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Vayyar Imaging Unveils the World’s Most Advanced CMOS SOC for mmWave 3D Imaging

TEL AVIV, Israel–(BUSINESS WIRE)–Vayyar Imaging, the global leader in 3D imaging technology, today announced the launch of the world’s most advanced System on a Chip (SOC) for mmWave 3D imaging, which integrates an unprecedented number of transceivers and an … Read More → "Vayyar Imaging Unveils the World’s Most Advanced CMOS SOC for mmWave 3D Imaging"

AVX Celebrates the Continuing Success of the ChemCam on NASA’s Curiosity Rover, Which is Enabled in Part by 630 AVX Capacitors

FOUNTAIN INN, S.C., May 14, 2018 (GLOBE NEWSWIRE) — AVX Corporation, a leading manufacturer and supplier of advanced electronic components and interconnect, sensor, control, … Read More → "AVX Celebrates the Continuing Success of the ChemCam on NASA’s Curiosity Rover, Which is Enabled in Part by 630 AVX Capacitors"

Arduino and MathWorks team up to offer students new Arduino Engineering Kit

Chiasso, Switzerland, May 12, 2018: Arduino today announced its partnership with MathWorks, a leading developer of mathematical computing software for engineers and scientists, to reinforce the importance of Arduino at the university level in the fields of engineering, Internet of Things, and robotics. The Arduino Engineering Kit is the first product released as a result of the partnership and will be available for purchase starting today on the Arduino online store. The Arduino Engineering Kit consists of three cutting-edge, Arduino-based projects that teach students how to build modern electronic devices – challenging them intellectually and helping them develop physical engineering skills that … Read More → "Arduino and MathWorks team up to offer students new Arduino Engineering Kit"

Otii, the energy optimization solution for the IoT, receives a major software update bringing enhanced features and greater productivity

Lund, Sweden, 14 May 2018 – Qoitech AB today announces the release of version 2.0.0 of the Otii multi-platform desktop software environment that supports the Otii Arc, the innovative energy consumption analysis hardware for developers. Together, Otii’s hardware and software helps engineers maximize battery life and minimize power consumption in fixed, portable and connected devices targeting the IoT.

Otii is an energy consumption analysis solution that lets engineers measure true power usage in real-time at the nA scale. With the release of Version 2.0.0, developers now have access to a … Read More → "Otii, the energy optimization solution for the IoT, receives a major software update bringing enhanced features and greater productivity"

MagnaChip and YMC to Offer Cost Effective 0.13 micron Multiple-Time Programmable (MTP) IP Solutions

SEOUL, South Korea and SAN JOSE, Calif., May 14, 2018 — MagnaChip Semiconductor Corporation (MagnaChip Semiconductor) (NYSE: MX), a designer and manufacturer of analog and mixed-signal semiconductor products, announced today the availability of 0.13 micron Multiple-Time Programmable Intellectual Property (MTP-IP) memory cores targeted for mobile and industrial applications.

Jointly developed with Taiwan-based Yield Microelectronics Corporation (YMC), the non-volatile MTP-IP memory core is coupled with MagnaChip’s 0.13 micron mixed signal and BCD technologies to provide global foundry customers with system-on-a-chip performance for embedded microcontrollers capable of being programmed one thousand times.

Demand for embedded … Read More → "MagnaChip and YMC to Offer Cost Effective 0.13 micron Multiple-Time Programmable (MTP) IP Solutions"

Synopsys IC Validator Certified by GLOBALFOUNDRIES for Signoff Physical Verification

MOUNTAIN VIEW, Calif., May 14, 2018 /PRNewswire/ — 

Highlights:

  • Multi-year collaboration delivers signoff accuracy and highest performance for leading GLOBALFOUNDRIES process technology
  • Certified runsets enable designers to take advantage of IC Validator’s speed and scalability for physical signoff

Synopsys, … Read More → "Synopsys IC Validator Certified by GLOBALFOUNDRIES for Signoff Physical Verification"

Alliance Memory Expands Low-Power SDRAM Portfolio

SAN CARLOS, Calif. — May 8, 2018 — Alliance Memory, a manufacturer of hard-to-find SRAM, DRAM, and SDRAM ICs, today announced that its SDRAM portfolio now features a wide variety of components that combine low power consumption with power-saving features to extend battery life in mobile devices.

Alliance Memory’s lineup of high-speed CMOS mobile low-power SDRAMs includes Read More → "Alliance Memory Expands Low-Power SDRAM Portfolio"

Vishay Intertechnology Launches New AEC-Q101 Qualified High Voltage Thyristors and Diodes

MALVERN, Pa. — May 7, 2018 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced 37 new high voltage thyristors and diodes for automotive applications. Qualified to AEC-Q101, the Vishay Semiconductors devices offer repetitive voltages from 600 V to 1600 V and wide current ranges in three package options.

The devices released today are available in surface-mount DPAK (TO-252AA) and D²PAK (TO-263AB) packages and in the through-hole TO-247AD. The nine new thyristors deliver continuous RMS on-state current from 12 A to 79 A, while the 28 standard and fast recovery diodes offer forward current from 8 A to 65 A. All devices provide up to 1000 V/µ … Read More → "Vishay Intertechnology Launches New AEC-Q101 Qualified High Voltage Thyristors and Diodes"

STMicroelectronics Adds New High-Accuracy MEMS Sensors with 10-Year Product Longevity for Advanced Industrial Sensing

 

  • New low-noise 3-axis accelerometer delivers affordable high-accuracy sensing for industrial inclinometers
  • New parts supported by commitment of 10-year product-longevity program
  • Additional sensing functions, optimized for industrial precision and stability, to follow in 2018

Geneva, May 9, 2018 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications and the leading supplier of MEMS motion sensors … Read More → "STMicroelectronics Adds New High-Accuracy MEMS Sensors with 10-Year Product Longevity for Advanced Industrial Sensing"

ADLINK to Showcase Open Compute Project Carrier Grade for Edge Computing at Light Reading’s Big Communication Event

San Jose, CA – May 10, 2018 – ADLINK, a leading provider of telecom equipment and Plantinum member of the Open Compute Project (OCP),  will be featuring carrier grade CG-OpenRack-19 solutions at the Big Communication Event in Booth B419 on May 14-16 in Austin, TX.  These solutions include Multi-access Edge Compute solutions from multiple OCP partners and suppliers.

The Big Communications Event (BCE) is the communication industry’s meeting point to discuss the major changes affecting its future.  BCE brings telecom experts from around the globe. The conference and expo … Read More → "ADLINK to Showcase Open Compute Project Carrier Grade for Edge Computing at Light Reading’s Big Communication Event"

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