industry news
Subscribe Now

CEA-Leti and Arkema set up a platform dedicated to lithography based on nanostructured polymers

The semiconductor industry forecasts a doubling of the performances of electronic components every 18 months. However, the current printing technology – lithography – has to address the physical constraints of ever-greater miniaturization of silicon chips. CEA-Leti and Arkema, in association with LCPO (Laboratoire de Chimie des Polymères Organiques)  ofBordeaux, have succeeded in going beyond the boundaries of the infinitely small by showing the unique resolution potential of lithography based on nanostructured polymers. These initial results meet the requirements of the next 4 generations of electronic chips. Building on this success, CEA-Leti and Arkema have created a development platform dedicated to this technology.

As part of their joint laboratory, Arkema and CEA-Leti, with the help of Professor Hadziioannou’steam of LCPO, have successfully obtained a 20 nanometer (nm) pitch* and reduced the diameter of contacts down to 7 nm thanks to nanostructured polymers, thereby demonstrating the compatibility of this technology for technological nodes ranging from 20 nm to sub-10 nm.

A collaborative research platform

On the strength of these initial positive results, Arkema and CEA-Leti have created IDEAL (Insertion of DSA** lithography for CMOS*** application), a collaborative research platform dedicated to the development and industrialization of lithography based on nanostructured polymers. This platform relies on CEA-Leti’s expertise in process and electronic component integration, and on Arkema’s know-how in the development and industrialization of nanostructured polymers. These complementary capabilities will help adapt materials and processes to achieve optimum results and make the technology available to the semiconductor industry without delay.

Going beyond the boundaries of « classic » lithography

The semiconductor industry has had to contend with the limits of conventional optical lithography for several years now. The cost and the problems encountered with the EUV**** technology undermine the feasibility of the technological roadmap of micro-electronics. Lithography by self-assembly (or nanostructuring) of polymers is a highly promising technological alternative due to its low manufacturing costs and its straightforward integration in existing processes for the manufacture of microprocessors and other electronic chips.

Since the early 2000s, Arkema has been developing for various applications a block copolymer technology that yields innovative nanostructured materials boasting a wide range of properties, some of which are particularly suited to self-assembled lithography.

CEA-Leti operates at the heart of developments for the most advanced CMOS technologies within its 300 mm pilot line and in partnership with this sector’s world players.

« The creation of this platform is an initial success for our brand-new collaboration, and it illustrates the importance of combining material, process and integration know-how at an early stage. It also bears testimony to Arkema’s ability to develop new copolymers and to adapt its industrial resources to this demanding micro-electronics sector in terms of product performance and purity », declares Ian Cayrefourcq, Director Emerging Technologies at Arkema. 

« Lithography based on nanostructured copolymers opens up very encouraging prospects in terms of performance and cost for the semiconductor industry. Cooperation between Arkema, an innovative world-leading chemical company, and CEA-Leti, a world-renowned institute in the integration of CMOS technologies, will help develop materials and processes directly transferrable and compatible with the industry’s standards », points out Laurent Malier, CEA-Leti Director.

Leave a Reply

featured blogs
Dec 8, 2025
If you're yearning for a project that reconnects you with the roots of our digital age, grab a soldering iron and prepare to party like it's 1979!...

featured news

Microchip Unveils First 3 nm PCIe® Gen 6 Switch to Power Modern AI Infrastructure

Sponsored by Microchip

AI systems are starving for bandwidth. Microchip’s 3 nm Switchtec™ Gen 6 PCIe® switches deliver up to 160 lanes, lower power, and CNSA-compliant security—built for the future of AI and cloud infrastructure.

Click here to read more

featured chalk talk

Accelerating the Transition to 48V Power Systems
Sponsored by Mouser Electronics and Vicor
In this episode of Chalk Talk, Tom Curatolo from Vicor and Amelia Dalton explore the what, where, and how of 48 volt power delivery networks. They also investigate the components of a 48 volt portfolio ecosystem, the advantages of a high-density, modular power design solution and the six things to consider when transitioning to 48 volt power systems. 
Dec 2, 2025
25,588 views