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Pasternack Releases New Line of IQ Mixers with RF and LO Frequency Bands Ranging from 4 GHz to 38 GHz

April 4, 2017

IRVINE, Calif. – Pasternack, a leading provider of RF, microwave and millimeter wave products, has released six new IQ mixer models with RF and LO frequency bands ranging from 4 GHz to 38 GHz and In-Phase and Quadrature IF bandwidths ranging from DC to 4.5 GHz. Typical applications include point-to-point and point-to-multipoint radio, VSAT, Military Radar, EW, Satellite Communications, sensors, and  test and measurement equipment.

Pasternack’s new Read More → "Pasternack Releases New Line of IQ Mixers with RF and LO Frequency Bands Ranging from 4 GHz to 38 GHz"

Renesas Electronics Enables Security and Safety for Next-Generation Connected Cars With Embedded Virtualization Technology for the R-Car Platform

April 4, 2017

Dusseldorf, April 4, 2017 – Renesas Electronics, a premier supplier of advanced semiconductor solutions, today announced its new software packages for the R-Car automotive computing platform to improve security and safety capabilities for next-generation connected cars. The software packages implement embedded optimized virtualization technology that enables embedded systems … Read More → "Renesas Electronics Enables Security and Safety for Next-Generation Connected Cars With Embedded Virtualization Technology for the R-Car Platform"

Leti Announces EU/South Korean Project for World’s First 5G-system Prototype

April 4, 2017

GRENOBLE, France – April 4, 2017 – Leti, a research institute of CEA Tech, today announced a European and South Korean project, 5G CHAMPION, to deliver the world’s first fully integrated and operational 5G prototype in conjunction with the 2018 Winter Olympics.

The team of eight European and 13 Korean partners will develop a new architecture that provides an efficient end-to-end system performance encompassing cutting-edge 5G radio-access, core-network and satellite technologies. It will be the first time ever that state-of-the-art terrestrial wireless communication, including future key enablers such as mmWave access, will be seamlessly combined with disruptive satellite communication. This will form … Read More → "Leti Announces EU/South Korean Project for World’s First 5G-system Prototype"

New Mentor DRS360 Platform Enables Level 5 Autonomous Driving via Centralized Raw Data Fusion and Direct Real-Time Sensing

April 4, 2017

Mentor, a Siemens business, today introduced the DRS360 platform – a comprehensive automated driving solution featuring breakthrough technology that captures, fuses and utilizes raw data in real time from a wide range of sensing modalities, including radar, LIDAR, vision and other sensors. The DRS360 platform delivers dramatic improvements in latency reduction, sensing accuracy and overall system efficiency required for SAE Level 5 autonomous vehicles.

A Breakthrough Approach for Real-Time, High-Resolution Sensing

In a first for autonomous driving platforms, DRS360 directly transmits unfiltered information from all system sensors to a central processing unit, where raw sensor … Read More → "New Mentor DRS360 Platform Enables Level 5 Autonomous Driving via Centralized Raw Data Fusion and Direct Real-Time Sensing"

TE Connectivity Expands DEUTSCH 369 Series Product Line with PCB Versions

April 4, 2017

HARRISBURG, Pa. – April 4, 2017 – TE Connectivity (TE), a world leader in connectivity and sensors, has expanded its DEUTSCH 369 series connector range to include two new versions of the connector, enabling integration directly to the printed circuit board. Key applications include commercial aircraft interiors, helicopter and rail lighting.

TE’s DEUTSCH 369 series connectors are designed with the industry’s strict regulations and Electrical Wiring Interconnect Systems’ (EWIS) best practices in mind. Based on EN4165/ARINC 809 connectors, the 369 connector series include connectors in 3, 6, and 9 position standard. The PCB versions follow these standards with their compact footprint and space-saving configuration. Engineers … Read More → "TE Connectivity Expands DEUTSCH 369 Series Product Line with PCB Versions"

DDC-I and Mocana Announce Integrated IoT Security Platform for Military and Commercial Avionics

April 4, 2017

Phoenix, AZ. – April 4, 2017 – DDC-I, a leading supplier of software and professional services for mission- and safety-critical applications, and Mocana, a leading provider of mission-critical security solutions for embedded systems and the Internet of Things (IoT), today announced an integrated platform for avionics security that combines DDC-I’s Deos certifiable safety-critical real-time operating system (RTOS) with Mocana’s IoT Security Platform. The integrated, commercial-off-the-shelf (COTS) platform enables avionics developers to equip their safety critical systems with advanced security capabilities, such as trusted boot and firmware upgrades, certificate management, cryptography, data transport, and device-to-cloud communications.

< … Read More → "DDC-I and Mocana Announce Integrated IoT Security Platform for Military and Commercial Avionics"

Cadence Voltus IC Power Integrity Solution Enables Juniper Networks to Achieve First-Pass Silicon Success for its Largest Networking SoC

April 4, 2017

SAN JOSE, Calif., April 4, 2017— Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that Juniper Networks achieved first-pass silicon success for its largest system-on-chip (SoC) design with hundreds of millions of instances on the latest FinFET process using the Cadence Voltus IC Power Integrity Solution. With the Cadence solution in place, Juniper yielded faster turnaround times and improved signoff accuracy when compared with its previous solution.

In addition to faster turnaround and improved accuracy, the Voltus IC Power Integrity Solution incorporates the industry’ … Read More → "Cadence Voltus IC Power Integrity Solution Enables Juniper Networks to Achieve First-Pass Silicon Success for its Largest Networking SoC"

Microsemi’s New Smart Storage I/O Controllers Unlock Flash Performance in Data Center Servers

Latest Storage Controller Platform Delivers Industry-Leading Performance, Power and Security
April 3, 2017

ALISO VIEJO, Calif., April 3, 2017 /PRNewswire/ — Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the production release of a new generation of storage input/output (I/O) controller products, the SmartROC 3100 and SmartIOC 2100, powered by the company’s Unified Smart Storage Stack. With the release of this new Smart Storage Platform, Microsemi significantly … Read More → "Microsemi’s New Smart Storage I/O Controllers Unlock Flash Performance in Data Center Servers"

Renesas Electronics Europe Announces the Winners of its Third European MCU Car Rally Held at embedded world 2017 in Nuremberg

April 3, 2017

Dusseldorf, April 3, 2017 – Renesas Electronics Europe, a premier supplier of advanced semiconductor solutions, today announced the winners of its MCU Car Rally competition for university students, which was held on March 16 at embedded world 2017 in Nuremberg, Germany. Thirty teams from all over Europe, comprising approximately 150 students supported by their 25 professors, participated in the challenge by each developing a functioning model rally car that included sensors and an RX microcontroller (MCU) from Renesas.

First past the post, with a time of 03:21 minutes for five full laps of the 67m circuit, was the car built by the Fastech from the … Read More → "Renesas Electronics Europe Announces the Winners of its Third European MCU Car Rally Held at embedded world 2017 in Nuremberg"

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