News – Page 1189 – EEJournal

eSilicon at TSMC OIP 2017: High-Performance 7FF IP Platform and 7FF HBM2/LL HBM Combo PHY

September 8, 2017

eSilicon, an independent provider of FinFET-class ASIC design, custom IP and advanced 2.5D packaging solutions, will deliver several presentations in booth 807 at the 2017 TSMC OIP Ecosystem Forum in Santa Clara, California at the Santa Clara Convention Center on September 13, 2017.

High-Performance Networking and Computing 7FF IP Platform

Highly differentiating TCAM and memory compilers, I/O libraries and 56G SerDes for high-performance, high-bandwidth applications.

8:30 AM & 12:40 PM, booth 807

7FF Combo PHY: High-Bandwidth Memory Gen2 and Low-Latency … Read More → "eSilicon at TSMC OIP 2017: High-Performance 7FF IP Platform and 7FF HBM2/LL HBM Combo PHY"

Movandi Brings Innovative RF Front End Technology to Emerging High Frequency, Millimeter Wave Networks for 5G and Beyond

Internationally recognized siblings, leaders and innovators, Maryam and Reza Rofougaran Introduce Innovative Approach to RF and Antenna Design, Announce New Company

September 8, 2017

NEWPORT BEACH, Calif., September 6, 2017 – MWC Americas – Movandi, a venture-backed startup with a mission to revolutionize millimeter wave networks, today announced BeamX technology, a scalable RF front-end system solution. The superior performance of Movandi’s RFIC, phased array antenna, and beamforming techniques enable the next generation of 5G and multi-gigabit connectivity that is driving new applications. The company will be demonstrating Movandi’s innovative technology at MWC Americas in … Read More → "Movandi Brings Innovative RF Front End Technology to Emerging High Frequency, Millimeter Wave Networks for 5G and Beyond"

Microsemi’s Cost-Optimized, Low Power Mid-Range PolarFire FPGAs Now Interoperate with Analog Devices’ AD9371 Wideband RF Transceiver

Compatibility Enables PolarFire FPGAs to Serve the Unique Needs of the Wireless Communications, Medical and Defense Markets

September 8, 2017

ALISO VIEJO, Calif. —Sept. 6, 2017—Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced its cost-optimized, low power, mid-range Read More → "Microsemi’s Cost-Optimized, Low Power Mid-Range PolarFire FPGAs Now Interoperate with Analog Devices’ AD9371 Wideband RF Transceiver"

Pixus Announces OpenVPX Development ATR Enclosure

September 7, 2017

Waterloo, Ontario — Sept 6, 2017 – Pixus Technologies, a provider of embedded computing and enclosure solutions, now offers a low-cost demonstration and development ATR (Air Transport Rack) for conduction-cooled 3U or 6U OpenVPX systems. The enclosure includes rear fans for supplemental cooling of high-power cards.

The ATRD058HEX-3U features a 6-slot 3U OpenVPX backplane to PCIe Gen3 (8 Gbps) speeds and includes a VITA 62 power supply slot. Other backplane slot sizes and various VITA 65 profiles are available. The development unit is slightly wider than a 1/2 ATR, Short.

The conduction cooled ATR with heat exchange … Read More →

XP Power releases compact, high-efficiency 750W AC-DC power supplies with industrial and medical approvals

September 7, 2017

September 7th 2017 – XP Power today unveiled the GSP750 series of 750 W AC-DC power supply units, offering high efficiency, a peak power capability of 900 W, single outputs, intelligent fan cooling, and industrial and medical safety approvals.

The GSP750 series come in a low-profile 1U-high chassis and 4 x 10-inch footprint unit, and is an excellent choice for designers looking for a fully featured 750 W supply in a compact mechanical package with class-leading efficiency. In addition, for certain applications, the unit’s peak power capability of 900 W could offer … Read More → "XP Power releases compact, high-efficiency 750W AC-DC power supplies with industrial and medical approvals"

Cadence Announces Legato Memory Solution, Industry’s First Integrated Memory Design and Verification Solution

Delivers up to 2X runtime improvement compared to existing point tool solutions

September 7, 2017

SAN JOSE, Calif., September 7, 2017—Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced the Cadence® Legato™ Memory Solution, the industry’s first integrated solution for memory design and verification. The Legato Memory Solution eliminates the complexity of piecing together point tools for multiple design and verification tasks and can lead to productivity gains of up to 2X when compared with previous point tool offerings. To learn more about the Cadence Legato Memory Solution, please visit Read More → "Cadence Announces Legato Memory Solution, Industry’s First Integrated Memory Design and Verification Solution"

Sequans and STMicroelectronics Introduce New LTE Tracker Platform to Connect and Locate Objects Everywhere

CLOE to be demoed at Mobile World Congress Americas

September 7, 2017

Paris, France; Geneva, Switzerland – September 7, 2017 – Sequans Communications S.A. (NYSE: SQNS), a leading LTE chipmaker, and STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today introduced CLOE, a new LTE-connected tracker platform based on the integration of Sequans and ST technologies. An acronym of Connecting and Locating Objects Everywhere, CLOE combines the Internet-of-Things (IoT) technologies of two industry leaders into one comprehensive platform that simplifies the development of LTE-based IoT tracker devices for the full range of vertical markets, including logistics, consumer electronics, and automotive.

Specifically designed and … Read More → "Sequans and STMicroelectronics Introduce New LTE Tracker Platform to Connect and Locate Objects Everywhere"

Xilinx Powers Huawei FPGA Accelerated Cloud Server

Delivers 10x acceleration for machine learning, data analytics and video processing

September 7, 2017

SHANGHAI, Sept. 6, 2017 /PRNewswire/ — Xilinx, Inc. (XLNX) today announced at HUAWEI CONNECT 2017 that Huawei has chosen high performance Virtex® UltraScale+™ FPGAs to power their first FP1 instance as part of a new accelerated cloud service. The Huawei FPGA Accelerated Cloud Server (FACS) is a platform that enables users to develop, deploy and publish new FPGA-based services and applications on Huawei Public Cloud.

While Huawei’s FACS offers a complete infrastructure … Read More → "Xilinx Powers Huawei FPGA Accelerated Cloud Server"

Renesas Electronics High-Performance Automotive Chips Adopted by Nissan for its New LEAF Automated-Parking System

September 7, 2017

SANTA CLARA, Calif., September 7, 2017 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions today announced that its R-Car system-on-chip (SoC) for car infotainment and advanced driving assistant systems (ADAS) as well as its RH850 automotive control microcontroller (MCU) have been adopted by Nissan for the ProPILOT Park, a full-fledged automated-parking system, of its new LEAF, Nissan’s new 100 percent electric vehicle … Read More → "Renesas Electronics High-Performance Automotive Chips Adopted by Nissan for its New LEAF Automated-Parking System"

CLOE IoT Tracker Platform to be demoed at Mobile World Congress Americas

September 7, 2017

SAN FRANCISCO, Calif. – September 7, 2017 – Sequans Communications S.A. (NYSE: SQNS), a leading LTE chipmaker, and STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today introduced CLOE, a new LTE-connected tracker platform based on the integration of Sequans and ST technologies. An acronym of Connecting and Locating Objects Everywhere, CLOE combines the Internet-of-Things (IoT) technologies of two industry leaders into one comprehensive platform that simplifies the development of LTE-based IoT tracker devices for the full range of vertical markets, including … Read More → "CLOE IoT Tracker Platform to be demoed at Mobile World Congress Americas"

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