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New Series of STM32 Microcontrollers from STMicroelectronics Kick-Starts Advanced Innovations for Even Smaller, More Capable, and Power-Efficient Smart Objects

  • Lower power consumption and large memory density in low-pin-count packages create compact efficient platform for smart connected objects
  • Robust new Arm® Cortex®-M0+ series with simplified power connection, superior EMS protection, and class-leading hardware-based security
  • Enhancements to peripherals, plus support for USB Type-C and Power Delivery

Geneva, December 4, 2018 – By adding the new STM32G0 microcontrollers (MCUs) to the STM32* family, STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, is stretching the portfolio of top Arm® Cortex®-M-core MCUs to more thoroughly cover key embedded-market … Read More → "New Series of STM32 Microcontrollers from STMicroelectronics Kick-Starts Advanced Innovations for Even Smaller, More Capable, and Power-Efficient Smart Objects"

More processing power for connected aircrafts, in-flight infotainment and augmented reality in aviation

San Diego, CA,  December 4, 2018  * * *  congatec – a leading vendor of standardized and customized embedded computer boards and modules – showcases its new modular airborne computing platforms for connected aircrafts, passenger infotainment, and augmented reality applications at Aeromart Toulouse (hall 6, stand B24-C25). Designed for converged edge servers in aircrafts, the new COM Express Type 7 Server-on-Modules are a perfect fit for content delivery applications to seatback screens and passengers’ mobile devices, as well as for predictive maintenance and other Big Data applications, video surveillance, and cloud based flight data recordings. The platforms are also ideal for augmented reality applications in … Read More → "More processing power for connected aircrafts, in-flight infotainment and augmented reality in aviation"

Industry’s First RISC-V SoC FPGA Architecture Brings Real-Time to Linux, Giving Developers the Freedom to Innovate in Low-Power, Secure and Reliable Designs

RISC-V Summit, SANTA CLARA, Calif.—Dec. 4, 2018—In a new era of computing driven by the convergence of 5G, machine learning and the internet of things (IoT), embedded developers need the richness of Linux-based operating systems. These must meet deterministic system requirements in ever lower power, thermally constrained design environments—all while addressing critical security and reliability requirements. Traditional system-on-chip (SoC) field programmable gate arrays (FPGAs) blending reconfigurable hardware with Linux-capable processing on a single chip provide developers ideal devices for customization, yet consume too much power, lack proven levels of security and reliability, or use inflexible and … Read More → "Industry’s First RISC-V SoC FPGA Architecture Brings Real-Time to Linux, Giving Developers the Freedom to Innovate in Low-Power, Secure and Reliable Designs"

Microchip Teams Up with Electromaker.io To Give Away 100 AVR-IoT WG Development boards

Poole, United Kingdom, 4th December 2018  – Electromaker.io, the online electronics maker community, today announced a project-based competition for hobbyists with 100 Microchip AVR-IoT WG Development boards ( https://www.electromaker.io/contest/microchip-iot )  as prizes, Entrants will also win the chance to compete for a place at the 2019 Microchip Masters conference in Berlin.

The AVR-IoT WG development board, designed for … Read More → "Microchip Teams Up with Electromaker.io To Give Away 100 AVR-IoT WG Development boards"

Zeno Demonstrates Scalability of World’s Smallest SRAM Bitcell Technology to FinFET Technology Node at IEDM Conference

Sunnyvale, CA, December 5, 2018 – Zeno Semiconductor, a Silicon Catalyst Portfolio Company, demonstrated the scalability of its novel 1-transistor/2-transistor Bi-SRAM (bi-stable, intrinsic bipolar) memory technology to FinFET technology node at the IEDM Conference. The results from 14nm and 16nm FinFET technology nodes from multiple foundries follow previous implementation of Bi-SRAM technology in 28nm technology node.

