News – Page 1073 – EEJournal

ARCCORE launches AUTOSAR Starter Kit for TI’s AWR1642BOOSt EVM mmWave sensor

June 19, 2018

Gothenburg/Sweden, June 18, 2018 – ARCCORE, an independent, established AUTOSAR software provider, is broadening access to the rapidly evolving automotive market with the introduction of a new starter kit for the Texas Instruments (TI) mmWave AWR1642BOOSt EVM sensor which was launched in May 2017.

Automotive OEMs increasingly mandate the use of the open and industry-leading AUTOSAR standard in their ECUs where it simplifies development through software reuse and improved code quality and reliability. Current AUTOSAR solutions, however, are often complex and require a significant initial investment cost. This … Read More → "ARCCORE launches AUTOSAR Starter Kit for TI’s AWR1642BOOSt EVM mmWave sensor"

Synopsys and Industry Technologists to Present Safety-Related Innovative Solutions for Modern-Era Vehicles

Panel Topics Include Challenges, Ecosystem Enablement, and ISO 26262 Compliance for Automotive Designs

June 19, 2018

MOUNTAIN VIEW, Calif., June 18, 2018 /PRNewswire/ — Synopsys, Inc. (Nasdaq: SNPS) today announced it is hosting an automotive-based luncheon panel on how “Automotive Drives the Next Generation of Designs” at the 2018 Design Automation Conference (DAC) event on Tuesday, June 26, from Read More → "Synopsys and Industry Technologists to Present Safety-Related Innovative Solutions for Modern-Era Vehicles"

STMicroelectronics’ Off-Line Converters for 5-30V Power Supplies Enhance Ruggedness, Efficiency, and Flexibility

June 19, 2018

Geneva, June 18, 2018 — The VIPer11 off-line converter with embedded 800V avalanche-rugged … Read More →

FPGA programming solution goes live at AEE 2018 in latest version of SLX

June 18, 2018

Industry-first solution fully explores the design space to optimize hardware/software partitioning
SLX automatically inserts pragmas and rewrites code to make it High-Level Synthesis (HLS) ready
Solution designed in collaboration with customers including Ricoh

San Jose, Calif. And Cologne, Germany – June 18, 2018 – Silexica will launch a new solution within SLX to support the increasing use of FPGAs for embedded computing tasks such as sensor fusion and deep learning. It has been developed in partnership with Ricoh and other customers who will use the solution for industrial automation and defense projects.

Analog Devices Enhanced A2B Transceivers Deliver Unparalleled Flexibility for Emerging Applications

June 18, 2018

NORWOOD, Mass.–(BUSINESS WIRE)–Analog Devices, Inc. (ADI) announced today three enhanced Automotive Audio Bus (A²B®) transceivers that deliver unprecedented capability to tailor system-level performance to even the most stringent electromagnetic compatibility (EMC) requirements. The new AD242x series … Read More → "Analog Devices Enhanced A2B Transceivers Deliver Unparalleled Flexibility for Emerging Applications"

Synopsys Unveils Next-Generation ZeBu Server 4

Emulation Market Leader Delivers 2X Faster Emulation over Legacy Systems

June 18, 2018

MOUNTAIN VIEW, Calif., June 18, 2018 /PRNewswire/ —

Highlights:

Industry’s fastest emulation system now offers 2X higher performance
Industry’s largest capacity, scalable to designs over 19 billion gates
Industry’s lowest total cost of ownership—5X lower power consumption with half … Read More → "Synopsys Unveils Next-Generation ZeBu Server 4"

New Vishay Intertechnology Series of Direct Water-Cooled Wirewound Resistors Saves Space and Increases Reliability

For Industrial Applications, Devices Deliver Ultrahigh Power Dissipation to 9000 W in Compact Sizes Without External Radiation

June 18, 2018

MALVERN, Pa. — June 18, 2018 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new series of direct water-cooled wirewound resistors that offers ultrahigh power dissipation to 9000 W with almost no external radiation. Available in six compact sizes ranging from 38 mm by 178 mm to 38 mm by 410 mm, Vishay MCB DCRF series devices are designed to save space and increase reliability over standard wirewound resistors.

The resistors released today handle 10 times the power of natural-cooled devices in the same size, and two times the power of indirect water-cooled devices. By replacing multiple components with one resistor, the DCRF series allows designers … Read More → "New Vishay Intertechnology Series of Direct Water-Cooled Wirewound Resistors Saves Space and Increases Reliability"

Real Intent Launches Verix PhyCDC – the Next Innovation in SoC Design Sign-off

New Analysis Tool Brings Giga-Scale Capacity and Fastest Analysis to Gate-Level Designs

June 18, 2018

SUNNYVALE, CA– (June 18, 2018) – Real Intent, Inc., a leading provider of SoC and FPGA sign-off verification solutions, today announced Verix PhyCDC – a new tool … Read More → "Real Intent Launches Verix PhyCDC – the Next Innovation in SoC Design Sign-off"

Synopsys IC Validator Certified by Samsung Foundry for 7nm Signoff Physical Verification

IC Validator's Massively Parallel Architecture and Samsung Foundry's Runsets Accelerate Physical Signoff for Mutual Customers

June 15, 2018

MOUNTAIN VIEW, Calif., Jun 13, 2018 /PRNewswire/ —

Highlights:

IC Validator certified by Samsung Foundry for physical signoff for Samsung Foundry’s latest 7LPP process technology
Signoff-accurate 7LPP runsets are available for DRC, LVS and Fill
IC Validator’s modern distributed processing and scalability deliver overnight full-chip DRC signoff

Synopsys, Inc. (Nasdaq: SNPS) … Read More → "Synopsys IC Validator Certified by Samsung Foundry for 7nm Signoff Physical Verification"

Cloud-Based Simulation Provider Metrics Partners with T&VS to Accelerate Verification’s Move into the Cloud

T&VS Will Use Metrics Platform to Manage, Leverage Big Simulation Data, Shattering Barriers Restricting Simulation Capacity

June 15, 2018

OTTAWA, CANADA –– June 12, 2018 –– Metrics Technologies and Test and Verification Technologies (T&VS) today announced a long-term, far-reaching partnership to further adoption of the Metrics true cloud solution and accelerate verification’s move into the cloud.

Under terms of the agreement, T&VS will have access to the Metrics Open Platform to manage and leverage … Read More → "Cloud-Based Simulation Provider Metrics Partners with T&VS to Accelerate Verification’s Move into the Cloud"