News – Page 1031 – EEJournal

New Alliance Memory High-Speed CMOS PSRAMs Offer Densities From 8Mb to 128Mb in 48-Ball and 49-Ball FPBGA Packages

Devices Provide Cost-Effective, Easy-to-Use Solutions for High-Bandwidth, Low-Power Applications

October 24, 2018

SAN CARLOS, Calif. — Oct. 24, 2018 — Alliance Memory today introduced a new family of high-speed CMOS pseudo SRAMs (PSRAMs) with densities from 8Mb to 128Mb in 6.0 mm x 7.0 mm x 1.0 mm 48-ball FPBGA and 4.0 mm by 4.0 mm by 1.0 mm 49-ball FPBGA packages. The devices combine the most desirable features of SRAMs and DRAMs to provide designers with easy-to-use, low-power, and cost-effective memory solutions for wireless, automotive, networking, and industrial applications.

Featuring high-density DRAM cores with SRAM interfaces and on-chip refresh circuits for refresh-free operation, the devices released today provide the high bandwidth and the low power necessary to replace … Read More → "New Alliance Memory High-Speed CMOS PSRAMs Offer Densities From 8Mb to 128Mb in 48-Ball and 49-Ball FPBGA Packages"

OneSpin Puts Verification on the Move with New PortableCoverage Solution

Enables Integration of Formal Results, Coverage with any Simulator or Verification Planning Tool

October 23, 2018

MUNICH and SAN JOSE, CALIF. –– October 23, 2018 –– OneSpin® Solutions today announced PortableCoverage™, the first formal verification solution to integrate with all major simulators, coverage databases and viewers, and chip design verification planning tools, enabling users to choose the vendor or multiple vendors of their choice.

“Simulation and formal verification are essential to our chip design verification strategy,” says Thomas Klotz, verification expert at Bosch Sensortec. “We need to continually assess overall verification progress in order to determine next steps and … Read More → "OneSpin Puts Verification on the Move with New PortableCoverage Solution"

Synopsys Custom Design Platform Delivers Breakthrough Analog Simulation and Fusion Technologies

3X Faster Analog Simulation and New Fusion Technologies Accelerate AMS Design

October 23, 2018

MOUNTAIN VIEW, Calif., Oct. 23, 2018 /PRNewswire/ —

Highlights:

FineSim SPICE 2018.09 delivers 3X faster runtime for analog circuits, adds RF analysis features
Custom Compiler’s Extraction Fusion with StarRC provides early parasitics for accurate pre-layout simulation
Custom Compiler’s DRC Fusion with IC Validator reduces late-cycle iterations with live DRC checking

Tektronix Redefines the Arbitrary/Function Generator

New AFG31000 Series is Packed with Innovation to Delight Engineers and Researchers Who Need to Generate Test Signals Quickly and Easily

October 23, 2018

Hands-on Demonstrations Available at Electronica 2018
BEAVERTON, Ore., Oct. 23, 2018 — Tektronix, Inc., a leading worldwide provider of measurement solutions, today announced that it has redefined the arbitrary/function generator (AFG) with the introduction of the AFG31000 series<Read More → "Tektronix Redefines the Arbitrary/Function Generator"

Cadence Custom/AMS Flow Certified on Samsung 7LPP Process Technology

October 23, 2018

SAN JOSE, Calif., October 23, 2018—Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that its custom and analog/mixed-signal (AMS) IC design tools have achieved certification for Samsung Foundry’s 7nm Low Power Plus (7LPP) process technology. This certification ensures Cadence and Samsung Foundry mutual customers of a highly automated circuit design, layout, signoff and verification flow with full extreme ultraviolet lithography (EUV) support. This certification complements the earlier announced certification ( Read More → "Cadence Custom/AMS Flow Certified on Samsung 7LPP Process Technology"

Resonant Releases Details of its Breakthrough XBAR Resonator Technology for 5G Mobile Devices

October 23, 2018

GOLETA, CA – October 23, 2018 – Resonant Inc. (NASDAQ: RESN), a leader in transforming the way radio frequency, or RF, front-ends are being designed and delivered for wireless devices, today released more details about its breakthrough resonator technology that holds the potential for a new class of high-performance RF filters for 5G devices.

The new discovery is important because resonators form the building blocks for RF filters and define much of the performance achievable in a filter. Resonant’s XBAR is a new bulk acoustic wave (BAW) structure that can be produced in silicon using standard … Read More → "Resonant Releases Details of its Breakthrough XBAR Resonator Technology for 5G Mobile Devices"

STMicroelectronics Launches Ultra-Low-Power Sigfox Monarch-Ready Solution for Industrial Asset Management, Enabling Seamless IoT Worldwide Connectivity

October 22, 2018

Industry’s first hardware- and software-certified reference design enabling Sigfox Monarch service, based on ST’s S2-LP sub-1GHz radio with STM32 MCU or BlueNRG SoC
Ready-to-go solution for remote monitoring and asset-tracking devices featuring global inter-regional Sigfox geolocation capability
The S2-LP based long-range and ultra-low-power connectivity extends ST portfolio for the industrial IoT market

Geneva, October 22, 2018 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, is the first chip maker to develop and market a … Read More →

Wind River and TTTech Auto Collaborate to Advance Autonomous Driving Applications

October 22, 2018

ALAMEDA, CA – Oct. 22, 2018 – Wind River®, a leader in delivering IoT software for safety-critical domains including automotive, announced that it has provided its VxWorks (http://www.windriver.com/products/vxworks/?utm_source=PR&utm_campaign=Automotive-ADAS-ADAR-Autonomous-2018) real-time operating system to power the … Read More → "Wind River and TTTech Auto Collaborate to Advance Autonomous Driving Applications"

Credit Card Sized HMI Development Hardware

October 22, 2018

22nd October 2018 – Coinciding with the BT815 and BT816 advanced graphics controller ICs being ramped up into volume production, Bridgetek has introduced a series of accompanying entry-level development modules. Supporting a range of different display configurations, the compact (54.1mm x 85.60mm) VM816C modules each feature a BT816 device. Through these items, engineers will be able to utilise the functionality offered by the latest generation of Bridgetek’s proprietary Embedded Video Engine (EVE) technology and apply it to their human machine interface (HMI) designs. In particular, they will benefit from the BT816’s adaptive scalable texture compression (ASTC) capabilities – which … Read More → "Credit Card Sized HMI Development Hardware"

Silicon Labs Accelerates Low-Power Cellular IoT Applications with LTE-M Solution

New Jointly Developed Kit Delivers LPWAN Connectivity with Digi XBee Pre-Certified Modem and Silicon Labs Gecko Microcontrollers

October 22, 2018

AUSTIN, Texas – Oct. 22, 2018 – Silicon Labs (NASDAQ: SLAB) delivers ultra-low-power, long-range wireless connectivity to battery-powered IoT devices with a new LTE-M expansion kit featuring Digi International’s Digi XBee3™ pre-certified cellular modem. ( https://www.digi.com/products/xbee-rf-solutions/embedded-cellular-modems/xbee3-cellular-lte-m-nb-iot ) The LTE-M expansion kit works with Silicon Labs’ EFM32 … Read More → "Silicon Labs Accelerates Low-Power Cellular IoT Applications with LTE-M Solution"