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Qualcomm and Green Hills Software Team Up to Deliver Advanced Platforms for Next-Generation Automotive Cockpits

Companies Offer High Performance Solutions to Support Safe and Secure Consolidation of Android and Linux-based Infotainment with Safety-Critical Applications
January 9, 2019

LAS VEGAS, NV — January 8, 2019 –– CES 2019 — Green Hills Software, the worldwide leader in embedded safety and security, and Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated (NASDAQ: QCOM), announced today their efforts to support global automakers and Tier-1 suppliers with purpose-built, scalable solutions, designed to support a safe, secure consolidation of Android and Linux-based infotainment processing with critical ASIL-certified vehicle services into a single multicore-based electronic control unit (ECU). As a part of the relationship, Green Hills is working with Qualcomm Technologies to feature the Read More → "Qualcomm and Green Hills Software Team Up to Deliver Advanced Platforms for Next-Generation Automotive Cockpits"

BrainChip Partners with SoftCryptum to Deliver AI-powered Video Analytics to Government Agencies in European Countries

January 9, 2019

San Francisco – 8 January 2019 BrainChip Holdings Ltd (“BrainChip” or the “Company”) (ASX:BRN), a leading developer of software and hardware accelerated solutions for advanced artificial intelligence (AI) and machine learning applications, has signed a strategic partnership agreement with SoftCryptum to sell BrainChip’s AI-powered video analytics solutions to government agencies in France, Belgium, and Switzerland.

SoftCryptum sells security and data analytical solutions around the world, particularly to government agencies that require video and image content analysis tools for CCTV footage. Often recorded in low resolution, the recordings from such video surveillance systems are ideally suited to analysis using … Read More → "BrainChip Partners with SoftCryptum to Deliver AI-powered Video Analytics to Government Agencies in European Countries"

RS Components introduces new version of entry-level Arduino Uno WiFi board for IoT projects

Arduino Uno WiFi Rev2 prototyping board packs more processing punch and adds security for wireless communications
January 9, 2019

LONDON, UK, 8 January, 2019 – RS Components (RS), the trading brand of Electrocomponents plc (LSE:ECM), a global multi-channel distributor, has announced availability of a new Arduino board that comes with WiFi wireless networking capability and more processing power than previously available, by integrating a new 8-bit microprocessor from Microchip.

This second version – Rev2 – of the highly popular Arduino Uno WiFi board (Read More → "RS Components introduces new version of entry-level Arduino Uno WiFi board for IoT projects"

STMicroelectronics and Arilou Collaborate To Detect Automotive Hacking

January 9, 2019
Las Vegas, January 8, 2019 – Arilou Information Security Technologies, a supplier of high-end cyber security solutions for the automotive industry, part of NNG Group, and STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications,are working together on the integration of Arilou’s Intrusion Detection and Prevention system (IDPS) Software solution into ST’s SPC58 Chorus series of 32-bit automotive microcontrollers (MCUs). The companies will share a demonstration of their efforts in a private suite at CES 2019, Jan 8-10 in Las Vegas.

ams introduces world’s smallest 1D time-of-flight sensor for accurate proximity sensing and distance measurement in smartphones

New TMF8701’s attributes include excellent smudge and dirt rejection, high immunity to interference from ambient light, and tightly-controlled field of view
January 9, 2019

Premstaetten, Austria ( 08 January, 2019) — ams (SIX: AMS), a leading worldwide supplier of high performance sensor solutions, introduces the world’s smallest integrated 1D time-of-flight distance measurement and proximity sensing module.

The sensor is ideal for implementing presence detection, for example to trigger the operation of a facial recognition system when the user’s face is in range. Supplied in a 2.2mm x 3.6mm x 1.0mm package, the new TMF8701 sensor fits in a narrow bezel, helping smartphone manufacturers to realize widescreen phone designs that have a high display screen to body ratio.

