increase performance and I/O bandwidth per slot, while preparing for future performance upgrades that will have increasing power and cooling requirements.

The Centellis 2100 ATCA system … Read More → "New Artesyn Embedded Technologies Compact ATCA System Platform Offers Highest Power and Cooling Performance"

PAM4 Analysis, USB 3.1 Compliance, DDR Debug, PCI Express Link Equalization, and 100 GHz Oscilloscope Capabilities Showcased at DesignCon 2015

January 28, 2015

Chestnut Ridge, NY and Santa Clara, CA, January 28, 2015 – Teledyne LeCroy, a longtime Diamond Sponsor of DesignCon, will once again be showcasing the latest innovations in test technology on the exhibition floor in Santa Clara, January 28-29. Product exhibits include the world’s first 100 GHz bandwidth real-time oscilloscope; the first 12-bit, 8-channel high definition oscilloscope; and the only receiver/transmitter test instrument capable of PCIe link equalization testing. These pioneering technologies are the building blocks of unique test and analysis tools such as PAM4 Analysis, USB 3.1 Compliance, DDR Debug, and PCI … Read More → "PAM4 Analysis, USB 3.1 Compliance, DDR Debug, PCI Express Link Equalization, and 100 GHz Oscilloscope Capabilities Showcased at DesignCon 2015"

4DSP’s Sensuron Unit Announces Revolutionary 3D Shape Sensing for Medical Applications

January 28, 2015

AUSTIN, TX – 4DSP announces the release of groundbreaking 3D shape sensing technology that will change the landscape for medical instrumentation developers and physicians. Through its new Sensuron unit, 4DSP is the leading global … Read More → "4DSP’s Sensuron Unit Announces Revolutionary 3D Shape Sensing for Medical Applications"

Altera Showcases Its Industry-leading SoC Solutions at Embedded World

January 28, 2015

Nurnberg, Germany, Embedded World 2015, January 28, 2015 — Altera Corporation (Nasdaq: ALTR) will showcase how it is further extending its leadership position in SoC solutions at Embedded World 2015. Demonstrations show how Altera’s industry-leading SoCs are enabling advanced embedded systems featured in automotive and industrial applications. Today, Altera offers the most comprehensive portfolio of SoC FPGAs based on a world-class architecture. At Embedded World 2015, Altera will display its second generation SoC family, Arria 10 SoCs, the only 20nm SoC FPGA family, which provide embedded developers access to a high-performance applications-class … Read More → "Altera Showcases Its Industry-leading SoC Solutions at Embedded World"

Altium and Valydate Announce Strategic Partnership with New Design Analysis and Verification Technology

January 28, 2015

San Diego, CA – January 28, 2015 – Altium Limited <http://www.altium.com> , a global leader in Electronic Design Automation and Valydate Inc. <http://www.valydate.com/> , the leader in Schematic, Signal and Power Integrity analysis, today announced a strategic partnership aimed at easing the time-consuming visual inspection and debugging process of electronic schematics with ValydateVERA, a powerful design analysis and verification tool, which will integrate seamlessly with Altium Designer. This new technology will be unveiled … Read More → "Altium and Valydate Announce Strategic Partnership with New Design Analysis and Verification Technology"

Espressif Systems Internet of Things WiFi Chips Employ Cadence Tensilica Xtensa Low-Power Processor for Control and DSP

January 28, 2015

SAN JOSE, Calif., January 28, 2015 ? Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that Espressif Systems has utilized the Cadence® Tensilica® Xtensa® processor in its ESP8089 and ESP8266 WiFi chips that are optimized for Internet of Things (IoT) applications. The Xtensa processor, customized by Espressif to achieve the best power, performance and area results, is used both as a digital signal processor and control processor with a real-time operating system (RTOS) that runs Espressif’s WiFi and TCP/IP stacks and other application software.

For more information on the Xtensa processor, visit www.cadence.com/xtensa/espressif.

< … Read More →

HUBER+SUHNER Unveils High Speed 50 GHz/50 Gbps Digital Testing Solution at DesignCon Santa Clara

January 27, 2015

Global connectivity supplier HUBER+SUHNER will today unveil its new high speed digital testing solutions at DesignCon 2015. The company has chosen the Santa Clara event for the global launch of its MPX50 precision multicoax connector solution which combines the highest density, lowest loss and highest performance characteristics for cutting edge data rate testing in one testing solution.

Also on show for the first time at the company’s DesignCon booth #949 will be the SUCOFLEX 229 loss revolution for dynamic applications and the HUBER+SUHNER high signal fidelity testing solution, Minibend L/MMPX.

The products are part … Read More → "HUBER+SUHNER Unveils High Speed 50 GHz/50 Gbps Digital Testing Solution at DesignCon Santa Clara"

ANSYS Unveils Release 16.0

January 27, 2015

PITTSBURGH, Jan. 27, 2015 – From simulating the interactions between software and hardware that fuel the Internet of Things to better understanding the full spectrum of advanced structural materials, the newly released ANSYS® (NASDAQ: ANSS) 16.0 offers advanced functionality enabling engineers to rapidly innovate new products.

ANSYS 16.0 includes a variety of new functionality – including capabilities to verify electronics reliability and performance throughout the design process and complex electronics industry supply chains, which in turn helps to facilitate the Internet of Things

ANSYS 16.0 delivers major advancements across the company’s entire portfolio, including structures, fluids, electronics and systems engineering solutions – … Read More → "ANSYS Unveils Release 16.0"

Cadence Expands Sigrity 2015 Technology Portfolio with New Products, a Key Feature Update and Flexible Licensing Options

January 27, 2015

New Sigrity Parallel Computing 4-pack enables efficient product creation with 3X speedup in signoff-accurate PCB extraction
? Updated power-aware system signal integrity (SI) feature now supports LPDDR4 analysis with full JEDEC compliance checking
? Flexible licensing options available for small analysis teams with big analysis requirements

SAN JOSE, Calif., January 27, 2015?Cadence Design Systems, Inc. (NASDAQ: CDNS), today announced an expanded Cadence® Sigrity? technology portfolio with the Sigrity Parallel Computing 4-pack and the Sigrity … Read More → "Cadence Expands Sigrity 2015 Technology Portfolio with New Products, a Key Feature Update and Flexible Licensing Options"

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