SAN FRANCISCO, January 25, 2018 – The Linux Foundation, the nonprofit organization enabling mass innovation through open source, today announced the program for Read More → "The Linux Foundation Announces Speakers and Sessions for Embedded Linux Conference + OpenIoT Summit North America"
LISLE, IL– Read More → "Molex Spotlights High-Speed Data Connectivity and Expertise at DesignCon 2018"
LONDON, UK, 25 January, 2018 – RS Components (RS), the trading brand of Electrocomponents plc (LSE:ECM), the global distributor for engineers, today announced a significant expansion of RS Pro power supplies ( https://uk. … Read More → "RS Components introduces two new series of RS Pro power converters"
ROCHESTER, N.Y., Jan. 24, 2018 – Vuzix® Corporation (VUZI), (“Vuzix” or, the “Company”), a leading supplier of Smart Glasses and Augmented Reality (AR) technologies and products for the consumer and enterprise markets, is pleased to announce that the Company has launched the Vuzix Blade Edge program due to an overwhelming response to the unveiling of the Vuzix Blade at CES 2018. The Vuzix Blade Edge program represents the 2nd phase of the Vuzix Blade market launch, and replaces the Vuzix Blade Beta Developer kit pre-order program, which has been fully sold out and is now closed.
In order to fulfill … Read More → "Vuzix Launches Vuzix Blade™ Edge Program to Address Market Demand from Developers & Customers"
Cambridge, UK, 25 January 2018 – UltraSoC, the leading developer of embedded analytics technology, today announced general availability of its RISC-V processor trace solution, an industry first and a key enabler within the RISC-V ecosystem. The addition of trace capabilities means that UltraSoC provides the most comprehensive RISC-V commercial debug solution.
Last June the company announced plans to develop processor trace, when … Read More → "UltraSoC delivers industry’s first RISC-V processor trace IP"
LEWISVILLE, Texas – Fairview Microwave Inc., a supplier of on-demand microwave and RF components, has released a new line of high-speed end launch connectors. They are ideal for signal integrity measurements, chip evaluations, coplanar waveguide, 25 GbE, SERDES, substrate characterization and test fixture applications.
Fairview’s new line of high-speed end launch connectors is comprised of 4 … Read More → "Fairview Microwave Debuts New High-Speed Millimeter-Wave End Launch Connectors"
NORWOOD, MA – January 24, 2018 – Analog Devices announces the Power by Linear™ LTC3351, a supercapacitor charger and backup power controller IC that includes hot swap front-end protection and all the features necessary to provide a complete, standalone capacitor-based backup power solution. The LTC3351’s integrated hot swap controller and circuit breaker use N-channel MOSFETS to provide a low loss power path from the input to the output, plus foldback current limiting to reduce inrush current. The device enables reliable short term uninterrupted power in the event of a main power failure for applications such as solid-state drives (SSDs) and nonvolatile dual … Read More → "35V Hot Swappable Supercapacitor Backup Power Controller Provides Uninterrupted Power, Protection & Monitoring"
MALVERN, Pa. — Jan. 24, 2018 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new series of wirewound noise suppressor resistors that delivers improved voltage performance and reliability for automotive ignition systems in reciprocating engines.
Vishay Dale NSR-HP series devices feature a coating that increases reliability by protecting the resistive element against moisture and mechanical shock while enabling high voltage performance to 45 kV and high operating temperatures to +200 °C. The resistors can withstand high voltage pulses at high frequencies and feature a dielectric withstand voltage of 1000 VAC.
Ideal for reducing RFI during electrical discharges in gasoline engines, the … Read More → "New Vishay Intertechnology Noise Suppressor Resistors Offer Increased Voltage Performance and Reliability"
AUSTIN—Silicon Integration Initiative, Inc. (Si2), a research and development joint venture focused on integrated circuit design tool interoperability standards, has launched a System Level Power working group to create the Si2 Unified Power Model (UPM), a standard which will strengthen power management in system-level IC design.
Jerry Frenkil, director of the OpenStandards Coalition, which incubates new Si2 standards, said development of the Si2 UPM is part of the industry’s ongoing effort to improve energy and power efficiency throughout the system-on-a-chip development flow, with a focus on system design.
“Energy efficiency is a growing … Read More → "New Si2 Working Group to Develop Unified Power Model for System-Level IC Design"
Thalwil, Switzerland – January 25, 2018 – u‑blox (SIX:UBXN), a global leader in wireless and positioning modules and chips, announced today that its SARA cellular module series ( https://www.u-blox.com/en/cell
