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Pentek Announces 4-channel 200 MHz A/D with 32 DDCs Jade XMC Module for Communication and Radar Systems

  • Four 200 MHz, 16-bit A/Ds
    Four wideband FPGA-based Digital Down Converters (DDCs)
    32 narrowband FPGA-based DDCs
    XMC (VITA 42) with PCIe Gen 3 interface
    Jade Architecture with Xilinx Kintex UltraScale FPGA
    Navigator Design Suite for streamlined IP development

    UPPER SADDLE RIVER, NJ─Pentek, Inc., today introduced the newest member of the Jade™ family of high-performance data converter XMC modules based on the Xilinx Kintex UltraScale FPGA. The Model 71862 includes four 200 MHz, 16-bit A/D channels and a unique combination of 32 programmable multiband DDCs for both wideband and narrowband frequency monitoring.

    Performance … Read More → "Pentek Announces 4-channel 200 MHz A/D with 32 DDCs Jade XMC Module for Communication and Radar Systems"

Samtec Expands ExaMAX® High-Speed Backplane Connector System With New Direct Mate Orthogonal (DMO) Options

New Albany, IN: Samtec, a privately held $662MM global manufacturer of a broad line of electronic interconnect solutions, proudly announces the expansion of the ExaMAX® High-Speed Backplane Connector System with new DMO options. System designers can now leverage the inherent advantages of direct mate orthogonal architectures when compared with traditional backplane systems.

Samtec’s new ExaMAX® DMO solutions offer system designers flexibility by removing the mid-plane, allowing fabric cards and line cards to mate … Read More → "Samtec Expands ExaMAX® High-Speed Backplane Connector System With New Direct Mate Orthogonal (DMO) Options"

Altium Announces the TASKING Embedded Profiler to Optimize Applications running on Infineon AURIX

Amersfoort, Netherlands – September 27, 2017 — Altium announces the release of the TASKING Embedded Profiler for TriCore™, giving software developers the capability to fully utilize the performance potential of Infineon AURIX™ devices.

Traditionally, profiling is associated with measuring execution times of functions. Developed jointly with Infineon, the Embedded Profiler is unique in the market as it incorporates expert-level knowledge about the AURIX internal architecture and capabilities within the tool rather than simply measuring execution times. Using this environment-specific knowledge, the TASKING Embedded Profiler locates and analyzes sources of performance degradation and then offers AURIX-specific suggestions for improvement. Because of the … Read More → "Altium Announces the TASKING Embedded Profiler to Optimize Applications running on Infineon AURIX"

Turnkey Power-Line Communication Chipset from STMicroelectronics Paves Way for New Smart-Energy Infrastructure Rollouts

Geneva, Switzerland, September 28, 2017 – STMicroelectronics (NYSE:STM), a global semiconductor leader serving customers across the spectrum of electronics applications, is powering the global shift to smarter energy consumption and management with its new modular Power-Line Communication (PLC) modem chipset. The chipset will provide more flexibility to manufacturers of utility meters, smart-grid nodes, streetlamps, and home and industrial controllers. Three leading global smart-meter manufacturers are already designing solutions based on this new platform.

A turnkey solution, the chipset consolidates protocol handling to package and adapt data so it can be transmitted and line driving for sending over mains wires. … Read More → "Turnkey Power-Line Communication Chipset from STMicroelectronics Paves Way for New Smart-Energy Infrastructure Rollouts"

New high-end GNSS simulator from Rohde & Schwarz generates highly realistic test scenarios

The R&S SMW200A GNSS simulator adds a high-end solution to the Rohde & Schwarz portfolio of satellite navigation system simulators. It can be extended to up to four RF outputs and allows GNSS signals to be simulated simultaneously in multiple frequency bands for multiple antennas. It is the only instrument on the market that can internally simulate a complex interference environment in parallel with GNSS signals. With the R&S SMW200A, Rohde & Schwarz heralds a new era in GNSS simulation.

Munich, September 26, 2017 — Today, an increasing number of GNSS receivers are able … Read More → "New high-end GNSS simulator from Rohde & Schwarz generates highly realistic test scenarios"

Additive Manufacturing Software Developers Gain Competitive Advantage Using SDKs from Tech Soft 3D

BEND, Oregon — September 27, 2017 – Tech Soft 3D, leading provider of software development tools and 3D PDF solutions to the engineering software industry, today announced that many of their partners looking to add 3D printing capability to existing products or develop new innovative ones are using HOOPS software development toolkits and Polygonica in lieu of developing the technology in-house.

Software development toolkits from Tech Soft 3D provide world-class technology with key capabilities such as CAD translation, visualization, modeling, and mesh processing – capabilities that are incredibly difficult and costly to develop. By leveraging the Tech Soft 3 … Read More → "Additive Manufacturing Software Developers Gain Competitive Advantage Using SDKs from Tech Soft 3D"

Be Part of the Future Which Inspires Tomorrow’s Designs at the 55th Design Automation Conference

LOUISVILLE, Colo. –– September 25, 2017 – For 55 years, the Design Automation Conference (DAC) has been recognized as the premier conference on leading-edge research and practice in tools and methodologies for the design and automation of electronic circuits and systems.  DAC continues to offer the semiconductor and electronic design industry outstanding education, training, exhibits and networking opportunities for a worldwide community of designers, researchers, tool developers and vendors. The Technical … Read More → "Be Part of the Future Which Inspires Tomorrow’s Designs at the 55th Design Automation Conference"

Micro-Measurements Introduces Miniature, Lightweight Hybrid Sensors for Force, Displacement, Pressure, Strain and Acceleration Measurements

Malvern, PA, USA – September 20, 2017 – The Micro-Measurements® brand of Vishay Precision Group, Inc. (NYSE: VPG)(www.micro-measurements.com), industry experts in the design, development, and manufacture of resistive-foil sensors for high-precision strain measurements, has introduced a new range of miniature, lightweight hybrid sensors, offering cost-effective force, displacement, pressure, strain and acceleration measurements within high-volume OEM and test applications.

Design of the new Micro-Measurements … Read More → "Micro-Measurements Introduces Miniature, Lightweight Hybrid Sensors for Force, Displacement, Pressure, Strain and Acceleration Measurements"

Future-Proof Security for Very Small Things

Shelton, CT, September 26, 2017 – SecureRF Corporation, a leading provider of quantum-resistant security solutions for the Internet of Things (IoT), has announced that its CEO, Louis Parks, will give a talk at the IoT Device Security Summit on September 28, 2017. Parks will speak about solutions for securing and future-proofing the small, resource-constrained processors typically specified for the Internet of Things (IoT).

< … Read More → "Future-Proof Security for Very Small Things"

Microsemi Announces BlueSky GPS Firewall to Provide Security Against GPS Spoofing and Jamming Threats

ALISO VIEJO, Calif.—Sept. 26, 2017—Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the recent development of a breakthrough approach to protecting critical infrastructure against GPS spoofing and jamming threats with the introduction of its BlueSky™ GPS Firewall. Designed to provide security protection for GPS delivered position, navigation and … Read More → "Microsemi Announces BlueSky GPS Firewall to Provide Security Against GPS Spoofing and Jamming Threats"

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