EEJournal

industry news archive
Subscribe Now

Xilinx Software Defined Development Environment for Data Center Acceleration Now Available on Amazon Web Services

Software developers less familiar with FPGAs can now accelerate applications at cloud scale
September 15, 2017

Sep 13, 2017

SAN JOSE, Calif., Sept. 13, 2017 /PRNewswire/ — Xilinx, Inc. (NASDAQ: XLNX) today announced that its software defined development environment, SDAccel™, is now available on Amazon Web Services (AWS) for use with Amazon Elastic Compute Cloud (Amazon EC2) F1 instances. Amazon EC2 F1 instances provide reconfigurable, custom-hardware acceleration with 16nm Virtex® UltraScale+™ FPGAs enabling customers to meet the demands of compute-intensive workloads like data analytics, video processing and machine learning.

With the availability of the SDAccel Development Environment for … Read More → "Xilinx Software Defined Development Environment for Data Center Acceleration Now Available on Amazon Web Services"

Cadence Delivers Design and Analysis Flow Enhancements for TSMC InFO and CoWoS® 3D Packaging Technologies

September 15, 2017

Highlights:

•       Completed InFO flow provides customers with a holistic experience from planning and implementation to analysis across multiple dies
•       CoWoS reference flow updated with new enhancements for mobile and high-performance applications development

SAN JOSE, Calif., September 13, 2017—Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced new capabilities that complete its holistic, integrated design flow for TSMC’s advanced wafer-level Integrated Fan-Out (InFO) packaging technology. Additionally, Cadence has unveiled enhancements for TSMC’s chip-on-wafer-on-substrate (CoWoS) advanced packaging technology. The complete InFO flow and enhanced CoWoS design methodologies enable design teams to efficiently complete the development process, … Read More → "Cadence Delivers Design and Analysis Flow Enhancements for TSMC InFO and CoWoS® 3D Packaging Technologies"

Vishay Intertechnology Launches Industry-First High Frequency IHLP® Inductor Series, Boosting DC/DC Efficiency

IHLP-1616BZ-0H Devices Feature High Frequency Performance up to 10 MHz With Lowest Losses of Any Composite Inductor at 1 MHz and Above
September 15, 2017

MALVERN, Pa. — Sept. 14, 2017 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced the first extended-frequency inductor in the low profile, high current IHLP® family. The new IHLP‑1616BZ-0H series features high frequency performance up to 10 MHz with the lowest losses of any inductor on the market for frequencies of 1 MHz and above. By using the IHLP-1616BZ-0H, designers can improve efficiency and potentially reduce the size of DC/DC converter circuitry.

Typical applications for the IHLP-1616BZ-0H will include notebook and desktop computers, sensors, cameras, POL converters, and various battery powered devices that require one or … Read More → "Vishay Intertechnology Launches Industry-First High Frequency IHLP® Inductor Series, Boosting DC/DC Efficiency"

Keysight Technologies’ SystemVue 2017 Simulation Software Enables Industry’s First 5G Design, Verification Process

Software allows 5G base station, handset, RF component, chipset, antenna designers to design 5G systems, phased-array antennas, verify Verizon-KT 5G specification compliance
September 15, 2017

Highlights:

  • Software helps ensure compliance with FCC spectral emission rules
  • Software verifies phased-array hybrid beamforming between the base station and handset in 28-GHz mmWave channels with Verizon-KT 5G signals

SANTA ROSA, Calif., Sept. 14, 2017 – Keysight Technologies, Inc. (NYSE: KEYS) today announced the latest release of its SystemVue electronic system level (ESL) software. Offering unique phased-array antenna and other 5G functionality, Keysight EEsof EDA’s Read More → "Keysight Technologies’ SystemVue 2017 Simulation Software Enables Industry’s First 5G Design, Verification Process"

Cadence Introduces the Conformal Smart Logic Equivalence Checker

Massively parallel architecture and adaptive proof technology improve equivalence checking runtime by an average of 4X
September 14, 2017

SAN JOSE, Calif., September 14, 2017—Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced the Cadence® Conformal® Smart Logic Equivalence Checker (LEC), the next-generation equivalence checking solution that delivers a significant improvement in equivalence checking runtime with minimal user effort. The Conformal Smart LEC delivers an average of 4X runtime improvement compared to the previous generation of logic equivalency checking tools with the same compute resources.

For more information on the Conformal Smart LEC, visit Read More → "Cadence Introduces the Conformal Smart Logic Equivalence Checker"

600V Super-Junction Power Modules from STMicroelectronics Add New Package Options and Features to Simplify Motor Drives

September 14, 2017

Geneva, September 14, 2017 — New SLLIMM™-nano intelligent power modules (IPM) from STMicroelectronics introduce extra package options and integrate additional components to accelerate development and simplify assembly of motor drives from very low power up to 300W.

The 3A and 5A modules contain state-of-the-art 600V super-junction MOSFETs to maximize energy efficiency in equipment such as compressors, fans, pumps, and other appliances. A choice of packages … Read More → "600V Super-Junction Power Modules from STMicroelectronics Add New Package Options and Features to Simplify Motor Drives"

Synopsys and Alango Technologies Introduce Voice Enhancement Package Optimized for DesignWare ARC Data Fusion IP Subsystem

Combination of Alango's Far-Field Voice Enhancement Software Technologies and Synopsys' ARC IP Subsystem Provides Ideal Low-Power Solution for Voice-Controlled Devices
September 13, 2017

MOUNTAIN VIEW, Calif., and TIRAT CARMEL, Israel, Sept. 13, 2017 /PRNewswire/ —

Highlights:

Announcing Thermal-Mechanical Analysis with Sherlock 5.3

Capture System-Level Effects on Solder Joint Reliability During Temperature Cycling
September 13, 2017

Beltsville, MD – September 12, 2017 – DfR Solutions, leader in quality, reliability, and durability (QRD) solutions for the electronics industry, today announced the next release of Sherlock Automated Design Analysis™ software – Version 5.3. Advanced features include Thermal-Mechanical Analysis. This advanced new capability provides the ability to capture system-level effects on solder joint reliability during temperature cycling.

Thermal issues are at the root of many product failures in today’s electronics designs. Modern products are more complex, smaller, require more power, and operate in more extreme environments than ever before.  The more complex the design, the greater the thermal strain on the … Read More → "Announcing Thermal-Mechanical Analysis with Sherlock 5.3"

featured blogs
Want to Build Your Own AI-Powered Perseverance Mars Rover?
Apr 2, 2026
Build, code, and explore with your own AI-powered Mars rover kit, inspired by NASA's Perseverance mission....
More from Max's Cool Beans...