News – Page 1229 – EEJournal

Alliance Memory Launches New 32-Bit Wide 8Mb and 16Mb Fast SRAMs in 90-Ball TFBGA Package

May 17, 2017

SAN CARLOS, Calif. — May 17, 2017 — To meet the demand for high-density fast CMOS SRAMs, Alliance Memory today introduced new 8Mb and 16Mb x32 devices in the 90-ball 8mm by 13mm TFBGA package.

Providing space-saving alternatives to solutions in larger 119-ball packages, the devices released today are optimized for networking routers and switchers, test and medical equipment, and automotive applications. Featuring access times of 10 ns and data retention voltages of 1.5V minimum, the 8Mb AS7C325632-10BIN and 16Mb AS7C351232-10BIN are configured as 256K x 32 and 512K x 32, respectively.

The SRAMs provide low … Read More → "Alliance Memory Launches New 32-Bit Wide 8Mb and 16Mb Fast SRAMs in 90-Ball TFBGA Package"

Renesas Electronics America Expands Renesas IoT Sandbox to Accelerate the Path from IoT Design Prototyping to Production

May 16, 2017

Collaboration with Bug Labs, Medium One, and Seeed Studio Speeds the End-to-End Process with Data Monitoring, Data Intelligence, and Open-Source Hardware

SANTA CLARA, Calif., May 15, 2017 — Renesas Electronics America Inc., a premier supplier of advanced semiconductor solutions, today announced it has expanded Renesas IoT Sandbox to shorten the prototyping process for Internet of Things (IoT) design and to simplify the path to production for small- to large-sized companies developing IoT solutions.

In collaboration with Bug Labs, Medium One, and Seeed Studio, Renesas has broadened Renesas IoT Sandbox by enhancing the data monitoring and data intelligence developer … Read More → "Renesas Electronics America Expands Renesas IoT Sandbox to Accelerate the Path from IoT Design Prototyping to Production"

Gate Drivers from Diodes Incorporated Simplify the Switching of MOSFETs and IGBTs in Motors and Power Supplies

May 16, 2017

Plano, Texas – May 16th, 2017 – Diodes Incorporated has introduced the DGD2103M, DGD2104M and DGD2304 gate drivers that feature a floating high-side driver to simplify the switching of two N-channel MOSFETs or two IGBTs in a half-bridge configuration. These drivers suit a wide range of motor control and power supply applications in industrial automation and white goods, that require AC and DC motor control boards rated above 100W, and LLC resonant converter power supply topologies.

The half-bridge configuration of the DGD2103M, DGD2104M and DGD2304 devices includes high-side (HS) and low-side (LS) drivers with high pulse-current … Read More → "Gate Drivers from Diodes Incorporated Simplify the Switching of MOSFETs and IGBTs in Motors and Power Supplies"

MEMSIC Announces Economical, Compact, Highly Accurate VG380 Vertical Gyro Modules

May 16, 2017

Designed for unmanned aerial vehicles, satellite antenna tracking, precision agriculture, surveying instruments, and construction equipment

The industry’s best performance and accuracy for the price point

May 16, 2017 – Andover, Massachusetts

MEMSIC Inc., a leading solutions provider, combining proprietary MEMS technology with advanced mixed-signal processing and systems solutions, today announced the addition of the VG380 to its portfolio of inertial modules. These new vertical gyros provide highly accurate pitch and roll (with respect to gravity), in both static and dynamic conditions, at a very attractive size and price points. The static and dynamic accuracy is … Read More → "MEMSIC Announces Economical, Compact, Highly Accurate VG380 Vertical Gyro Modules"

Cadence Expands JasperGold Platform for Advanced Formal-Based RTL Signoff

May 16, 2017

JasperGold Formal Verification Platform’s new Superlint and Clock Domain Crossing Apps reduce logic designer’s IP development time by up to four weeks

SAN JOSE, Calif., May 16, 2017—Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced the expansion of its JasperGold® Formal Verification Platform with the introduction of the JasperGold Superlint and Clock Domain Crossing (CDC) Apps, advanced formal-based technologies that address register-transfer level (RTL) signoff requirements. The Superlint and CDC Apps bring the power of JasperGold formal technology to the RTL designer’s desktop. The new apps improve IP design quality by reducing late-stage RTL changes … Read More → "Cadence Expands JasperGold Platform for Advanced Formal-Based RTL Signoff"

