News – Page 1256 – EEJournal

Flex Logix Works with DARPA to Develop Flex Logix’s Embedded FPGA IP for Government Projects

January 23, 2017

MOUNTAIN VIEW, Calif., Date January 23, 2017 – DARPA, the Defense Advanced Research Projects Agency, announced today that it has signed an agreement to work with Flex Logix to develop Flex Logix’s EFLX embedded FPGA technology for use by any company or government agency designing integrated circuits for the US Government. As part of the agreement, Flex Logix will make available EFLX arrays in the TSMC 16FFC process node from 2.5K to 122.5K LUTs so that these companies and agencies can reconfigure RTL at any point during the design process. Having this flexibility will enable chip designers to increase performance, reduce … Read More → "Flex Logix Works with DARPA to Develop Flex Logix’s Embedded FPGA IP for Government Projects"

New Rugged Small Form Factor Embedded Computer from DFI Tech

January 23, 2017

Sacramento, CA — Jan 19, 2017 – DFI Tech, a provider of embedded computing solutions and board products, offers a new Small Form Factor (SFF) rugged system to satisfy mission-critical and cost-efficiency needs.

The EC500 from DFI Tech features a 6^th/4^th generation Intel® Core™ i7/i5/i3 processor. The conduction-cooled system supports dual 8GB DDR3 memory, a 2.5” SATA drive bay with SATA III capability, and 1 mSATA module via the Mini PCIe socket. The unit also facilitates rich graphics capability with 24-bit color depth up to 1920×1200 resolution and comes with Intel HD Graphics.

The rugged … Read More → "New Rugged Small Form Factor Embedded Computer from DFI Tech"

Pentek Announces 8-Channel A/D Jade XMC Module for Defense and Radar Phased-Array Applications

January 23, 2017

Eight-channel, 250 MHz, 16-bit A/D XMC module with programmable multiband Digital Down Converters
Jade Architecture with Xilinx Kintex Ultrascale FPGA offers price, power and processing performance advantages
Navigator Design Suite compatible with Xilinx’s Plug-and-Play Vivado IP Integrator expedites development

UPPER SADDLE RIVER, NJ?January 23, 2017, Embedded Tech Trends Forum?Pentek, Inc., today introduced the newest member of the Jade™ family of high-performance data converter XMC modules based on the Xilinx Kintex Ultrascale FPGA. The Model 71131 is an eight-channel, 250 … Read More → "Pentek Announces 8-Channel A/D Jade XMC Module for Defense and Radar Phased-Array Applications"

Circuit Check and ASSET InterTech collaborate on boundary-scan test solutions

January 19, 2017

News Highlights

Combined products allow the capability to support printed circuit board assembly or product-level test and programming.
CCI’s unique quick-change fixture drop-in technologies allow for station modularity and scalability.
Joint tool flow simplifies all aspects of test from design verification to production thru repair, delivering more detailed diagnostics during a high-level test.

Minneapolis, Minnesota, January 17, 2017 – Circuit Check Inc., a global leader in test, automation and interfacing solutions for electronics and electro-mechanical device manufacturers, … Read More → "Circuit Check and ASSET InterTech collaborate on boundary-scan test solutions"

Imec and EVG demonstrate for the first time 1.8µm pitch overlay accuracy for wafer bonding

January 19, 2017

Leuven (Belgium)—Jan. 19, 2017— At the 2017 European 3D Summit in Grenoble (France, Jan 23-25), the world-leading research and innovation hub for nano-electronics and digital technology imec and the leading supplier of wafer-bonding equipment EV Group (EVG) announce an extension to their successful collaboration, achieving excellent wafer-to-wafer overlay accuracy results in both hybrid bonding and dielectric bonding. Expanding this collaboration, EVG will become a partner in imec’s 3D integration program through a joint development agreement … Read More → "Imec and EVG demonstrate for the first time 1.8µm pitch overlay accuracy for wafer bonding"

