SANTA CLARA, Calif., USA- August 28, 2012 – Tensilica®, Inc. today announced that Renesas Electronics Corporation has signed a corporate-wide license for Tensilica’s HiFi Audio/Voice DSP (digital signal processor). Renesas will use the HiFi DSP in a wide variety of SOCs (system on chips) for mobile handsets, tablets, automotive, and other multimedia devices.
“We selected the HiFi Audio DSP for its power-efficient and small-area architecture, the availability of a wide range of fully optimized codecs from Tensilica, and the best software development tools,” stated Hiromi Watanabe, general manager of SoC Software Platform Division, SoC Business Unit, Renesas Electronics Corporation. “We were also impressed with its proven track record with high-volume applications and its large third-party ecosystem. By utilizing the resources of such third-party partners, we will be able to support our customers’ wide-ranging needs.”
“By adopting our HiFi DSP, Renesas can quickly add sophisticated voice and audio capabilities to a wide range of SOCs for mobile, automotive, and other entertainment applications,” stated Larry Przywara, Tensilica’s senior director of Multimedia Marketing. “The combination of the most efficient audio/voice DSP, the broadest third-party support ,and a C-based programming model will enable Renesas to develop best-in-class products.”
Tensilica’s HiFi Audio DSP is the most widely used audio/voice DSP IP core on the market, designed into digital televisions, smartphones, Blu-ray Disc players, automotive applications , audio/video receivers, portable digital radio, and other consumer equipment. Tensilica’s software development team, and its network of more than 30 partners, have ported and optimized over 100 audio/voice encoders and decoders, audio enhancement software, and pre-processing packages.
About Tensilica
Tensilica, Inc. is the leader in dataplane processor IP cores, with almost 200 core licensees. Dataplane processors (DPUs) combine the best capabilities of DSPs and CPUs while delivering 10 to 100x the performance because they can be optimized using Tensilica’s automated design tools to meet specific and demanding signal processing performance targets. Tensilica’s DPUs power SOC designs at system OEMs and seven out of the top 10 semiconductor companies for designs in mobile wireless, telecom and network infrastructure, computing and storage, and home and auto entertainment. Tensilica offers standard cores and hardware/software solutions that can be used as is or easily customized by semiconductor companies and OEMs for added differentiation. For more information on Tensilica’s patented, benchmark-proven DPUs visit www.tensilica.com.
