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VadaTech launches a dual-channel IF signal conditioning unit

Henderson, NV – February 21, 2016 – VadaTech, a leading manufacturer of integrated systems, embedded boards, enabling software and application-ready platforms, announces the AMC902, a dual-channel IF signal conditioning unit providing programmable gain/attenuation.  The module allows analog signal conditioning to be integrated into MicroTCA sub-systems for radar, SIGINT and … Read More → "VadaTech launches a dual-channel IF signal conditioning unit"

CEVA Introduces the World’s Most Advanced Communication DSP, Providing Cutting-Edge Performance for Multi-Gigabit Class Connectivity

  • CEVA-XC12 is the industry’s first DSP capable of meeting the extreme performance requirements critical to the success of 5G, gigabit LTE, MU-MIMO Wi-Fi and other multi-gigabit modems
  • Revolutionary processor architecture delivers up to 8x performance improvement and consumes 50% less power than previous generation

MOUNTAIN VIEW, Calif., – February 23, 2017 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing IP for smarter, connected devices, today introduced the world’s most advanced communication DSP to meet the extreme performance requirements of multi-gigabit class modems. Capitalizing … Read More → "CEVA Introduces the World’s Most Advanced Communication DSP, Providing Cutting-Edge Performance for Multi-Gigabit Class Connectivity"

STMicroelectronics Works with Sigfox to Extend Plug-and-Play IoT Security to Industrial and Consumer Device Makers

GENEVA, February 23, 2017 — STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, announced the expansion of its STSAFE family of secure elements with the introduction of a powerful plug-and-play solution that provides state-of-the-art security features to devices connected to the Sigfox low-power wide-area network (LPWAN).

The new Read More → "STMicroelectronics Works with Sigfox to Extend Plug-and-Play IoT Security to Industrial and Consumer Device Makers"

New Bidirectional Power-Switching Solution is One of the Industry’s Smallest

HARRISBURG, Pa. – February 23, 2017 – TE Connectivity (TE), a world leader in connectivity and sensors, has released an additional size for the KILOVAC current-sensing [KCS] high-voltage contactors. The KILOVAC KCS01 contactor is a compact power-switching solution with an integrated current sensor and current trip function. These contactors are suited for applications in harsh military and commercial electric vehicles, power distribution, energy storage and battery storage systems.

For over 35 years, KILOVAC products have been used to deliver high-voltage switching capabilities demanded by aerospace and defense applications. KILOVAC contactors are highly specialized for use in critical applications with high current systems. … Read More → "New Bidirectional Power-Switching Solution is One of the Industry’s Smallest"

Waves Nx VR Audio Technology Now Available for Cadence Tensilica HiFi Audio DSPs

SAN JOSE, Calif. and KNOXVILLE, Tenn., 23 Feb 2017

Cadence Design Systems, Inc. (NASDAQ: CDNS) and Waves Audio Ltd., the world-leading developer of audio DSP technologies, today announced the availability of the Waves Nx Virtual Reality Audio Technology on the Cadence®Tensilica® HiFi 3 DSP for Audio, Voice, and Speech. The Waves Nx solution, which delivers high-quality VR audio and true 5.1 or 7.1 surround with a minimal resource footprint, will be demonstrated at the Cadence booth at Mobile World Congress in Barcelona, February 27 to March 2, 2017, in … Read More → "Waves Nx VR Audio Technology Now Available for Cadence Tensilica HiFi Audio DSPs"

Renesas Electronics Europe: Third European MCU Car Rally Competition Showcases Student Creativity with State-of-the-Art Renesas Solutions at Embedded World 2017

Dusseldorf, February 23, 2017 – Renesas Electronics Europe, a premier provider of advanced semiconductor solutions, today announced that the third MCU Car Rally competition will take place at the occasion of the embedded world Student Day on March 16, 2017</ … Read More → "Renesas Electronics Europe: Third European MCU Car Rally Competition Showcases Student Creativity with State-of-the-Art Renesas Solutions at Embedded World 2017"

Tiny fibers open new windows into the brain

CAMBRIDGE, Mass. — For the first time ever, a single flexible fiber no bigger than a human hair has successfully delivered a combination of optical, electrical, and chemical signals back and forth into the brain, putting into practice an idea first proposed two years ago. With some tweaking to further improve its biocompatibility, the new approach could provide a dramatically improved way to learn about the functions and interconnections of different brain regions.

The new fibers were developed through a collaboration among material scientists, chemists, biologists, and other specialists. The results are reported in the journal Nature … Read More → "Tiny fibers open new windows into the brain"

Ultrahaptics collaborates with HARMAN to integrate mid-air haptic sensations into connected cars

Bristol, UK – 21st February 2017. Mid-air touch-free haptics company, Ultrahaptics, has announced a collaboration with HARMAN International Industries, Incorporated (NYSE: HAR), the premier connected technologies company for automotive, consumer and enterprise markets, to incorporate mid-air gesture haptic feedback technology into a range of infotainment and audio systems.

Ultrahaptics has developed a technology that uses ultrasound to project physical sensations onto the user’s bare hands. Without the need to wear gloves or hold special equipment, users can receive haptic feedback for gestures they perform in mid-air. This type of user-friendly gesture control can be used … Read More → "Ultrahaptics collaborates with HARMAN to integrate mid-air haptic sensations into connected cars"

Lattice Semiconductor Expands CrossLink Programmable ASSP (pASSP) IP Solutions

  • Expands use cases to foster development of innovative new video bridging applications using the latest generation processors, displays and sensors
  • Design flexibility, unique programmability and high performance of CrossLink make it ideal for broad markets including consumer, industrial and automotive
  • Designs based on CrossLink IP use up to 40% less logic than previous versions with reduced power consumption while enabling more functionality

PORTLAND, OR – February 21, 2017 – Read More → "Lattice Semiconductor Expands CrossLink Programmable ASSP (pASSP) IP Solutions"

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