News – Page 1248 – EEJournal

ams launches AS7225 tunable-white lighting smart system sensor

March 28, 2017

Premstaetten, Austria (March 28, 2017) — ams AG (SIX: AMS), a leading provider of high performance sensor solutions, today announced the AS7225 tunable-white lighting smart system sensor, further broadening the solution set for sensor-integrated tunable-white lighting solutions. With the addition of the AS7225, OEM lighting manufacturers can access ams’ closed-loop CCT tuning and daylight compensation, while retaining the existing host microprocessor architecture in their smart lighting design. The result is higher precision, more flexible LED binning, and lower system costs for tunable white lighting systems.

Read More → "ams launches AS7225 tunable-white lighting smart system sensor"

MakeVR Brings Advanced Design, Modeling and 3D Printing to Virtual Reality

March 28, 2017

San Francisco, CA – March 27, 2017 – Vive Studios™, the virtual reality (VR) content development and publishing initiative fromHTC VIVE™, and Sixense, a global leader in motion tracking and VR content, today launched MakeVR. Developed by Sixense,MakeVR is an industry standard professional CAD engine that brings advanced 3D object modeling to VR. With an intuitive interface based on natural two-handed motions, the app uses Vive’s room-scale VR to give creators an immersive virtual space to explore and design objects like never before. MakeVR also bridges the gap between virtual and real workshop with direct … Read More → "MakeVR Brings Advanced Design, Modeling and 3D Printing to Virtual Reality"

efabless, X-FAB Announce Results of First Analog-on-Demand Design Challenge

March 28, 2017

SAN JOSE, CALIF. –– March 28, 2017 –– The top three winning entries in the first open analog Design Challenge for an ultra-low power voltage reference were announced today by sponsors efabless corporation, an open-innovation, semiconductor creation platform, and X-FAB Silicon Foundries, the leading analog/mixed-signal and MEMS foundry group.

Winning designs met a given set of conditions across the full range of parameters and were judged by the lowest power dissipation. First place was awarded to Rishi Raghav, whose design had the lowest … Read More → "efabless, X-FAB Announce Results of First Analog-on-Demand Design Challenge"

Pentek’s Jade Architecture Module for Wideband Signal Capture and Generation Now Available

March 28, 2017

Wideband, low-latency, synchronous XMC module
Two 500 MHz 12-bit A/Ds with multiband digital down converters
Wideband digital upconverter feeds two 800 MHz 16-bit D/As
Jade Architecture with Xilinx Kintex Ultrascale FPGA offers price,
power and processing performance advantages
Navigator Design Suite expedites development and custom … Read More → "Pentek’s Jade Architecture Module for Wideband Signal Capture and Generation Now Available"

Synopsys’ IC Validator Used for Physical Sign-Off on More Than 100 FinFET Production Tapeouts

March 28, 2017

MOUNTAIN VIEW, Calif., March 28, 2017 /PRNewswire/ —

Highlights:

Industry’s most complex chips verified with more than 200 CPUs overnight
Complete foundry runset coverage for all FinFET processes
In-Design physical signoff with IC Compiler II place-and-route system for rapid ECO flow

Software Start-Up Kaloom Inc. Building The Next Generation Networking Solution to Revolutionize the Data Center

March 27, 2017

MONTRÉAL, March 24, 2017 /CNW/ – Kaloom Inc., a Montréal and Silicon Valley based software start up, building the next generation networking solution to revolutionize the data center, today announced that it has closed on a US $10.7 million committed Series A equity funding round, led by the Fonds de solidarité FTQ, with the participation of Somel Investments Inc., MBUZZ Investments Inc., Griffin Fund II, LP and other current investors and the company’s officers. The transaction closed in December, 2016.

Based in Montréal and Silicon Valley, Kaloom is building … Read More → "Software Start-Up Kaloom Inc. Building The Next Generation Networking Solution to Revolutionize the Data Center"

CSEM Brasil and SUNEW Develop Fully Transparent Solar Film Using Cambrios’ ClearOhm®

March 27, 2017

MUNICH, GERMANY–(Marketwired – March 27, 2017) – CSEM Brasil, SUNEW and Cambrios have announced here at LOPEC 2017 that they have jointly developed “OPV Power Film” that uses Cambrios’ ClearOhm® materials to make transparent solar cells which will be integrated into windows and make use of the large areas available to produce power in buildings.

CSEM Brasil will showcase a prototype of large area OPV Power Film using silver nanowires applied to a glass window during LOPEC.

OPV Power Film will be manufactured and sold by SUNEW, which was formed … Read More → "CSEM Brasil and SUNEW Develop Fully Transparent Solar Film Using Cambrios’ ClearOhm®"

AVX Releases New FHC1 & FHC2 Series Power Film Capacitors for EV/HEV Applications

March 27, 2017

FOUNTAIN INN, S.C. (March 27, 2017) – Read More → "AVX Releases New FHC1 & FHC2 Series Power Film Capacitors for EV/HEV Applications"

Synopsys’ RSoft Photonic Component Design Suite Version 2017.03 Accelerates Optoelectronic Device Analysis

March 27, 2017

MOUNTAIN VIEW, Calif., March 27, 2017 /PRNewswire/ —

Highlights:

Enhances integration with Synopsys’ Sentaurus TCAD products
Speeds simulations of waveguide photodetectors by as much as 100x
Improves the bidirectional scattering distribution function calculation for mixed-level LED/OLED simulations

Synopsys, Inc. ( … Read More → "Synopsys’ RSoft Photonic Component Design Suite Version 2017.03 Accelerates Optoelectronic Device Analysis"

Pentek’s Jade Architecture Module for Wideband Signal Capture and Generation Now Available

March 27, 2017

Wideband, low-latency, synchronous XMC module
Two 500 MHz 12-bit A/Ds with multiband digital down converters
Wideband digital upconverter feeds two 800 MHz 16-bit D/As
Jade Architecture with Xilinx Kintex Ultrascale FPGA offers price, power and processing performance advantages
Navigator Design Suite expedites development and custom IP integration

UPPER SADDLE RIVER, NJ?March 27, 2017?Pentek, Inc., today introduced the newest member of the Jade™ family of data converter XMC modules. The Model 71851 is based on the Xilinx Kintex … Read More → "Pentek’s Jade Architecture Module for Wideband Signal Capture and Generation Now Available"