industry news
Subscribe Now

STMicroelectronics and FAW Group Establish Joint Laboratory to Drive Innovation in Automotive Electronics

BEIJING–(Marketwire – Aug 28, 2012) – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications and a leading supplier of automotive electronics, together with China FAW Group Corporation (FAW), one of the global leaders in the vehicle manufacturing industry, today announced the establishment of a joint laboratory in the FAW Group Research and Development Center emphasizing advanced research covering comprehensive cutting-edge solutions in power train, chassis, safety, car body, car infotainment, and new-energy technologies, as well as other automotive applications. FAW will adopt ST’s microcontrollers (MCUs), Application Specific Standard Products (ASSPs) and smart drivers in their advanced research in automotive electronics platforms.

The joint lab will focus on advanced research in automotive electronics systems. Building on ST’s global automotive electronics experience and know-how, devices including PowerPC series 32-bit microcontrollers and EMS (Engine Management System) highly integrated chip solutions, reference designs and technical support, the ST/FAW lab will accelerate joint development of advanced automotive-electronics technologies such as ECU (Engine Control Units), TCU (Transmission Control Unit) and EPS (Electric Power Steering), which will ultimately add more value to FAW’s new-generation automobiles.

“China is a huge market for automotive semiconductors and China’s automotive shipments have ranked No. 1 worldwide for three consecutive years. Today, automotive safety and comfort are attracting increased attention from consumers and the market for automotive electronics is also growing dramatically,” said Jun Li, Deputy Chief Engineer and Director of FAW R&D Center. “The cooperation between FAW and ST will drive our innovation in automotive-electronics technologies to support our development of optimized products at competitive cost, while strengthening our technological competences by overcoming technical constraints.”

“A collaboration between FAW, the leading automotive manufacturer in China, and ST, ranking the 1st supplier of automotive ICs in China in 2011[1], and the 3rd automotive supplier globally in 2011[2], will contribute to FAW developing advanced vehicles that well address the market,” said Edoardo Merli, Head of Marketing & Application, Automotive Product Group, STMicroelectronics Greater China & South Asia Region. “ST is already well-positioned in the applications of power-train, car body, and safety, as well as infotainment, and that position is well recognized among Chinese car makers and we are confident this cooperation will further strengthen ST’s position in China’s automotive electronics industry.”

About FAW Group

FAW Group is a China leader in the vehicle manufacturing including high quality trucks, buses, special vehicles and sedans. Established in 1953, it is the oldest and largest automotive group in the country. In 2011, FAW Group sold more than 2 million vehicles.

About STMicroelectronics

ST is a global leader in the semiconductor market serving customers across the spectrum of sense and power technologies and multimedia convergence applications. From energy management and savings to trust and data security, from healthcare and wellness to smart consumer devices, in the home, car and office, at work and at play, ST is found everywhere microelectronics make a positive and innovative contribution to people’s life. By getting more from technology to get more from life, ST stands for life.augmented.

In 2011, the Company’s net revenues were $9.73 billion. Further information on ST can be found at www.st.com.

Leave a Reply

featured blogs
Mar 20, 2026
From machines that see and think, to systems that act, and the humans that nudge them along....

featured video

Cadence Chiplets Solutions | Helping you realize your chiplet ambitions

Sponsored by Cadence Design Systems

In this webinar, David Glasco, VP of Compute Solutions at Cadence, discusses how Cadence enables customers to transition from traditional monolithic SoC architectures to modular, scalable chiplet-based solutions, essential for meeting the growing demands of physical AI applications and high-performance computing.

Read eBook: Helping You Realize Your Chiplet Ambitions

featured chalk talk

BMV080: World’s Smallest Particulate Matter (PM) Sensor
In this episode of Chalk Talk, Liaisan Khismatova from Bosch Sensortec and I explore the benefits of the Bosch BMV080, the world’s smallest particulate matter (PM) sensor. They also investigate the fanless innovation at the heart of the BMV080 Particulate Matter Sensor and how the silent and maintenance-free operation and ultra-compact size of this sensor makes it a game changer for next generation air quality monitoring applications. 
Jan 29, 2026
38,178 views