industry news
Subscribe Now

Baum Reveals Plans to Fully Optimize Energy Efficiency in Semiconductor Designs

Will Exhibit in Verific’s DAC Booth, Setting the Stage for Launch of High-Speed, Accurate Power Analysis and Modeling Solutions

DAEJEON, KOREA –– JUNE 7, 2017 –– Baum today announced its plans to provide electronic design automation (EDA) software and solutions that will enable engineering groups to fully optimize the energy efficiency of their semiconductor designs.

As the emerging power solutions expert, Baum will launch in September a state-of-the-art, high-speed and accurate power analysis and modeling solution initially targeting the automotive, internet of things (IoT), mobile, networking and server markets.

Baum representatives will be available to answer questions about its power analysis and modeling solution and give demonstrations from 1 p.m. until 3 p.m. daily in Verific’s Booth (#639) during the Design Automation Conference (DAC). DAC will be held June 19-21 at the Austin Convention Center in Austin, Texas. To schedule an appointment, contact Andy Ladd, Baum’s chief executive officer at: andy.ladd@baum-ds.com.

“Power modeling and analysis remain the most underdeveloped solutions in the design of SoCs,” says Ladd, who co-founded Baum with Youngsoo Shin and Joonhwan (Steve) Yi, who serve as chief technology officer and chief architect, respectively. “With the slowdown of Moore’s Law, engineers must add power-consuming complexity to their designs to achieve their performance goals, making energy efficiency even more critical.”

Engineers need a complete power solution instead of ad hoc tools with little or no automation. Abstract power models without a path to implementation or late-stage tools targeting the gate-level or later when change is difficult and costly aren’t effective either.

Baum’s fast, accurate power analysis and modeling solution will be used earlier in the design cycle when there is more opportunity to optimize power and gain better energy efficiency. Engineering groups will use it for hardware/software co-design to optimize designs for low-power consumption, and power and thermal management. It will support dynamic and static power, taking in register transfer level (RTL) and netlist descriptions of the design.

Telechips of Seoul, Korea, is an early Baum partner and a supplier of automotive entertainment systems and consumer electronics. “Baum was instrumental in identifying and fixing several power issues in our new design,” remarks Moon-Soo Kim, vice president of engineering at Telechips. “Having a solution that achieves both the speed necessary to run a variety of realistic scenarios combined with providing a very high level of accuracy allowed us to uncover power problems quickly and identify where to make the fixes. Without Baum’s unique power analysis capabilities, we wouldn’t have been able to find and fix these issues causing our new product to consume too much power.”
More information about Baum’s power analysis and modeling solution availability will be announced in September.

About Baum

Baum provides electronic design automation (EDA) software and solutions that enable engineering groups in the automotive, internet of things (IoT), mobile, networking and server markets to fully optimize the energy efficiency of their semiconductor designs. Founded in 2016 by seasoned semiconductor professionals with technical, R&D and business development expertise, Baum is privately held and funded. Email: contacts@baum-ds.com Website: www.baum-ds.com

Leave a Reply

featured blogs
Feb 24, 2026
How a perfectly good Bosch HVAC system was undermined by preventable mistakes, and a thermostat interface that defies logic....

featured video

Cadence Chiplets Solutions | Helping you realize your chiplet ambitions

Sponsored by Cadence Design Systems

In this webinar, David Glasco, VP of Compute Solutions at Cadence, discusses how Cadence enables customers to transition from traditional monolithic SoC architectures to modular, scalable chiplet-based solutions, essential for meeting the growing demands of physical AI applications and high-performance computing.

Read eBook: Helping You Realize Your Chiplet Ambitions

featured chalk talk

The Han® Connector
Sponsored by Mouser Electronics and HARTING
In this episode of Chalk Talk, Emily Kenny from HARTING and Amelia Dalton investigate the details of the HARTING Han® connector family. They also explore the trends in connector solutions today, the variety of options within this connector family and how you can get started using a HARTING Han® connector for your next design!
Feb 18, 2026
9,786 views