News – Page 107 – EEJournal

An Efficient Self-Assembly Process for Advanced Self-Healing Materials

The novel method produces multilayered self-healing films with enhanced durability compared to conventional materials for coatings and flexible electronics

April 2, 2025

Self-healing coatings are advanced materials that can repair damage, such as scratches and cracks on their own. Researchers from Waseda University have developed an efficient method for preparing self-healing films consisting of alternating layers of highly cross-linked organosiloxane and linear polydimethylsiloxane (PDMS). Their film is more durable than conventional self-healing PDMS materials, offering superior hardness and greater thermal stability while self-healing at mild temperatures, paving the way for stronger, more reliable, and easier-maintained self-healing materials.

Polysiloxane materials, such as polydimethylsiloxane (PDMS)-based elastomers, exhibit a self-healing capability by the introduction of silanolate (Si– … Read More →

ALD’s Newest SAB MOSFET Reaches New Power Management Standard for Supercapacitors Rated at 3V or Higher

The ALD910030 array enables precise voltage and leakage current balancing, extending the reach to higher-voltage supercapacitors.

April 2, 2025

SUNNYVALE, Calif. – March 18, 2025 – Advanced Linear Devices Inc. (ALD), a design innovator in analog semiconductors, today announced its latest addition to its Supercapacitor Auto-Balancing (SAB™) MOSFET family. This dual MOSFET provides unmatched auto-balancing capabilities and power management for supercapacitors ranging from 2.8V to 3.3V. The ALD910030 uses virtually no power for cell balancing and prevents most catastrophic failures. The chip enhances performance across various sectors, including utility boxes, backup power systems, industrial applications, uninterruptible power supplies, renewable energy and consumer electronics.

Traditionally, widely used supercapacitors had a voltage rating of 2.7V … Read More → "ALD’s Newest SAB MOSFET Reaches New Power Management Standard for Supercapacitors Rated at 3V or Higher"

DustPhotonics Expands Silicon Photonics Portfolio with 2xFR4 Products for AI and Hyperscale Data Centers

Tamar Product Family Includes Industry’s First Merchant 1.6T-2xFR4 and 800G-2xFR4 Products with Integrated Optical Multiplexer

April 1, 2025

MODI’IN, ISRAEL – 1 April , 2025 – DustPhotonics, a leading developer of silicon photonics solutions, today announced Tamar200 and Tamar, two … Read More →

Same Sky’s New Piezo Elements Feature Low Profiles Down to 0.12 mm

April 1, 2025

LAKE OSWEGO, Ore. — April 1, 2025 — Same Sky’s Audio Group today announced the continued expansion of … Read More →

New at Mouser: Microchip Technology’s PIC16F13145 Microcontroller with the Configurable Logic Block

April 1, 2025

April 1, 2025 – Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is now stocking the PIC16F13145 family of microcontrollers from Microchip Technology.

Pixus and COMINT Consulting Collaborate to Enhance Ruggedized Emerson/NI SDRs

New Signal Decoding Software Option Boosts Capabilities

April 1, 2025

Waterloo, Ontario — Apr 1, 2025 – Pixus Technologies, a provider of embedded computing and enclosure solutions, offers Emerson (Ettus Research brand) USRP Software Defined Radios (SDRs) in ruggedized versions. COMINT Consulting provides superior signal decoding and analysis software/firmware for SIGINT & COMINT. The combined solution provides tailored waveform monitoring/control options for a wide range of applications.

The Pixus-ruggedized Emerson SDRs in the RX310 and RX410 versions are ideal for Electronic Warfare, SIGINT, COMINT, and other applications. Working seamlessly with the Krypto1000 VHF-SHF and satellite software suite, the SDRs can perform all of the functions of the … Read More →

Renesas Introduces Highly Integrated LCD Video Processor that Enables Next-Generation ASIL B Automotive Display Systems

RAA278830 LVDS Solution Adds ISO 26262 Compliance to Renesas’ Industry-Leading Video Diagnostic Capabilities

March 31, 2025

TOKYO, Japan, March 27, 2025 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the RAA278830 Video Diagnostics Bridge IC, a highly integrated dual Low-Voltage Differential Signal (LVDS) LCD video processor. The new IC integrates many of the features necessary to design ISO 26262-compliant ASIL B automotive display systems such as heads-up-displays (HUD), digital instrument clusters, camera monitor systems (CMS), and electronic mirrors.

As automotive safety systems are increasingly dependent on display systems, it has become more critical that clear, uncorrupted images be presented to the driver. Missing frames, frozen images, and even … Read More →

Marvell Demonstrates Industry’s First End-to-end PCIe Gen 6 Over Optics for Accelerated Infrastructure at OFC 2025

Protocol-level PCIe Gen 6 Over 10m Optical Cable and PCIe Gen 7 SerDes Over Optics in Collaboration with TeraHop for AI Server Scale Up

March 31, 2025

SANTA CLARA, Calif., March 27, 2025 — Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced in collaboration with TeraHop, a global optical solutions provider for AI driven data centers, the demonstration of the industry’s first end-to-end PCIe Gen 6 over optics in the Marvell booth #2129 at OFC 2025. The demonstration will showcase the extension of PCIe reach beyond traditional electrical limits to enable low-latency, standards-based AI … Read More → "Marvell Demonstrates Industry’s First End-to-end PCIe Gen 6 Over Optics for Accelerated Infrastructure at OFC 2025"

Lanner Unveils Rugged Edge AI Computers at NVIDIA GTC 2025, Powered by NVIDIA Jetson AGX Orin

March 31, 2025

Lanner Electronics, a global leader in network computing appliance and industrial AI computers, will officially unveil its latest innovation, the EAI-I233 and EAI-I251 industrial-grade Edge AI computers, at NVIDIA GTC 2025.

EAI-I233: Compact Yet Powerful AI Inference System

The EAI-I233 features a compact design and is powered by the NVIDIA Jetson AGX Orin SOM, offering up to 64GB LPDDR5 memory and 2048 CUDA® cores for exceptional AI performance. With versatile connectivity options, including 1x GbE RJ45, 1x 10GbE RJ45, 1x 2.5GbE RJ45, 4x USB 3.2, 2 … Read More → "Lanner Unveils Rugged Edge AI Computers at NVIDIA GTC 2025, Powered by NVIDIA Jetson AGX Orin"

Silynxcom to Co-Develop Advanced Augmented Reality Communication Solutions for the Aerospace Market

Silynxcom enters non-binding memorandum of understanding to examine integrating its tactical communications expertise with augmented reality technology to address emerging aerospace industry needs

March 31, 2025

Netanya, Israel, March 28, 2025 (GLOBE NEWSWIRE) — Silynxcom Ltd. (NYSE American: SYNX) (“Silynxcom” or the “Company”), a manufacturer and developer of ruggedized tactical communication headset devices, today announced that it has signed a non-binding memorandum of understanding (the “MOU”) with an augmented reality software development company to explore the joint development of innovative communication solutions for the aerospace market.

The MOU establishes a framework for the companies to collaborate on the development of next-generation products that would integrate Silynxcom’s advanced in-ear headset technology with augmented reality capabilities specifically designed for aerospace applications.

“This is an exciting … Read More → "Silynxcom to Co-Develop Advanced Augmented Reality Communication Solutions for the Aerospace Market"