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Infineon 2025 predictions – Gallium Nitride (GaN) semiconductors: GaN to reach adoption tipping points in multiple industries, further driving energy efficiency

February 4, 2025

Munich, Germany – 30 January 2025 – As the world continues to face the challenges of climate change and environmental sustainability, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is at the forefront of innovation, harnessing the power of all relevant semiconductor materials including silicon (Si), silicon carbide (SiC), and gallium nitride (GaN) to drive meaningful progress towards decarbonization and digitalization.

In its 2025 predictions – GaN power semiconductors, Infineon highlights that gallium nitride will … Read More → "Infineon 2025 predictions – Gallium Nitride (GaN) semiconductors: GaN to reach adoption tipping points in multiple industries, further driving energy efficiency"

FORVIA HELLA selects Infineon’s new CoolSiC™ Automotive MOSFET 1200 V for its next generation of charging solutions

February 4, 2025

Munich, Germany – 29 January 2025 – FORVIA HELLA, an international automotive supplier, has selected the new CoolSiC™ Automotive MOSFET 1200 V from Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) for its next generation 800 V DCDC charging solution. Designed for on-board charger and DCDC applications in 800 V automotive architectures, Infineon’s CoolSiC MOSFET comes in a Q-DPAK package. The device uses top-side cooling (TSC) technology, which enables excellent thermal performance, easier assembly and lower system costs.

“We are excited to continue our partnership with FORVIA HELLA, leveraging our high-efficiency SiC products based on TSC packages,” … Read More → "FORVIA HELLA selects Infineon’s new CoolSiC™ Automotive MOSFET 1200 V for its next generation of charging solutions"

Digital Twin Consortium Launches Digital Twin Testbed Initiative

Innovative member-driven program for evolving next-generation digital twins and enabling technologies
February 4, 2025

BOSTON, MA – JANUARY 30, 2025  –  Today, the Digital Twin Consortium® (DTC) announced its transformative Digital Twin Testbed initiative, an opportunity for members to showcase innovation in digital twin evolution. The initiative is a collaborative, holistic approach DTC members can use to develop, test, verify, and validate digital twin systems and advance digital-twin-enabling technologies.

“The DTC Digital Twin Testbed initiative opens new horizons for our members, allowing them to demonstrate how they’re pushing the boundaries of digital twins and enabling technologies,” said Dan … Read More → "Digital Twin Consortium Launches Digital Twin Testbed Initiative"

Infineon’s 512 Mbit QSPI NOR Flash for satellite applications is now qualified according to DLAM QML-V and QML-P

February 3, 2025

Munich, Germany – 30 January 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) announced that its radiation-hardened 512 Mbit QSPI NOR Flash memory for space and extreme environment applications has now received the QML-V and QML-P qualification of the Defense Logistics Agency Land and Maritime (DLAM). The QML certification is the highest reliability standard for microcircuits awarded by the U.S. government and indicates that the device will perform reliably under the most challenging conditions. This makes the memory device the first and only QML-qualified radiation-hardened NOR flash memory for the space industry. The flash memory … Read More → "Infineon’s 512 Mbit QSPI NOR Flash for satellite applications is now qualified according to DLAM QML-V and QML-P"

Silicon Labs’ BG22L and BG24L “Lite” SoCs Bring Application-Optimized Ultra-Low Power Bluetooth® Connectivity

New BG22L delivers robust security and processing for common Bluetooth devices, while BG24L supports advanced AI/ML acceleration and Channel Sounding
February 3, 2025

AUSTIN, Texas, Jan. 30, 2025 /PRNewswire/ — Silicon Labs (NASDAQ: SLAB), a leader in secure, intelligent wireless technology for a more connected world, introduced the BG22L and Read More → "Silicon Labs’ BG22L and BG24L “Lite” SoCs Bring Application-Optimized Ultra-Low Power Bluetooth® Connectivity"

Saelig Introduces Sensepeek SQG Passive 6GHz Probe Series

For troubleshooting high-speed digital designs, Sensepeek’s range of AC and DC-coupled probes offers the versatility and precision that HF electronics engineers demand
February 3, 2025

Fairport, NY, USA: Saelig Company, Inc. has introduced the Sensepeek SQG-series of passive high-frequency hands-free oscilloscope probes, designed for both AC and DC GHz applications. When used with Sensepeek baseplates or handheld, this groundbreaking series enables engineers to perform measurements up to 6GHz economically and without the need to solder connections to the test PCB.

Maintaining measurement signal integrity is crucial, and the SQG-series has exceptionally low probe-tip capacitance, which minimizes loading and signal distortion for sensitive circuits. Measuring high data rate signals is now economical and precise with these passive probes that … Read More → "Saelig Introduces Sensepeek SQG Passive 6GHz Probe Series"

Shaping Future of Displays: Clay/Europium-Based Technology Offers Dual-Mode Versatility

Researchers unveil a groundbreaking device that integrates light emission and color control using clay compounds, promising a multifunctional display solution
February 3, 2025
Electrochemical reaction-based stimuli-responsive materials are shaping up the era of innovative display devices. By embedding luminescent europium(III) complexes and color-changing viologen derivatives in a layered clay matrix, the device achieves simultaneous control of light emission and color at low voltage. The use of clay-based materials also highlights an eco-friendly approach to enhancing electronic device performance. This innovation could revolutionize display technology and the development of sensors, adaptable to changing light conditions.

SLAC will play a key role in DOE’s new research centers for advancing next-generation microelectronics

Funded by the Department of Energy, these centers are part of an effort that brings together national laboratories, universities and industry to invent and accelerate novel microelectronics technologies to operate efficiently or in extreme environments.
January 30, 2025

TeraSignal Demonstrates Interoperability with Synopsys 112G Ethernet PHY IP for High-Speed Linear Optics Connectivity

Enabling Plug-and-Play Solutions for High-Performance AI and Data Center Applications
January 30, 2025

 IRVINE, Calif., January 27, 2025– DesignCon 2025 – TeraSignal, a leader in intelligent interconnect technology, announced the successful interoperability demonstration between its TSLink intelligent chip-to-module (C2M) interconnect and Synopsys’ 112G Ethernet PHY IP at DesignCon 2025. This demonstration … Read More → "TeraSignal Demonstrates Interoperability with Synopsys 112G Ethernet PHY IP for High-Speed Linear Optics Connectivity"

FORVIA HELLA selects Infineon’s new CoolSiC™ Automotive MOSFET 1200 V for its next generation of charging solutions

January 30, 2025

Munich, Germany – 29 January 2025 – FORVIA HELLA, an international automotive supplier, has selected the new CoolSiC™ Automotive MOSFET 1200 V from Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) for its next generation 800 V DCDC charging solution. Designed for on-board charger and DCDC applications in 800 V automotive architectures, Infineon’s CoolSiC MOSFET comes in a Q-DPAK package. The device uses top-side cooling (TSC) technology, which enables excellent thermal performance, easier assembly and lower system costs.

“We are excited to continue our partnership with FORVIA HELLA, leveraging our high-efficiency SiC products based on TSC packages,” … Read More → "FORVIA HELLA selects Infineon’s new CoolSiC™ Automotive MOSFET 1200 V for its next generation of charging solutions"

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