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Leti Says New FDSOI Light-Sensing Technique Can Make Transistors Far More Sensitive to Visible Light

December 9, 2016

SAN FRANCISCO – Dec. 7, 2016 – Leti, an institute of CEA Tech, has developed a new light-sensing device that integrates photodiodes below the buried oxide (BOX) of FDSOI transistors, making the transistors very sensitive to visible light.

In this work, photodiodes were co-integrated in the SOI substrate, replacing conventional FDSOI transistor backgate. This device architecture may lead not only to very small pixels with maximized fill factor, but also to more complex light-detection functions, due to complementary effects observed depending on diode polarity and FET type.

Presented today during IEDM 2016 in the paper, “Extending … Read More → "Leti Says New FDSOI Light-Sensing Technique Can Make Transistors Far More Sensitive to Visible Light"

ams’ new High Performance Analog technology A30 offers superior noise performance

December 8, 2016

Premstaetten, Austria (6 December, 2016) — ams AG (SIX: AMS), a leading provider of high performance sensors and analog ICs, today announced the availability of its High Performance Analog Low Noise CMOS process (“A30”). The new A30 process provides superior noise performance and is realized as an optical shrink by a factor of 0.9 from ams’ advanced 0.35µm High-Voltage CMOS process family.

The A30 technology features performance optimized, isolated 3.3V devices (NMOSI and PMOSI), isolated 3.3V low Vt devices (NMOSIL and PMOSIL), an isolated high voltage device with thin gate oxide (NMOSI20T), vertical bipolar transistors (VERTN1 and VERTPH) as well … Read More → "ams’ new High Performance Analog technology A30 offers superior noise performance"

efabless Unveils Online Community to Reimagine Chip Design

December 8, 2016

SAN JOSE, CALIF.–– November 29, 2016 ––efabless corporation, an open-innovation, hardware creation platform, today became the first online marketplace for community-developed, customized intellectual property (IP) and integrated circuits (ICs), allowing hardware system innovators to turn ideas into marketable products.

Initially focused on analog and mixed-signal design for customized ICs, efabless addresses all of the steps required to cost effectively take an electronics specification to prototype. Its growing community of approximately 700 members in 30 countries can make full use of an online … Read More → "efabless Unveils Online Community to Reimagine Chip Design"

Synopsys Announces Industry’s First DisplayPort 1.4 with DSC 1.2 Verification IP and Test Suites

December 8, 2016

MOUNTAIN VIEW, Calif., Dec. 8, 2016 /PRNewswire/ — Synopsys, Inc. (Nasdaq: SNPS) today announced the availability of the industry’s first Verification IP (VIP) and source code test suite for DisplayPort 1.4 with DSC 1.2 and for eDP 1.4a/b. With the increase in consumer demand for enhanced display resolution quality, Synopsys VC VIP for DisplayPort enables system-on-chip (SoC) teams to design these next-generation displays with ease of use and integration, resulting in accelerated verification closure. 

“The new DisplayPort 1.4 standard takes advantage of VESA’s Display Stream Compression technology to support new … Read More → "Synopsys Announces Industry’s First DisplayPort 1.4 with DSC 1.2 Verification IP and Test Suites"

congatec’s new COM Express Mini module with Intel Apollo Lake processors

December 8, 2016

San Diego, CA, December 08, 2016 * * * congatec – a leading technology company for embedded computer modules, single board computers and embedded design and manufacturing services – has released the conga-MA5, the next generation of low-power modules for the industrial and extended temperature range in the credit card sized COM Express Mini form factor. The new COM Express Type 10 Computer-on-Modules are equipped with the latest Intel® Atom™, Celeron® and Pentium® processors (code name Apollo Lake) and impress with 30% more processing power and 45% more graphics performance on a very small COM Express Mini module. 

Target applications can be found wherever a small footprint … Read More → "congatec’s new COM Express Mini module with Intel Apollo Lake processors"

Barr Group Announces Spring 2017 Embedded Systems Training Calendar

December 8, 2016

GERMANTOWN, Maryland – Dec. 8, 2016 – Barr Group has officially announced their Spring 2017 public training calendar for embedded systems engineers and managers. During this season, Barr Group will be offering three “Boot Camp” courses on embedded software, embedded Android, and embedded security. These comprehensive four-day courses are designed to immerse attendees in valuable aspects of embedded systems software development and improve students’ abilities in creating safe and secure embedded devices.

Barr Group also will be offering two expanded courses, “TDD & Agile: Power Techniques for Better Embedded Software Development” … Read More → "Barr Group Announces Spring 2017 Embedded Systems Training Calendar"

CEL Launches New Laser Diodes for 100G CWDM4 Data Center Applications

December 7, 2016

Santa Clara, December 7, 2016 – CEL introduces the availability of Renesas Electronics Corporation’s new series of semiconductor Laser Diodes, the “NX6375AA Series” into North America. The newly developed direct modulation distributed feedback Laser Diodes support 25 Gbps × four wavelengths operation as the light sources in 100 Gbps optical transceivers that are used for communication between servers and routers installed in data centers.

The NX6375AA Series enables system developers to develop highly reliable high-speed optical transceivers and optical modules that can be implemented in the servers and routers used in data centers. The NX6375AA Series is now available … Read More → "CEL Launches New Laser Diodes for 100G CWDM4 Data Center Applications"

Imec demonstrates record tunneling magnetoresistance for one of the world’s smallest perpendicular magnetic tunnel junctions

December 7, 2016

SAN FRANCISCO – International Electron Devices Meeting 2016 (IEDM) —Dec. 6, 2016— At the 2016 IEEE International Electron Devices Meeting, in a special poster session on MRAM, world-leading research and innovation hub for nano-electronics and digital technology imec presented a 8nm p-MTJ device with 100 percent tunnel magnetoresistance (TMR) and coercive field as high 1500Oe. This world’s smallest device enables the establishment of a manufacturing process for high-density spin-transfer-torque magnetic random access memory (STT-MRAM) arrays that meet the requirements of the 10nm and beyond logic node for embedded non-volatile memory applications. It also paves the way for high density stand-alone applications.

< … Read More → "Imec demonstrates record tunneling magnetoresistance for one of the world’s smallest perpendicular magnetic tunnel junctions"

Synopsys Releases Version 2016.12 of the RSoft Photonic System Design Suite

December 7, 2016

MOUNTAIN VIEW, Calif., Dec. 7, 2016 /PRNewswire/ —

Highlights:

  • Adds Gaussian noise model for faster long-haul optical fiber simulation
  • Supports AIM Photonics Process Design Kit for photonic integrated circuit design
  • Provides native 64-bit support for faster MATLAB co-simulations

Synopsys, Inc. (Nasdaq: SNPS) today announced the latest release of its RSoft™ Photonic System Design Suite, the company’s industry-leading software for the design of optical communication systems and photonic integrated circuits (PICs) at the signal … Read More → "Synopsys Releases Version 2016.12 of the RSoft Photonic System Design Suite"

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