LIVERMORE, Calif. — June 18, 2013— FormFactor Inc. (Nasdaq: FORM) announced today that it has shipped multiple units of Apollo^TM MF100 probe cards to two leading semiconductor foundries.   Following an extensive engineering evaluation, the foundries selected the Apollo^TM MF100 to test advanced 28nm System-on-Chip products, utilizing copper pillar packaging technology, in volume production.

The transition to copper pillars is happening fast as semiconductor manufacturers deploy the new interconnect structure for its technology and cost advantages.  By 2014, more than 50% of bumped wafers for Flip-Chip will be equipped with Cu pillars,  and Cu pillar Flip-Chip is expected to grow at a Compound Annual Growth Rate (CAGR) of 35 percent between 2010 and 2018 in terms of wafer count, according to Yole Développement*.

The Apollo^TM MF100 expands FormFactor’s position in this high-growth sector.  Popularly used for solder bump probing, the Apollo^TM platform is now available with a vertical MEMS MF100 probe option creating a new high-precision/low-force technology solution for copper pillar applications.  It is a highly customizable platform with application-specific probe options for targeted structures.  Geared for multi-DUT (devices under test) testing in high-volume manufacturing environments, the product is optimized for robust performance and high throughput  advantages that help lower overall test costs.

“Today’s move marks two important developments,” said Mike Slessor, Sr. Vice President and General Manager of the MicroProbe Product Group.  “First, it applies our industry-leading MEMS technology to this high-growth segment of the market; and second, it extends the trusted and well-established Apollo^TM vertical platform to our SoC customers’ leading edge products at 28nm and beyond.”  

* “Flip-chip Market & Technology Trend – 2013 Business Update” – Yole Développement 

About FormFactor

FormFactor Inc. (NASDAQ: FORM) is a leader in advanced wafer test solutions. The company’s advanced wafer probe cards enable semiconductor manufacturers to lower their overall production costs, improve yields, and bring next-generation devices to market. FormFactor’s acquisition of MicroProbe creates the leading wafer test solution provider for both memory and non-memory semiconductor manufacturers. FormFactor is headquartered in Livermore, California with operations in Europe, Asia and North America. For more information, visit the company’s website at www.formfactor.com.

FormFactor, MicroProbe and the FormFactor and MicroProbe logos are registered or unregistered trademarks of FormFactor Inc. All other product, trademark, company or service names mentioned herein are the property of their respective owners.