AVX is Now Sampling the First-Ever Combined IDC/Press-Fit Wire-to-Board Connection System

May 16, 2017

The new 53-8702 Series combines the two most reliable contact technologies in the automotive industry in a single package to deliver robust, double-ended, cold-welded, & gas-tight 18 – 24AWG wire-to-board terminations in quality- & cost-conscious automotive applications exposed to harsh environmental hazards

FOUNTAIN INN, S.C. (May 16, 2017) – AVX Corporation, a leading manufacturer and supplier of passive components and interconnect solutions, has developed and is now sampling a new, first-of-its-kind, off-the-shelf, high-reliability wire-to-board (WTB) connection system for discrete 18 – 24AWG wire terminations in quality- and cost-conscious automotive electronics applications exposed to shock, vibration, high temperatures, and other harsh environmental elements, including vehicular computers, … Read More → "AVX is Now Sampling the First-Ever Combined IDC/Press-Fit Wire-to-Board Connection System"

300 W Medical Ac-Dc Power Supply Series Complies with 4th Edition EMC Standards

May 16, 2017

TUALATIN, Ore. — May 16, 2017 — CUI’s Power Group today announced the addition of a compact 300 W series to its line of internal ac-dc medical power supplies. http://www.cui.com/internal-ac-dc-medical-power-supplies The VMS‑300A series, available in industry standard 3” x 5” open frame and metal enclosed packages, delivers efficiencies up to 94% and high power densities up to 14.5 W/in3. Meeting EN 60601-1 edition 3.1 safety standards and 4th edition EMC requirements, these single output, medical power supplies are designed for energy-conscious, 2 x MOPP (Means of Patient Protection) hospital, home healthcare, and dental applications.

The open frame VMS‑300A and metal … Read More → "300 W Medical Ac-Dc Power Supply Series Complies with 4th Edition EMC Standards"

Imec demonstrates self-learning neuromorphic chip that composes music

May 16, 2017

Antwerp (Belgium) – May 16, 2017 – Today, at the imec technology forum (ITF2017), imec, the world-leading research and innovation hub in nano-electronics and digital technologies, demonstrated the world’s first self-learning neuromorphic chip. The brain-inspired chip, based on OxRAM technology, has the capability of self-learning and has been demonstrated to have the ability to compose music.

The human brain is a dream for computer scientists: it has a huge computing power while consuming only a few tens of Watts. Imec researchers are combining state-of-the-art hardware and software to design chips that feature these desirable characteristics of a self-learning system. Imec’ … Read More → "Imec demonstrates self-learning neuromorphic chip that composes music"

Cadence and MathWorks Announce New Integration to Accelerate Data Mining and Analytics

May 16, 2017

The collaboration between industry leaders yields new data exchange and analysis capabilities between MATLAB and the Virtuoso platform

SAN JOSE, Calif., May 16, 2017— Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced it has expanded its partnership with MathWorks through a new integration between the Cadence® Virtuoso® Analog Design Environment (ADE) Product Suite and MATLAB®, enabling customers to accelerate processing of large data sets when verifying custom, RF and mixed-signal designs. With this integration, designers can take advantage of existing MATLAB scripts and seamlessly share data between the Virtuoso and MATLAB platforms, allowing for data mining and efficient analysis … Read More → "Cadence and MathWorks Announce New Integration to Accelerate Data Mining and Analytics"

New ams Foundry Ecosystem provides solutions for ASIC design service, testing and fabrication

May 16, 2017

OEMs, system integrators and innovative start-ups can now get their ASIC solutions to market more quickly and more easily thanks to cooperation
between ams, Fraunhofer IIS and RoodMicrotec

Premstaetten, Austria (16 May, 2017) — ams (SIX: AMS), a leading worldwide supplier of high performance sensor solutions, today announced at the CDNLive EMEA a further expansion of its Foundry Ecosystem. In cooperation with Fraunhofer IIS and RoodMicrotec, these three partners now open an additional reliable and comprehensive path towards ASIC solutions by offering IC development, assembly, test and qualification services to OEMs, system integrators and innovative start-ups.

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