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Sixfab’s ALPON™ X5 AI Wins CES® 2026 Best of Innovation Award, Advancing Real-Time Physical AI at the Edge

January 6, 2026

DALLAS–FORT WORTH, Texas | January 6, 2026 — Sixfab announced that its ALPON X5 AI has been named a CES 2026 Best of Innovation Award winner in the Enterprise Tech category. The award, presented by the Consumer Technology Association (CTA), recognizes Sixfab’s execution in delivering deployment-ready Physical AI systems that operate reliably, securely, and scalably at the edge.

Selected from more than 3,600 global submissions, the ALPON X5 AI was recognized not only for enabling real-time Vision AI inference directly on-device, but also for delivering a complete, all-in-one edge AI platform that integrates hardware, embedded software, and cloud-based management, eliminating dependency … Read More → "Sixfab’s ALPON™ X5 AI Wins CES® 2026 Best of Innovation Award, Advancing Real-Time Physical AI at the Edge"

Synopsys Showcases Vision For AI-Driven, Software-Defined Automotive Engineering at CES 2026

Synopsys solutions accelerate innovation from systems to silicon, enabling more than 90% of the top 100 automotive suppliers to boost engineering productivity, predict system performance, and deliver safer, more sustainable mobility
January 6, 2026

Key Highlights

  • Synopsys will support the Fédération Internationale de l’Automobile (FIA), the global governing body for motorsport and the federation for mobility organizations worldwide, to enhance single-seater safety standards
  • Ansys AVxcelerate Sensors™ software now includes the Samsung ISOCELL Auto 1H1 automotive image sensor to simulate performance with high fidelity under real-life conditions
  • Synopsys Virtualizer™ Developer Kits for customers’ latest automotive SoCs enable system bring-up within days of silicon availability and accelerate vehicle time to market by up to 12 months

Read More → "Synopsys Showcases Vision For AI-Driven, Software-Defined Automotive Engineering at CES 2026"

Siemens unveils technologies to accelerate the industrial AI revolution at CES 2026

January 6, 2026
  • Siemens and NVIDIA expand their partnership to build the Industrial AI Operating System, reinventing the entire end-to-end industrial value chain through AI – from design and engineering to manufacturing, production, operations, and into supply chains
  • Siemens launches Digital Twin Composer software, available on Siemens Xcelerator Marketplace mid-2026, to power the industrial metaverse at scale
  • PepsiCo using Siemens Digital Twin Composer to simulate upgrades to its facilities in the U.S. with plans to scale globally
  • Siemens unveils nine industrial copilots to bring … Read More → "Siemens unveils technologies to accelerate the industrial AI revolution at CES 2026"

NXP’s New S32N7 Unlocks the Full Potential of SDVs

January 6, 2026
  • S32N7 processor series fully digitizes and centralizes core vehicle functions
  • OEMs can cut complexity and unlock AI-powered innovation fleetwide
  • Bosch is the first to deploy the S32N7 in its vehicle integration platform

Las Vegas, CES, January 5, 2026 – NXP Semiconductors N.V. (NASDAQ: NXPI) today  unveiled the S32N7 super-integration processor series, building on the same 5 nm  foundation as the S32N55, to enable a new era where carmakers can digitalize the  core functions of every vehicle – propulsion, vehicle dynamics, body, gateway and  … Read More → "NXP’s New S32N7 Unlocks the Full Potential of SDVs"

Silanna Semiconductor Adds Feature-Rich DSPs to Configurable Plural ADC Family

DSP integration in new 12- to 16-bit family of data converters reduces system load, improves SNR, and lowers system costs
January 6, 2026

SAN DIEGO, CA: January 5th, 2026 Silanna Semiconductor today announced it has integrated a feature-rich DSP into its Plural™ family of high-speed, low-power ADCs.

All Plural analog-to-digital converters have been designed using the company’s proprietary ResolutionEngine™ data converter core, which enables the devices to be factory configured to create each SKU from a standard die. This approach allows Silanna to access greater economies of scale and deliver lower-cost devices with more secure supply chains, shorter lead times and no need to end-of-life customer configurations.

The integration of … Read More → "Silanna Semiconductor Adds Feature-Rich DSPs to Configurable Plural ADC Family"

Hupside Introduces New Category, Original Intelligence, and Responds to AI-driven Homogenization with the First Measurable Metric of Human Originality

Company Launches National Original Intelligence Week and Debuts OIQ Challenge to Measure Originality in the Age of AI-driven homogenization
January 6, 2026

Las Vegas, NV, January 5, 2025 — Hupside, the only software company that measures and amplifies human originality, today announced the launch of a new category: Original Intelligence (OI), defining and measuring the human ability to generate ideas that go beyond AI’s homogenized outputs. To mark this milestone, Hupside is also launching National Original Intelligence Week, taking place January 5–9, and unveiling the public debut of the Read More → "Hupside Introduces New Category, Original Intelligence, and Responds to AI-driven Homogenization with the First Measurable Metric of Human Originality"

Precision sensing for the always-on era: Bosch Sensortec launches BMI423 IMU

Extended measurement range and low power consumption for wearables, hearables and robotics
January 6, 2026
  • Extended measurement range of ±32 g and ±4000 dps enables precise tracking of fast, dynamic motion
  • Voice Activity Detection (VAD) via bone conduction conserves power and enhances privacy
  • Low current consumption of only 25 µA for “always-on” acceleration-based applications in compact devices

Las Vegas, NV – Smart wearables are always on the move – and so is their sensing technology. At CES® 2026, Bosch Sensortec introduces the BMI423, a new-generation Inertial Measurement Unit (IMU) that combines extended measurement range with low power consumption. Designed for always-on applications such as wearables, hearables and robotics, … Read More → "Precision sensing for the always-on era: Bosch Sensortec launches BMI423 IMU"

Silicon Labs Accelerates the Future of Connected Intelligence at CES 2026

New Zephyr-optimized Simplicity SDK Streamlines RTOS Adoption for Next-Generation IoT
January 6, 2026

LAS VEGAS, Jan. 5, 2026 /PRNewswire/ — Silicon Labs (NASDAQ: SLAB), the leading innovator in low-power wireless, is showcasing a comprehensive portfolio of IoT advancements at CES 2026. Through live technical demonstrations, engineering-led presentations and key product introductions, the company is underscoring why developers worldwide rely on Silicon Labs to build secure, scalable, and energy-efficient connected devices.

At CES 2026, Silicon Labs is:

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