Zeno’s 1-transistor/2-transistor Bi-SRAM uses a single transistor as the memory bitcell and is therefore 3x-5x smaller than conventional SRAMs which use 6-transistor bitcells (6T-SRAM). Another key disclosure is that the Bi-SRAM technology can … Read More → "Zeno Demonstrates Scalability of World’s Smallest SRAM Bitcell Technology to FinFET Technology Node at IEDM Conference"

Imec Improves Performance and Understanding of Stacked Nanowire Gate-All-Around Transistors for N3 and Beyond

SAN FRANCISCO (USA), DECEMBER 3, 2018 At this week’s 2018 IEEE International Electron Devices Meeting (IEDM), imec, the world-leading research and innovation hub in nano-electronics and digital technology, reports significant progress in process enabling the introduction of gate-all-around (GAA) transistors with vertically stacked nanowires and nanosheets for the N3 technology node. Results include improved Si GAA devices, better understanding of strain engineering in Ge nanowire pFETs, and a comprehensive understanding of reliability and degradation mechanisms of nanowire FETs.

GAA MOSFETs are promising candidates to extend the gate length … Read More → "Imec Improves Performance and Understanding of Stacked Nanowire Gate-All-Around Transistors for N3 and Beyond"

Newark element14 Offers the Ultimate Holiday Gifts for Engineers and Makers of All Ages

Chicago, November 27, 2018: Newark element14, the Development Distributor, is making it easy to find the perfect gift for even the hardest to shop for engineer this holiday season. Featuring more than 30 unique products, Newark element14’s Holiday Gift Guide includes a range of developer kits and other tools for engineers of all ages and abilities, from those with decades of experience to those just starting out.

< … Read More → "Newark element14 Offers the Ultimate Holiday Gifts for Engineers and Makers of All Ages"

Imec Demonstrates the Feasibility of Introducing SST-MRAM as a Last-Level Cache at the 5nm Technology Node

SAN FRANCISCO (USA), DECEMBER 3 , 2018 — This week, at the 2018 IEEE International Electron Devices Meeting (IEDM), imec, the world-leading research and innovation hub in nanoelectronics and digital technologies, presents the first power-performance-area comparison between SRAM- and SST-MRAM-based last-level caches at the 5nm node. The analysis, based on design-technology co-optimization and silicon verified models, reveals that STT-MRAM meets the performance requirements for last-level caches in the high-performance computing domain. Moreover, for larger memory densities, significant energy gains are found for SST-MRAM compared to SRAM.  

The increased complexity of … Read More → "Imec Demonstrates the Feasibility of Introducing SST-MRAM as a Last-Level Cache at the 5nm Technology Node"

IAR Systems and SiFive partner to meet customers’ demands for professional solutions for RISC-V

RISC-V Summit, Santa Clara, California—December 3, 2018—IAR Systems®, the future-proof supplier of software tools and services for embedded development, and SiFive, the leading provider of commercial RISC-V processor IP, announce that they have formed a partnership in order to deliver increased possibilities for powerful RISC-V implementations with compact code and high performance.

The RISC-V technology and ecosystem are evolving rapidly. With the rapid growth, the need for professional development tools is increasing. IAR Systems and SiFive are responding to this need with an increased collaboration to bring IAR Systems’ leading compiler and debugger technology to users of … Read More → "IAR Systems and SiFive partner to meet customers’ demands for professional solutions for RISC-V"

Smallest data converters deliver high integration and performance

DALLAS (Dec. 3, 2018) – Texas Instruments (TI) (NASDAQ: TXN) today introduced four tiny precision data converters, each the industry’s smallest in its class. The new data converters enable designers to add more intelligence and functionality, while shrinking system board space. The DAC80508 and DAC70508 are eight-channel precision digital-to-analog converters (DACs) that provide true 16- and 14-bit resolution, respectively. The ADS122C04 and ADS122U04 are 24-bit precision analog-to-digital converters (ADCs) that feature a two-wire, I2C-compatible interface and a two-wire, UART-compatible interface, respectively.

These new devices join a portfolio of precision ADCs and DACs optimized for a variety … Read More → "Smallest data converters deliver high integration and performance"

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