News – Page 1230 – EEJournal

EpiGaN to Showcase its 200mm GaN-on-Si Epi Wafers for 650V Power Switching and RF Power Applications

May 15, 2017

Hasselt, Belgium, 15 May 2017 — EpiGaN n.v., a worldwide leading provider of III-nitride epitaxial material solutions for advanced semiconductor manufacturing, will showcase the latest enhancements of its Gallium Nitride on Silicon epi-wafer family that meets industrial specifications for HEMT (High Electron Mobility Transistor) devices at 650V at PCIM Europe 2017 in Nuremberg, Germany (May 16-18, 2017), as well as at CSMantech in Indian Wells, California, USA (May 22-14, 2017). At PCIM Europe, EpiGaN will exhibit in Hall 6, Booth 432.

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u‑blox introduces ultra small RPMA module for the Machine Network™

May 15, 2017

The SARA‑S200 offers significant size and cost savings for secure and robust M2M and IoT wireless applications.

Thalwil, Switzerland – May 15, 2017 – u‑blox (SIX:UBXN), a global leader in wireless and positioning modules and chips, today announced Read More → "u‑blox introduces ultra small RPMA module for the Machine Network™"

STMicroelectronics’ New MDmesh™ MOSFETs with Fast-Recovery Diode Enhance Power Density of High-Efficiency Converters

May 15, 2017

Geneva, May 15, 2017 – The latest MDmesh™ DK5 power MOSFETs from STMicroelectronics are Very High-Voltage (VHV) super-junction transistors with the extra advantage of a fast-recovery diode. This helps designers maximize the efficiency of various power-conversion topologies including LLC resonant converters with Zero-Voltage Switching (ZVS).

AVX Releases New Passive Component Design Kit for IoT Applications

May 15, 2017

Comprised of a broad sampling of passives, the new IoT design kit provides engineers with a broad range of component solutions ideally suited for IoT devices with widely varying power, data processing speed, form factor, & price requirements

FOUNTAIN INN, S.C. (May 15, 2017) – Read More → "AVX Releases New Passive Component Design Kit for IoT Applications"

Altium To Host “PCB 2020” Global Product Roadshow Series

May 15, 2017

San Diego, CA, May 11, 2017 — Rapid growth in markets for “smart” wearables, appliances, factory equipment, and more – the “Internet of Things” – is leading to more and more people, companies, and processes engaging in the design of printed circuit boards. Altium, a global provider of electronic design solutions, will overview market trends and the future of PCB design tools in its upcoming technology roadshow, “PCB 2020: Altium’s Roadmap to the Future”. This interactive and educational roadshow will be an all-inclusive event for PCB designers from every spectrum of the electronics community, from maker to specialist.

Design engineers from all … Read More → "Altium To Host “PCB 2020” Global Product Roadshow Series"

Intersil Introduces Smallest Footprint and Highest Efficiency PMIC for Application Processors, GPUs, FPGAs and System Power

May 15, 2017

Highly integrated ISL91211 PMIC enables 91% efficiency and 40% smaller solution size for smartphones, IoT devices, and other space/power constrained systems

Milpitas, Calif., May 15, 2017 – Intersil, a subsidiary of Renesas Electronics Corporation (TSE: 6723), today introduced a highly integrated programmable power management IC (PMIC) that delivers 91% efficiency at 1.1V output voltage for application processors, GPUs, FPGAs and high-performance system power. The new PMIC’s low RDS(on) MOSFETs and programmable PWM frequency allows designers to use fewer low-profile external components, enabling a 50mm2 power-supply that is 40% smaller than competing solutions. The ISL91211 triple/quad output PMIC is ideal for smartphones, … Read More → "Intersil Introduces Smallest Footprint and Highest Efficiency PMIC for Application Processors, GPUs, FPGAs and System Power"

Mentor Valor technologies connect advanced packaging vendors at world’s first live Industry 4.0 factory floor

May 15, 2017

Valor® technologies from Mentor, a Siemens business, are showcased in the Fraunhofer Institute annual live advanced packaging assembly line at the SMT Hybrid Packaging show in Nuremberg, Germany.
The Open Manufacturing Language (OML) from Mentor provides inter-vendor connection between surface mount technology (SMT) machines and line processes enabling Industry 4.0 capabilities.
The Valor IoT Manufacturing hardware product, Valor Finite Production Planning and Valor Lean Material Management software, inter-connected with machine vendors, comprise the world’s first public demonstration of digital factory automation.

Mentor, a Siemens business, today announced that … Read More → "Mentor Valor technologies connect advanced packaging vendors at world’s first live Industry 4.0 factory floor"

Spectrum’s new Boxcar function smooths out noise to give clear signals

May 15, 2017

Technical Highlights:

Improved resolution and dynamic performance for oversampled signals
Standard with all of Spectrum’s 44xx series PCIe, PXIe and LXI digitizers
Fully programmable and supported by SBench6 Pro software

Grosshansdorf, Germany, 15 May 2017 Spectrum GmbH, the pioneer of perfect-fit solutions, has announced a new function for its extensive range of modularly designed digitizers. The Boxcar averaging function smooths out high frequency noise to give a clear signal. It is most useful in situations where signals … Read More →

AdaCore Launches “Make with Ada” Programming Competition, with €5000 Top Prize

May 15, 2017

Programming competition aimed at embedded systems programmers, to demonstrate Ada’s benefits for reliable, safe and secure software

NEW YORK and PARIS, MAY 15, 2017 – AdaCore today announced the launch of its 2^nd annual “Make with Ada” programming competition, a contest that aims to help the embedded software community improve the quality of their code by encouraging the use … Read More → "AdaCore Launches “Make with Ada” Programming Competition, with €5000 Top Prize"

Xilinx Debuts Industry-First P4_16 to FPGA Compilation and Introduces New P4-NetFPGA Workflow for Networking Researchers at P4 Industry Events

May 12, 2017

May 11, 2017

SAN JOSE, Calif., May 11, 2017 /PRNewswire/ — Xilinx, Inc. (NASDAQ: XLNX) announced today it will participate in the 2017 P4 Developer Day and P4 Workshop, May 16 – 17 at Stanford University, debuting its P4₁₆ to FPGA compilation and introducing a new P4-NetFPGA workflow for networking researchers. As co-chair of the P4.org working group that has developed the new P4₁₆ language standard, Xilinx is a lead sponsor and co-presenter for … Read More → "Xilinx Debuts Industry-First P4_16 to FPGA Compilation and Introduces New P4-NetFPGA Workflow for Networking Researchers at P4 Industry Events"