Synopsys Releases New Version of Coverity Static Analysis Tool with Enhanced Security for Mobile and Web Applications

January 19, 2017

Highlights:

Enhances Android security analysis to detect critical vulnerabilities and weaknesses on the OWASP Top 10
Improves security analysis and accuracy for JavaScript, Java and C# web applications
Expands desktop analysis with Integrated Development Environment (IDE) plugins for mobile and web application security testing

Synopsys, Inc. (Nasdaq: SNPS) today announced a new 8.7 version of its Read More → "Synopsys Releases New Version of Coverity Static Analysis Tool with Enhanced Security for Mobile and Web Applications"

Texas Instruments expands Bluetooth® low energy portfolio with more available memory, Bluetooth 5 compatibility and automotive qualification

January 19, 2017

DALLAS (Jan.18, 2017) – Delivering more available memory, Bluetooth® 5-ready hardware, automotive qualification and a new ultra-small wafer-chip-scale package (WCSP) option, Texas Instruments (TI) (NASDAQ: TXN) today announced two new devices in its scalable SimpleLink™ Bluetooth low energy wireless microcontroller (MCU) family. The new devices continue to feature advanced integration including a complete single-chip hardware and unified software solution with an ARM® Cortex®-M3 based MCU, automatic power management, highly flexible full-featured Bluetooth-compliant radio and a low-power sensor controller. For more information, visit Read More → "Texas Instruments expands Bluetooth® low energy portfolio with more available memory, Bluetooth 5 compatibility and automotive qualification"

Latest best in class testing solutions to be showcased at DesignCon 2017 by HUBER+SUHNER

January 18, 2017

Herisau, 18 January 2017 – HUBER+SUHNER, leading manufacturer of components and systems for optical and electrical connectivity products, is set to unveil its best in class solutions for bench-top and system testing at this year’s DesignCon exhibition in Santa Clara.

The HUBER+SUHNER booth at DesignCon focuses on its range of outstanding electrical solutions and assemblies developed and enhanced for high speed digital testing. Designed to be highly flexible, with outstanding electrical characteristics and best in-class phase stability, HUBER+ … Read More → "Latest best in class testing solutions to be showcased at DesignCon 2017 by HUBER+SUHNER"

KEMET Automotive and Commercial ESD-Rated Ceramic Capacitors in 0603 EIA Case Size Extend Choices for Designers

January 18, 2017

KEMET, a leading global supplier of electronic components, has introduced electrostatic discharge (ESD) rated ceramic capacitors in small 0603 EIA case size (metric 1608), providing designers a choice of either X7R or C0G dielectric for circuits requiring Class-II or Class-I stability and noise performance. Automotive and commercial grades are available, and a special ordering code allows customers to obtain automotive-grade parts for their projects without submitting a drawing or specification.

“Electrostatic discharge events can cause undesirable operation in a circuit and possibly damage components. ESD damage due to human … Read More → "KEMET Automotive and Commercial ESD-Rated Ceramic Capacitors in 0603 EIA Case Size Extend Choices for Designers"

Melexis Announces Chipset and Evaluation Kit for ToF 3D Vision in Challenging Environments

January 18, 2017

Tessenderlo, Belgium, 18 January 2017 – Melexis, the global microelectronics company enabling future innovation through a philosophy of inspired engineering, has announced a chipset and its evaluation kit that simplify and speed the implementation of robust, time?of?flight (ToF) 3D vision solutions for the most challenging environments. With this newest addition Melexis continues to strengthen its expertise and know-how in the area of ToF solutions for automotive and beyond.

Representing a complete ToF sensor and control solution, the chipset supports QVGA resolution and offers unsurpassed sunlight robustness and up to -40°C to +105°C temperature range operation. Using the … Read More → "Melexis Announces Chipset and Evaluation Kit for ToF 3D Vision in Challenging Environments"

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