EEJournal

industry news archive
Subscribe Now

SEGGER announces web browser file access for Flashers

SEGGER’s file browser is now available for use with all products in the Flasher family of high-speed in-system programmers.
March 2, 2026

Monheim am Rhein, Germany — March 2, 2026 – Using a simple web browser, on any platform, users can view and manage (create, delete, upload, and download) all files and folders on a Flasher. Users have direct access to a Flasher’s internal file system through a web interface, even without an Ethernet connection. This access is non-intrusive, meaning users can also update a Flasher, without, for example, rebooting into File Access Mode. All that is required is a web browser.

“File system interaction with all Flasher products … Read More → "SEGGER announces web browser file access for Flashers"

Shimadzu Introduces the TOC-1000e S On-Line Analyzer for Ultrapure Water Monitoring in Semiconductor Manufacturing

March 2, 2026

COLUMBIA, Md. (March 2, 2026) — Shimadzu Scientific Instruments introduces the TOC-1000e S on-line total organic carbon (TOC) analyzer, engineered to meet the increasingly stringent ultrapure water quality requirements of advanced semiconductor manufacturing. As semiconductor miniaturization continues to advance, even trace-level organic contamination in ultrapure water can directly impact process stability and yield, making precise, reliable monitoring of TOC essential. Conventional on-line TOC analyzers often struggle to detect hard-to-oxidize compounds such as urea, which can persist after purification and compromise fabrication processes. Developed with direct input from leading semiconductor manufacturers, the TOC-1000e S analyzer addresses these challenges by delivering … Read More → "Shimadzu Introduces the TOC-1000e S On-Line Analyzer for Ultrapure Water Monitoring in Semiconductor Manufacturing"

Imec unlocks lever for EUV dose reduction: oxygen injection during metal-oxide resist post-exposure bake emerges as game-changer for throughput

The findings reveal that controlling gas composition, especially oxygen levels, during critical lithography steps dramatically optimizes metal-oxide resist performance for next-generation, high-throughput EUV patterning.
February 27, 2026

[SUMMARY]

ASRock Industrial’s Secure Edge AIoT Solutions Take Center Stage at Embedded World 2026

February 27, 2026

Taipei, Taiwan (February 25, 2026) – ASRock Industrial is pleased to announce its participation in Embedded World 2026, taking place from March 10th to March 12th, 2026, at the Exhibition Centre Nuremberg, Hall2 Booth 2-441. At the event, the company will debut its comprehensive secure edge AI platform, built on IEC 62443-4-1 and 4-2 certified secure development processes to help customers accelerate EU Cybersecurity Resilience Act (CRA) readiness. The end-to-end approach secures the entire product lifecycles from device level (Industrial Robust Edge AIoT Platforms, Embedded Computer Systems, and Industrial Motherboards) to deployment (via FDO-based Ai FDO) and on-going operation ( … Read More → "ASRock Industrial’s Secure Edge AIoT Solutions Take Center Stage at Embedded World 2026"

Innodisk Launches CXL Add-In Card for Scalable Edge AI Memory Expansion

The new CXL 2.0 Type 3 expansion card delivers flexible DDR5 memory scaling via PCIe Gen 5, addressing latency and space constraints in edge and micro data center environments.
February 26, 2026
Innodisk, a leading provider of industrial-grade memory solutions, announced the CXL Add-in Card (AIC), a major addition to its CXL product portfolio. Innodisk developed this CXL-based expansion card in response to rising memory demands in next-generation computing and the limited scalability of current motherboard designs. Connecting via the widespread and mature PCIe interface, the CXL AIC delivers fast memory access without occupying system DIMM slots. It also provides greater flexibility in memory usage and allocation. Its HHHL form factor, paired with Innodisk’s compact DDR5 RDIMM/RDIMM VLP, unlocks new possibilities for micro data centers and edge systems, especially … Read More → "Innodisk Launches CXL Add-In Card for Scalable Edge AI Memory Expansion"

Sequans Demonstrates Market Leadership with Breakthrough 5G eRedCap and RF Technologies at MWC 2026

February 26, 2026

Paris, France–(Newsfile Corp. – February 25, 2026) – Sequans Communications S.A. (NYSE: SQNS), a pioneer in cellular IoT solutions, will showcase its newest innovations at Mobile World Congress 2026 in Barcelona (March 2-5), Hall 5, Stand 5D81. The company will highlight:

Salience Labs and Tower Semiconductor Partner to Manufacture At-Scale Optical Circuit Switches for Next-Generation Data Centers

Salience Lab’s Innovative Architecture leverages Tower’s differentiated Silicon Photonics platforms to deliver ultra-low latency, high-bandwidth and lower-power optical connectivity for AI clusters
February 26, 2026
MIGDAL HAEMEK, Israel, and OXFORD, England, February 25, 2026 — Tower Semiconductor, the leading foundry of high-value analog semiconductor solutions, and < … Read More → "Salience Labs and Tower Semiconductor Partner to Manufacture At-Scale Optical Circuit Switches for Next-Generation Data Centers"

Kioxia Sampling UFS 5.0 Embedded Flash Memory Devices for Next-Generation Mobile Applications

Enhanced Interface Speed Enables High-Performance On-Device AI Features in Smartphones
February 26, 2026

SAN JOSE, Calif., February 23, 2026 – KIOXIA America, Inc. today announced that it has begun shipping evaluation samples1 of embedded flash memory compatible with the next-generation UFS standard, UFS 5.0, which is currently being standardized by JEDEC®2.

UFS 5.0 is a new standard for embedded flash storage designed to meet the performance requirements of next-generation mobile devices such as high-end smartphones equipped with on-device AI functions. It utilizes MIPI® M-PHY® version 6.0 for the physical layer and UniPro® version 3.0 for the protocol. M-PHY … Read More → "Kioxia Sampling UFS 5.0 Embedded Flash Memory Devices for Next-Generation Mobile Applications"

Samtec Interconnects Selected for VITA 90 VNX+

Samtec interconnects selected to improve signal integrity and reduce SWaP of evolving VITA standards requiring miniaturization and functionality advancements.
February 25, 2026

VITA™ 90 VNX+™ is a new rugged, high-performance small-form-factor standard recently ratified by ANSI and VITA for addressing the robust embedded computing requirements of UAVs, UUVs, missiles, satellites, and cube satellites commonly deployed in industrial, military and aerospace applications. Samtec’s rugged high-density, high-performance interconnects and alignment products were selected for the VITA 90 standard for use on both the plug-in module (PIM) and the backplane enabling a SWaP alternative to 3U OpenVPX. VNX+ modules are a fraction of the size of existing OpenVPX modules.

Suitable for rugged, high reliability system applications, VITA 90 VNX+ adheres … Read More → "Samtec Interconnects Selected for VITA 90 VNX+"

featured blogs
Dust in the Digital Wind
Mar 9, 2026
What happens to our digital history when the world's biggest archive of retro video games disappears?...
More from Max's Cool Beans...