Toshiba Starts World’s First Sample Shipment of 64-Layer 3D Flash Memory
TOKYO — Toshiba Corporation (TOKYO: 6502) today unveiled the latest generation of its BiCS FLASH™ three-dimensional (3D) flash memory with a stacked cell structure*1, a 64-layer device that will be first*2 in the world to start sample shipments today. The new device incorporates 3-bit-per-cell (triple-level cell, TLC) technology … Read More → "Toshiba Starts World’s First Sample Shipment of 64-Layer 3D Flash Memory"

