industry news
Subscribe Now

Give a boost to your TI MCU LaunchPad Evaluation Kit – Enter TI’s MCU BoosterPack Design Challenge!

Jan 15, 2013 – DALLAS, Jan. 15, 2013 /PRNewswire/ — Developers can now give their TI microcontroller (MCU) LaunchPad Evaluation Kits an extra boost – and showcase it at one of the largest technology trade shows in the world! Starting today, Texas Instruments Inc. (TI) (NASDAQ: TXN), in collaboration with Mouser Electronics, is inviting engineers, university students and hobbyists in the United States to enter the TI MCU BoosterPack Design Challenge. TI MCU BoosterPacks are plug-in modules that enable developers, students and hobbyists to add greater functionality and peripherals to one of three TI MCU LaunchPad evaluation platforms. Up to three winners will be flown to San Jose, Calf. to demonstrate their winning designs in the TI booth (#1607) at DESIGN West 2013. Winners may also have the opportunity to have their original BoosterPack plug-in module designs considered for manufacture by CircuitCo Electronics. For the avoidance of doubt, TI will not be under any obligation to manufacture any BoosterPack plug-in module designs. For more information on BoosterPack plug-in modules and to see previous examples, designers can go to www.ti.com/bpdc-pr-lp7.

The MCU BoosterPack Design Challenge is an opportunity for innovators to design a creative BoosterPack that exhibits a unique feature or compelling functionality that is not currently offered in the market today. Makers can design a BoosterPack leveraging the differentiated features of any of the three TI MCU LaunchPad evaluation kits: MSP430™ LaunchPadC2000™ LaunchPad and Stellaris® LM4F120 LaunchPad. The TI MCU LaunchPad ecosystem allows engineers to design easy-to-use, modular boards targeted at low-power, real-time control and connectivity applications. BoosterPack plug-in modules enable greater functionality, flexibility, peripherals and scalability to easily extend LaunchPad’s capabilities with LCD, LED lighting, capacitive touch, motor control, Bluetooth® and more.

TI MCU BoosterPack Design Challenge guidelines

Challenge participants will have until March 1, 2013 at 11:59 p.m. CST, to submit an original BoosterPack design online at www.ti.com/bpdc-pr-ep. Several of the requirements include:

  • Providing a schematic and a brief, written description of the BoosterPack design.
  • Designing a BoosterPack with bill of materials (BOM) not exceeding $40 USD and conforming to the BoosterPack pinout standard.
  • Uploading the project to either Google Drive or Github online file sharing systems.
  • Recording a video describing the BoosterPack idea and uploading it to YouTube.

To read the full contest rules applicable to this contest, go to www.ti.com/byob-bpdc-pr-rules.

After the challenge deadline, a judging panel consisting of individuals from TI, Mouser and CircuitCo will determine the three contest winners. The online community can show their support via Facebook Likes and the Make the Switch forum. Winners will be announced March 22, 2013 on ti.com/byob. Entities affiliated with this contest include TI, Mouser, CircuitCo, Total Phase, Anaren, 43oh.com and Olimex LTD.

Join other LaunchPad enthusiasts and BYOB – Build Your Own BoosterPack

Since their introduction in 2010, MCU LaunchPads have quickly become a popular evaluation platform within the design community, selling close to half a million kits to date. Many have already built their own BoosterPack plug-in module and shared them with the online community. The best-selling C5000™ Audio Capacitive Touch BoosterPack and the C2000™ LED BoosterPack as well as the new CC2530 ZigBee® BoosterPack are examples of BoosterPack plug-in modules, but they are just the beginning. Join the LaunchPad community, build your own BoosterPack and see how far your designs can take you!

For more information about this contest and to submit an original BoosterPack design, visit ti.com/byob. To find out more about BoosterPacks plug-in modules, visit ti.com/boosterpack.

TI’s broad portfolio of microcontrollers (MCUs) and software

From general purpose, ultra-low power MSP microcontrollers, to Stellaris® ARM ® Cortex™-M microcontrollers to real-time control C2000™ microcontrollers and Hercules™ safety microcontrollers, TI offers a broad range of microcontroller solutions. Designers can accelerate time to market by tapping into TI’s complete software and hardware tools, extensive third-party offerings and technical support.

About Texas Instruments

Texas Instruments semiconductor innovations help 90,000 customers unlock the possibilities of the world as it could be – smarter, safer, greener, healthier and more fun.  Our commitment to building a better future is ingrained in everything we do – from the responsible manufacturing of our semiconductors, to caring for our employees, to giving back inside our communities.  This is just the beginning of our story.  Learn more at www.ti.com.

Trademarks

C2000MSP430 and C5000 are trademarks and Stellaris is a registered trademark of Texas Instruments Incorporated.  All registered trademarks and other trademarks belong to their respective owners.

 

Leave a Reply

featured blogs
Jul 20, 2024
If you are looking for great technology-related reads, here are some offerings that I cannot recommend highly enough....

featured video

How NV5, NVIDIA, and Cadence Collaboration Optimizes Data Center Efficiency, Performance, and Reliability

Sponsored by Cadence Design Systems

Deploying data centers with AI high-density workloads and ensuring they are capable for anticipated power trends requires insight. Creating a digital twin using the Cadence Reality Digital Twin Platform helped plan the deployment of current workloads and future-proof the investment. Learn about the collaboration between NV5, NVIDIA, and Cadence to optimize data center efficiency, performance, and reliability. 

Click here for more information about Cadence Data Center Solutions

featured paper

Navigating design challenges: block/chip design-stage verification

Sponsored by Siemens Digital Industries Software

Explore the future of IC design with the Calibre Shift left initiative. In this paper, author David Abercrombie reveals how Siemens is changing the game for block/chip design-stage verification by moving Calibre verification and reliability analysis solutions further left in the design flow, including directly inside your P&R tool cockpit. Discover how you can reduce traditional long-loop verification iterations, saving time, improving accuracy, and dramatically boosting productivity.

Click here to read more

featured chalk talk

FlyOver® Technology: Twinax FlyOver® System for Next Gen Speeds -- Samtec and Mouser
Sponsored by Mouser Electronics and Samtec
In this episode of Chalk Talk, Amelia Dalton and Matthew Burns from Samtec investigate the challenges of routing high speed data over lossy PCBs. They also discuss the benefits that Samtec’s Flyover® cable assembly systems bring to data center and embedded designs and how Samtec is furthering innovation with their high speed interconnect solutions. 
Apr 15, 2024
13,815 views