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Baum Launches New Version of Power Modeling, Analysis Solutions for Hardware Design

Will Showcase PowerBaum at DAC June 25-27 at Moscone Center in San Francisco
June 13, 2018

CONCORD, MASS. –– June 12, 2018 –– Baum Inc. today launched the latest version of its flagship product PowerBaum, a state-of-the-art, high-speed and accurate power modeling and analysis solution for engineering groups to fully optimize the energy efficiency of their hardware designs.

PowerBaum 2.0 will be showcased in Booth #2454 at the Design Automation Conference (DAC) June 25-27 at the Moscone Center West in San Francisco. … Read More → "Baum Launches New Version of Power Modeling, Analysis Solutions for Hardware Design"

High-resolution, high-speed CMOS image sensor for machine vision systems goes into mass production

Award-winning CMV50000 from ams provides superior camera performance and higher throughput in Automated Optical Inspection applications
June 13, 2018

Premstaetten, Austria (12 June, 2018) — ams (SIX: AMS), a leading worldwide supplier of high performance sensor solutions, today announced its CMV50000, a high-speed 48Mpixel global shutter CMOS image sensor for demanding machine vision applications, has gone into mass production.
It is available for purchase in high volumes now.

The CMV50000, which features a 35mm-format 7920 x 6004 array of 4.6µm-sized pixels based on a patented eight-transistor pixel architecture, is a breakthrough in CMOS image sensor performance. It operates at a fast 30 frames/s … Read More → "High-resolution, high-speed CMOS image sensor for machine vision systems goes into mass production"

ADLINK Partners with FFG for 5G- and ROS2-based Factories of the Future

June 13, 2018

Taipei, Taiwan – June 12, 2018 – ADLINK Technology, a global leader in Edge Computing,  has joined forces with Fair Friend Group (FFG) to develop the new ROS2 toward Converged 5G for Factories of the Future project. The collaboration integrates wireless 5G network technologies with ROS2 (Robot Operating System 2) platforms to provide system architecture enabling real-time control and reliable communication. Igniting the next wave of growth for the network communication sector, the project can drive Industry 4.0 ecosystem development to bring on a productivity revolution for Factories of the Future.

With Industry 4.0 implementation growing, smart manufacturing has advanced … Read More → "ADLINK Partners with FFG for 5G- and ROS2-based Factories of the Future"

New high-performance oscilloscope from Rohde & Schwarz: innovative signal integrity, measurement speed and range of functions

Ultra fast acquisition rate of one million waveforms per second, realtime compensation of transmission losses (deembedding) between the signal source and oscilloscope, and silent operation even at full load – these are just some of the benefits of the high-performance R&S RTP oscilloscope family.
June 13, 2018

Munich, June 12, 2018 — Rohde & Schwarz introduces the new high-performance R&S RTP family, expanding its oscilloscope portfolio in keeping with its motto “Oscilloscope Innovation. Measurement Confidence.” During the development of the new oscilloscope family, the innovative T&M expert particularly focused on measurement accuracy, speed, a wide range of functions and future-proof technology. The R&S RTP combines various instruments better than any other oscilloscope in its class. All these features make the R&S RTP the oscilloscope of choice for debugging, e.g. … Read More → "New high-performance oscilloscope from Rohde & Schwarz: innovative signal integrity, measurement speed and range of functions"

Microsemi’s TimeProvider 4100 Enables Denmark’s Stofa to Launch First Trial of Remote PHY in Europe Based on DOCSIS 3.1 Standard

IEEE 1588 PTP Grandmaster Clock Offers Flexibility, Scalability and Precision Necessary for Next-Generation Cable Architectures
June 12, 2018

ALISO VIEJO, Calif.—June 12, 2018—Microsemi Corporation, a wholly owned subsidiary of Microchip Technology Inc. (Nasdaq: MCHP), today announced it has enabled cable TV and internet provider Stofa, based in Denmark, to successfully complete the first trial in Europe deploying a new type of architecture—Remote PHY (R-PHY)—based upon the DOCSIS® 3.1 standard in Europe. Using Microsemi’s TimeProvider 4100, a … Read More → "Microsemi’s TimeProvider 4100 Enables Denmark’s Stofa to Launch First Trial of Remote PHY in Europe Based on DOCSIS 3.1 Standard"

FIVE FREE Operating Systems for ARM Cortex M0 / M0+ CPUs

June 12, 2018

Embedded Environments Co. has announced the availability of five free Novos™ Operating Systems specifically developed for embedded systems that use ARM Cortex M0 / M0+ CPUs.

These CPUs need a Compact Micro RTOS and the aim of each Novos environment is to provide a software architecture to match the specific requirements of the application in hand – no more, and no less than what is needed.

Attempts to cut-down a traditional RTOS are very hard work and potentially result in undocumented, unsustainable solutions. A good analogy is trying to strip-down a … Read More → "FIVE FREE Operating Systems for ARM Cortex M0 / M0+ CPUs"

ITTIA and BlackBerry QNX® Strengthen Software Development Innovation for Industrial IoT and Embedded Systems

June 12, 2018

June 11, 2018 — Bellevue, WA — ITTIA, a leading provider of high performance database and connectivity software for embedded systems and Internet of Things (IoT) devices, today announced support for QNX SDP 7.0, the most advanced and secure embedded OS developed for use in all safety and mission critical applications. With ITTIA DB SQL and QNX SDP 7.0, embedded system designers are now empowered to collect, store, analyze and connect real-time data on safe and secure devices built on a highly reliable operating system software foundation that helps guard against system malfunctions, malware and cyber security breaches.

ITTIA … Read More → "ITTIA and BlackBerry QNX® Strengthen Software Development Innovation for Industrial IoT and Embedded Systems"

Integration at its core: New MSP430™ MCUs offer configurable signal-chain elements for sensing applications

TI’s value line MCU portfolio now offers extended operating temperatures up to 105°C, combined with increased analog integration, to meet industrial system requirements
June 12, 2018

DALLAS (June 6, 2018) – Texas Instruments (TI) (NASDAQ: TXN) today announced the addition of new microcontrollers (MCUs) with integrated signal-chain elements and an extended operating temperature range to its MSP430™ value line portfolio. New MSP430FR2355 ferroelectric random access memory (FRAM) MCUs allow developers to reduce printed circuit board (PCB) size and bill-of-materials (BOM) cost while meeting temperature requirements for sensing and measurement in applications such as smoke detectors, sensor transmitters and circuit breakers. For more information on the MSP430FR2355 MCUs, seeRead More → "Integration at its core: New MSP430™ MCUs offer configurable signal-chain elements for sensing applications"

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