Read More → "ams introduces world’s smallest 1D time-of-flight sensor for accurate proximity sensing and distance measurement in smartphones"

New at CES: Antenova’s design for a small On-Board Device integrates LTE CatM1 in a Blade Antenna for OBDII units

January 9, 2019

8th January 2019, Hatfield, UK:-  Antenova, manufacturer of antennas and RF antenna modules for M2M and the Internet of Things, has chosen CES 2019 to reveal a new blade antenna and its latest reference design for a small but high performing On Board Device (OBDII). Antenova has developed the blade antenna for LTE Cat M1. LTE Cat M1 is an IoT-friendly version of LTE that provides enough bandwidth for data communication whilst maintaining a long battery life.

The blade antenna, part no SR4G055 measures 41.0 x 22.0 x0.9mm and … Read More → "New at CES: Antenova’s design for a small On-Board Device integrates LTE CatM1 in a Blade Antenna for OBDII units"

United Nations commission to integrate ISA standards into cybersecurity regulatory framework

January 9, 2019

Research Triangle Park, North Carolina USA, Jan. 08, 2019 (GLOBE NEWSWIRE) — The United Nations Economic Commission for Europe (UNECE) has confirmed it will integrate the widely used ISA/IEC 62443 series of standards into its forthcoming Common Regulatory Framework on Cybersecurity (CRF). The CRF will serve as an official UN policy position statement for Europe.

At its recent annual meeting in Geneva, UNECE’s Working Party on Regulatory Cooperation and Standardization Policies recognized the ISA99 standards development committee for its leading role in conceiving and developing the widely used standards, while formally accepting review input presented on behalf of ISA99 … Read More → "United Nations commission to integrate ISA standards into cybersecurity regulatory framework"

Introducing Digi WR54: Reliable, High-Speed Continuous Connectivity for Transportation and Industrial Markets

Cellular Router Unlocks Increasing Speed Capabilities of Cellular Networks for Mission Critical Applications in Demanding Environments
January 9, 2019

MINNETONKA, Minn., January 8, 2019 – Digi International®, (NASDAQ: DGII, www.digi.com), a leading global provider of Internet of Things (IoT) connectivity products and services, today unveiled the Digi® WR54, an extremely reliable, secure, high-performance wireless router for complex mobile and industrial environments.

With dual cellular interfaces, Digi WR54 provides immediate carrier failover for near-constant uptime and continuous connectivity, especially as vehicles move throughout a … Read More → "Introducing Digi WR54: Reliable, High-Speed Continuous Connectivity for Transportation and Industrial Markets"

Optek Selects Cadence Tensilica HiFi 3 DSP for Bluetooth 5.0 Dual-Mode Audio/Voice SoC

January 9, 2019

SAN JOSE, Calif., 08 Jan 2019

Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that Optek, a fabless semiconductor company delivering multimedia audio products, has selected the Cadence® Tensilica® HiFi 3 DSP for its latest OTK528X Bluetooth 5.0 dual-mode audio/voice system on chip (SoC). Optek’s customers can take advantage of the HiFi DSP ecosystem for optimized audio, voice and artificial intelligence (AI) speech-based recognition processing software utilized in applications including hearables, wireless speakers, soundbars, on/in ear headphones, multi-channel AVRs, musical instruments, … Read More → "Optek Selects Cadence Tensilica HiFi 3 DSP for Bluetooth 5.0 Dual-Mode Audio/Voice SoC"

Maxim’s Buck Converters and Controllers Deliver Smallest, Most Efficient High-Voltage Automotive Power Solutions

MAX20004/6/8, MAX20034 and MAX20098 offer low quiescent current, improved noise performance and EMI mitigation for digital instrument clusters and radio head units
January 9, 2019

SAN JOSE, Calif. and LAS VEGAS, Nev.—Jan. 8, 2019—Maxim Integrated Products, Inc. (NASDAQ: MXIM) today announced power-management ICs offering the industry’s smallest solution size and highest efficiency to help automotive designers meet space and power challenges of next-generation automotive applications. As digital instrument clusters, radio head units and electronic subsystems require ever higher levels of compute power, these new high-power buck converters and high-power, multiphase buck controllers empower designers to balance low power consumption with high efficiency and electromagnetic interference (EMI) mitigation.

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