industry news
Subscribe Now

Nufront’s Third-Generation Mobile Applications Processor Powered by Cadence DDR3/3L/LPDDR2 Memory Interface IP Solution

SAN JOSE, CA–(Marketwire – May 21, 2012) – Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that Nufront’s NS115 chipset integrated the Cadence configurable DDR3/3L/LPDDR2 Memory Controller and Hard PHY IP core in its dual-core ARM® Cortex™-A9 based mobile applications processor. The TSMC 40nm LP 32-bit DDR3/3L/LPDDR2 interface features a data rate of up to 800Mbps while providing the automated traffic-based power management and efficiency critical to the ultrabook, tablet and smartphone markets. Fully compliant with the latest published specifications from JEDEC, the Cadence IP core for DDR3/3L/LPDDR2 memory enabled Nufront to reduce design risk and speed development of their chipset.

“Our third-generation dual core mobile computing chip, the NS115 delivers the performance, power efficiency and quality required by the tablet and smartphone market. It was selected for use in tablets from several local OEMs that were recently demonstrated at the Hong Kong Electronics Fair,” said Rock Yang, vice president of marketing, Nufront. “Cadence has developed an innovative, high-quality DDR3/3L/LPDDR2 IP core architecture that gives us the configuration flexibility necessary to meet the specific needs of our customers.”

The Cadence Design IP for DDR3/3L/LPDDR2 supports key capabilities required by high-performance, low power mobile computing applications to reduce risk and speed time-to-market. The Cadence DDR memory interface IP has been licensed for use in over 400 designs. Like its Cadence counterparts for other DDR standards like DDR4 and LPDDR3, the DDR3/DDR3L/LPDDR2 solution was architected to provide designers with the ability to configure the memory interface IP for optimal performance, power and area requirements.

“Our Cadence DDR Memory IP solution provides customers the system-specific combination of performance, power and configurability along with the ease-of-integration necessary to implement the DDR interface in their SoCs,” said Marc Greenberg, product marketing director, SoC Realization Group, Cadence. “The Nufront design team seamlessly integrated our IP into their design with minimal design risk thanks to our proven memory IP controller and PHY solutions and our commitment to ensuring our customer’s silicon success.”

About Cadence

Cadence enables global electronic design innovation and plays an essential role in the creation of today’s integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com.

Leave a Reply

featured blogs
Mar 9, 2026
What happens to our digital history when the world's biggest archive of retro video games disappears?...

featured video

Cadence Chiplets Solutions | Helping you realize your chiplet ambitions

Sponsored by Cadence Design Systems

In this webinar, David Glasco, VP of Compute Solutions at Cadence, discusses how Cadence enables customers to transition from traditional monolithic SoC architectures to modular, scalable chiplet-based solutions, essential for meeting the growing demands of physical AI applications and high-performance computing.

Read eBook: Helping You Realize Your Chiplet Ambitions

featured chalk talk

EU Cyber Resilience Act Compliance Simplified with Infineon Security Solutions
Sponsored by Mouser Electronics and Infineon
In this episode of Chalk Talk, Preeti Khemani from Infineon and Amelia Dalton investigate the scope, categories, and standards included in the EU Cyber Resilience Act. They also explore the timelines associated with the EU Cyber Resilience Act and discuss how Infineon is streamlining compliance to ensure your next design meets CRA requirements.
Mar 10, 2026
4,067 views