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Artila launches the Mobile Fanless & Wide-Temperature IoT Gateway Matrix-713

Meet the increasing demand for high-speed mobile internet
January 10, 2018

Taipei, Taiwan – Jan. 2018 — The dissemination of Internet around the world changed the way people communicate, the evolution of the information and communication technology allowed the creation of new types of services involving electronic devices with huge potential. Internet of Things (IoT) offers new possibilities and new services to end users, since they could learn more about other entities present in the surrounding environment. Therefore, the biggest challenges for the IoT application developer is to bring all these heterogeneous systems to an intelligent network, transform the data into a unified format for IoT communication and management. Artila, … Read More → "Artila launches the Mobile Fanless & Wide-Temperature IoT Gateway Matrix-713"

TANAKA Begins Shipments of SJeva, a Newly-developed, High-Quality Au Deposition Material

January 10, 2018
  •  SJeva effective at reducing non-metallic inclusions in products
  • Contributes to raising productivity and reducing costs in semiconductor and medical device applications

TOKYO, Jan 10, 2018 – (ACN Newswire) – Tanaka Holdings Co., Ltd. (Head office: Chiyoda-ku, Tokyo; Representative Director and CEO: Akira Tanae) announces the start of sample shipments of SJeva, a newly-developed, high-quality Au deposition material, by Tanaka Kikinzoku Kogyo K.K (Head office: Chiyoda-ku, Tokyo; Representative Director and CEO: Akira Tanae). Tanaka Kikinzoku Kogyo conducts industrial business within the Tanaka Precious Metals. The new … Read More → "TANAKA Begins Shipments of SJeva, a Newly-developed, High-Quality Au Deposition Material"

STMicroelectronics Selects GLOBALFOUNDRIES 22FDX® to Extend Its FD-SOI Platform and Technology Leadership

GF’s FDX technology will enable ST to deliver high-performance, low-power products for next-generation consumer and industrial applications
January 10, 2018
Santa Clara, California and Geneva, Switzerland, January 9, 2018 – GLOBALFOUNDRIES and STMicroelectronics (NYSE: STM) today announced that ST has selected GF’s 22nm FD-SOI (22FDX®) technology platform to support its next-generation of processor solutions for industrial … Read More → "STMicroelectronics Selects GLOBALFOUNDRIES 22FDX® to Extend Its FD-SOI Platform and Technology Leadership"

ON Semiconductor and ConvenientPower Systems Announce Strategic Collaboration in Automotive Wireless Charging

Joint technology leadership and significant IP portfolio will enhance next generation in-vehicle charging solutions
January 10, 2018

Consumer Electronics Show (CES) – Venetian 3302 – LAS VEGAS, NV – January 9, 2018 – ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, has announced a strategic collaboration with ConvenientPower Systems (CPS) whereby CPS will design, develop and market Read More → "ON Semiconductor and ConvenientPower Systems Announce Strategic Collaboration in Automotive Wireless Charging"

Imec and Holst Centre Introduce EEG Headset for Emotion Detection

Breakthrough Technology to Advance Neuro Research, e-Learning and Virtual Gaming Will be Demonstrated at CES 2018
January 9, 2018

LEUVEN, Belgium—Jan. 9, 2018 – At the International Consumer Electronics Show (CES) taking place in Las Vegas, Nev. Jan. 9-12, 2018, imec, the world-leading research and innovation hub in nano-electronics and digital technologies, and Holst Centre, a research center established by imec and TNO, will demonstrate a prototype of an electroencephalogram (EEG) headset that can measure emotions and cognitive processes in the brain. The headset is a major breakthrough in emotion measurement for therapeutic, learning and gaming applications.

Read More → "Imec and Holst Centre Introduce EEG Headset for Emotion Detection"

eSilicon announces 7nm FinFET ASIC design win

High-speed networking ASIC based on complete TSMC 7nm IP platform
January 9, 2018

SAN JOSE, Calif. — January 9, 2018 — eSilicon, an independent provider of FinFET-class ASIC design, custom IP and advanced 2.5D packaging solutions, today announced its first 7nm design win at a major OEM. The design win follows eSilicon’s development of a complete IP platform on TSMC 7nm process technology for high-bandwidth networking, high-performance computing and AI applications. The 7nm IP platform includes a 56G long-reach SerDes, TCAM, … Read More → "eSilicon announces 7nm FinFET ASIC design win"

Qorvo® IoT Solution Powers Senior Home Care

Collaboration with large health insurer affordably improves independent living
January 9, 2018

GREENSBORO, N.C., Jan. 05, 2018 — Qorvo® (Nasdaq:QRVO), a leading provider of innovative RF solutions that connect the world, is helping seniors live more independently in their homes with the help of a new eHealth system powered by the company’s chipsets for the Internet of Things (IoT). Health insurer CZ will provide the system to 3,000 elderly customers in the Netherlands, marking the first deployment of a senior smart home solution by a large health insurance company. 

Read More → "Qorvo® IoT Solution Powers Senior Home Care"

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