News – Page 1256 – EEJournal

Microsemi’s Space Products Support Iridium® NEXT Satellite Program

Company Congratulates Iridium Communications Inc., Thales Alenia Space, SpaceX and Subcontractors on Successful Launch of First 10 Satellites

March 9, 2017

ALISO VIEJO, Calif., March 9, 2017 /PRNewswire/ — Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today extended its congratulations to Iridium Communications Inc., Thales Alenia Space, SpaceX and project subcontractors on the successful launch of the first 10 Iridium NEXT satellites. Iridium NEXT is Iridium’s next-generation satellite constellation, replacing and enhancing its existing network of low-Earth orbit satellites spanning the globe. The project is leveraging more than 200,000 Microsemi devices ideally suited for < … Read More → "Microsemi’s Space Products Support Iridium® NEXT Satellite Program"

Advanced Dynamic NFC/RFID Tag ICs from STMicroelectronics Combine Long-Range Contactless Communication with Fast Transfer Mode

March 9, 2017

Geneva, March 9, 2017 — The new advanced ST25DV dynamic-tag ICs are the latest addition to the ST25 NFC/RFID product family that come with a rich featured contactless RF interface and I2C bus. The dual-interface enables untethered interaction … Read More → "Advanced Dynamic NFC/RFID Tag ICs from STMicroelectronics Combine Long-Range Contactless Communication with Fast Transfer Mode"

LDRA Integration with IBM® Rational® DOORS® Next GenerationProvides Complete Embedded Software Lifecycle Requirements Traceability and Collaboration Solution

March 9, 2017

Wirral, U.K. – 9 March 2017 – LDRA, the leader in standards compliance, automated software verification, software code analysis, and test tools, today announced that its industry-leading LDRA tool suite^® is now integrated with the IBM^® Rational^® DOORS^® Next Generation requirements management tool. DOORS Next Generation equips teams with … Read More → "LDRA Integration with IBM® Rational® DOORS® Next GenerationProvides Complete Embedded Software Lifecycle Requirements Traceability and Collaboration Solution"

InvenSense and GLOBALFOUNDRIES Collaborate on Industry-Leading Ultrasonic Fingerprint Imaging Technology

March 9, 2017

San Jose, California, March 9, 2017 – InvenSense, Inc. (NYSE: INVN), a leading provider of MEMS sensor platforms, and GLOBALFOUNDRIES, a leading provider of advanced semiconductor manufacturing technology, today announced their collaboration on an ultrasonic fingerprint imaging technology for InvenSense UltraPrint Ultrasound Fingerprint Touch Sensor Solution. InvenSense and GF are enabling, for the first time, commercial manufacturing of aluminum nitride-based piezoelectric Micromachined Ultrasonic Transducers (pMUT). As a result of the close technological collaboration between InvenSense and GF, InvenSense’s CMOS-MEMS Platform can now be extended to pMUT devices and enable a biometric authentication solution for mobile and IoT products.

Pycom boards and accessories for IoT development available from RS Components

March 9, 2017

OXFORD, UK, 9 March, 2017 – RS Components (RS), the trading brand of Electrocomponents plc (LSE:ECM), the global distributor for engineers, today announced availability of a range of development boards and accessories from Pycom http://uk.rs-online.com/web/b/pycom/ to … Read More → "Pycom boards and accessories for IoT development available from RS Components"

ESD Alliance Organizes “Energy Policy and Strategy for the IoT Era” Panel

March 8, 2017

REDWOOD CITY, CALIF. –– March 6, 2017 –– (reminder March 21)

WHO: The Electronic System Design Alliance (ESD Alliance), an international association of companies providing goods and services throughout the semiconductor design ecosystem

WHAT: Will present an informational panel, “Energy Policy and Strategy for the IoT Era,” to outline the new rules for PCs set by the California Energy Commission (CEC). It will be moderated by Grant Pierce, chief executive … Read More → "ESD Alliance Organizes “Energy Policy and Strategy for the IoT Era” Panel"

Microchip Simplifies the Development of Smart, Connected and Secure Solutions with a Hardware Cryptography-Enabled Microcontroller

March 8, 2017

CHANDLER, Ariz., March 8, 2017 — The CEC1702 hardware cryptography-enabled microcontroller is now available from Microchip Technology Inc. (NASDAQ: MCHP), a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions. The CEC1702 addresses the increasing need for security measures, such as secure boot, driven by the continual growth of Internet of Things (IoT) applications. For more information about the CEC1702, visit: http://www. … Read More → "Microchip Simplifies the Development of Smart, Connected and Secure Solutions with a Hardware Cryptography-Enabled Microcontroller"

Maxim’s Defibrillation and ESD Protection Device Safeguards Medical Applications with 100x Less Leakage Current

March 8, 2017

San Jose, CA—February 28, 2017—Targeting medical equipment such as defibrillators as well as ECG diagnostics and monitoring systems, the MAX30034 defibrillation protection device from Maxim Integrated Products, Inc. (NASDAQ: MXIM) protects against defibrillation pulses and electrostatic discharge (ESD). Compared to existing approaches and components, it simplifies design, provides > 75% space savings, and trims the bill of materials, all while significantly improving performance.

Eutelsat and STMicroelectronics Announce Low-Cost, Low-Power System-on-Chip for Interactive Satellite Terminals

March 8, 2017

Paris, France and Geneva, Switzerland – March 8, 2017 – Eutelsat Communications (NYSE Euronext Paris: ETL), one of the world’s leading satellite operators, and STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, have achieved a new milestone with a new-generation chip that will power Eutelsat’s SmartLNB interactive terminal.

ST’s advanced, low-power System-on-Chip (Read More → "Eutelsat and STMicroelectronics Announce Low-Cost, Low-Power System-on-Chip for Interactive Satellite Terminals"

Swatch Group creates the world’s smallest Bluetooth chip

March 7, 2017

Biel/Bienne (Switzerland), March 6, 2017 — Three world records in the “Swiss Silicon Valley”. Swatch Group is proud to introduce a new Bluetooth chip with exceptional features unrivaled by any existing product. The new integrated circuit, designed 100% by EM Microelectronic, Swatch Group R & D and the Swiss Center for Electronics and Microtechnology (CSEM), has already set the following records:

It is — first and foremost — the smallest Bluetooth chip on the market. The ultra-miniaturization of electronic components is crucial for the densification of functions in portable electronic devices and for the Internet of Things.
It has … Read More → "Swatch Group creates the world’s smallest Bluetooth chip"