SAN JOSE, Calif., August 30, 2012 – Xilinx, Inc. (NASDAQ: XLNX) today announced its participation in SEMICON Taiwan 2012 at the 3D IC Technology Forum | SiP Global Summit 2012, taking place at the Taiwan World Trade Center (TWTC) Nangang Exhibition Hall in Taipei, Taiwan from September 5- 7, 2012.
On Thursday, September 6, 2012, Vincent Tong, Xilinx senior vice president of worldwide quality and new product introductions, will deliver a keynote entitled, “The Evolution of 3D ICs: Leaping Ahead of Moore’s Law to Deliver a 6.8B Transistor Device” and participate in an industry panel.
What: SEMICON Taiwan, 3D IC Technology Forum
Where: TWTC Nangang Exhibition Hall, Taipei, Taiwan
When: September 5-7, 2012
Given the growing importance of packaging and testing in the global semiconductor supply chain, SEMI is holding the SiP Global Summit under the auspices of SEMI’s Taiwan Packaging and Testing Committee, as well as major international enterprises and research organizations. The two-day SiP Global Summit 2012 consists of two major forums: 3D IC Technology and Embedded Technology with representatives from 20 of the world’s top-notch IT firms slated to share insights into the 3D IC, TSV, silicon interposer and embedded substrate technologies.
Last year, participants in 3D IC Technology Forum agreed that realization of 3D IC and high volume manufacturing were not questions of “if,” but “when.” This year’s forum – “3D IC Supply Chain Readiness – Confirmation and Clarification” – will examine industrial readiness and maturity throughout the entire infrastructure. Representatives from leading companies (2.5D/3D IC supply chain, including EDA, foundry, OSAT, etc.) will deliver keynotes and participate in a panel at the conclusion of the session.
Keynote
Thursday, September 6
9:50 a.m. – 10:20 a.m., Room 504, 5F, TWTC Nangang Exhibition Hall, Taipei
Evolution of 3D ICs: Leaping Ahead of Moore’s Law to Deliver a 6.8B Transistor Device
Xilinx senior vice president, Vincent Tong’s talk will focus on the evolution 3D ICs, comparative approaches by industry pioneers, and a 28nm 3D IC case study of the world’s highest capacity FPGA and first heterogeneous 3D FPGA , both built using Xilinx’s revolutionary stacked silicon interconnect (SSI) technology. The case study will cover technology, applications and power benefits. It will conclude with a 3D standards call to action for our industry.
Panel
4:10 p.m. – 5:00 p.m., Room 504, 5F, TWTC Nangang Exhibition Hall, Taipei
Is The Supply Chain Ready To Support 2.5D and 3D ICs?
Moderator:
Dr. YJ Chan, VP & general director, EOL (Electronics and Optoelectronics Research Lab), ITRI
Panelists:
Dr. CP Hung, vice president of R&D officer, ASE Group
Mr. Vincent Tong, senior vice president, Xilinx Inc.
Dr. John Osenbach, fellow, materials and innerconnect technology, LSI Corp.
Dr. Derek Hinkle, senior director of advanced packaging, Aptina LLC
Dr. Keh-Ching Huang, director, corporate marketing, UMC
Mr. Min Yoo, senior director R&D division, Amkor Technology Taiwan
About SEMI
SEMI is the global industry association serving the nano- and microelectronics manufacturing supply chains. SEMI member companies are the engine of the future, enabling smarter, faster and more economical products that improve our lives. Since 1970, SEMI has been committed to helping members grow more profitably, create new markets and meet common industry challenges. SEMI maintains offices in Beijing, Bengaluru, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org.
About Xilinx
Xilinx is the world’s leading provider of All Programmable FPGAs, SoCs and 3D ICs. These industry-leading devices are coupled with a next-generation design environment and IP to serve a broad range of customer needs, from programmable logic to programmable systems integration. For more information, visit www.xilinx.com.
