industry news
Subscribe Now

Maxim Introduces Third-Generation TINI® Power SoC Chipset for Smaller, Thinner, and More Energy-Efficient Smartphones

Sunnyvale, CA—June 19, 2012—Maxim Integrated Products, Inc. (NASDAQ: MXIM) announced that its newest Power SoC chipset in the Galaxy S® III operates with the Exynos 4412 quad-core applications processor to provide a smaller, much thinner, and significantly more efficient smartphone.  

Maxim’s newest Power SoC chipset covers all power management, charging, and USB multiplexing needs. It provides an optimized balance between size and flexibility to power the Samsung® applications processor and baseband processor. It maximizes battery usage and enhances USB connectivity. Managing the power for upwards of 60 channels, the chipset offers up to 20 percent more conversion efficiency compared to the previous generation. Maxim’s unique Green Mode regulators and subregulation architecture, along with the company’s proprietary low-power, submicron geometry process, extend standby and active battery life. The chipset also enables fastest battery charging with minimal heat generation. High integration and advanced design techniques reduce the size, thickness, and number of external components so smartphones become even thinner

Chipset Features

  • One Power SoC is optimized to efficiently power the Exynos 4412 applications processor.
  • The second Power SoC powers the LTE (4G) baseband processor for faster, more reliable data and voice. 
  • The third Power SoC provides numerous integrated functions, including a battery charger, a haptic motor driver, high-accuracy ModelGauge® technology that maximizes battery usage, and the ability to use a single USB connector for charging or connecting accessories 

Comments

“Customers are demanding the smallest possible, most-efficient power solution, so end users can enjoy all-day use of the latest multimedia features,” said Chae Lee, Senior Vice President, Mobility Group at Maxim Integrated Products. “Our Power SoC enables a 30 percent reduction in power solution size, while increasing efficiency by up to 20 percent compared to the previous generation.”

Customers interested in using the Power SoC chipset to develop highly integrated smartphones should contact their Maxim sales representative. For more information about TINI Power SoCs, click here.

About Maxim Integrated Products

Maxim makes highly integrated analog and mixed-signal semiconductors. Maxim reported revenue of approximately $2.5 billion for fiscal 2011. For more information, go to www.maxim-ic.com.  


Leave a Reply

featured blogs
Mar 9, 2026
What happens to our digital history when the world's biggest archive of retro video games disappears?...

featured video

Cadence Chiplets Solutions | Helping you realize your chiplet ambitions

Sponsored by Cadence Design Systems

In this webinar, David Glasco, VP of Compute Solutions at Cadence, discusses how Cadence enables customers to transition from traditional monolithic SoC architectures to modular, scalable chiplet-based solutions, essential for meeting the growing demands of physical AI applications and high-performance computing.

Read eBook: Helping You Realize Your Chiplet Ambitions

featured chalk talk

EU Cyber Resilience Act Compliance Simplified with Infineon Security Solutions
Sponsored by Mouser Electronics and Infineon
In this episode of Chalk Talk, Preeti Khemani from Infineon and Amelia Dalton investigate the scope, categories, and standards included in the EU Cyber Resilience Act. They also explore the timelines associated with the EU Cyber Resilience Act and discuss how Infineon is streamlining compliance to ensure your next design meets CRA requirements.
Mar 10, 2026
7,245 views