SAN JOSE, Calif., May 7, 2012 – Xilinx, Inc. (NASDAQ: XLNX) today announced participation at the Interop IT Expo and Conference in Las Vegas, from May 8-10, at the Mandalay Bay Convention Center, Booth #2158. At the conference, attendees will see the Virtex®-7 X690T FPGA , the first chip in the Xilinx® 7 series FPGA family highlighting advanced high-performance networking applications that require low power and a highly integrated, single-chip implementation. Xilinx experts will also show 40 Gbps transfer over a PCI Express® Gen 3 x8 link that simplifies design, accelerates design productivity and lowers total cost of ownership for next generation networking and high-bandwidth Data Center solutions.
What: Interop IT Expo and Conference 2012
Where: Las Vegas, NV, Mandalay Bay Convention Center, Booth #2158
When: Technical Conference – May 6-10, 2012
Exposition – May 8-10, 2012
“Xilinx is committed to providing customers with a common, scalable, optimized architecture,” said Nick Possley, Xilinx senior director wired communications. “Our solutions enable fine grained QoS and parameterized traffic processing for a wide variety of applications including the Enterprise, Data Center, Metro, Access, Mobile Backhaul and Service Provider applications.”
In-Booth Exhibition Demonstrations
Tuesday – Thursday, May 8-10
Virtex-7 X690T FPGA Backplane Demonstration
- This will be the first public demonstration of the Virtex-7 X690T FPGA, featuring 80 GTH serial transceivers operating at 13.1 Gbps over a 10GBASE-KR backplane and surpasses the 2 Tbps bandwidth barrier. Virtex-7 X690T devices support up to 1000 SelectIOTM pins necessary to support the memory bandwidth required by high speed packet processing and traffic management applications. Built on TSMC’s 28nm High Performance Low Power process, the Virtex-7 X690T FPGA delivers 25 percent lower total power than competitive solutions. With unprecedented serial bandwidth and industry leading logic capacity, the Virtex-7 XT family is enabling single chip implementations for high speed enterprise and data center applications. These devices enable fast, scalable and easy-to-implement chip-to-chip serial interfaces, the leading signal-integrity for backplanes that maximize bandwidth while supporting the various board-to-board distances of next-generation communication systems, and highly flexible interfaces for the latest single mode fiber optical modules.
DMA Bandwidth Demonstration using PCI Express Gen 3 x8 IP for Data Center Applications
- Xilinx will show a PCI Express Gen 3 x8 solution for high-bandwidth Data Center applications. Delivering reliable and high-bandwidth connectivity, the Kintex–7 and Virtex-7 FPGAs provide a platform for feature-rich traffic management applications for optimal network QoS. This demonstration highlights the capability of Xilinx FPGAs to sustain over 40 Gbps of traffic with a PCI Express Gen3 x8 link, while simplifying design and lowering total cost of ownership for next generation networking and data center applications. The next generation data center powered by Xilinx employs a converged fabric and promotes higher levels of system integration, energy-efficiency and manageability through network virtualization and the flexible use of computing resources while reducing system power and lowering BOM.
About Xilinx
Xilinx develops All Programmable technologies and devices, beyond hardware to software, digital to analog, and single to multiple die in 3D ICs. These industry leading devices are coupled with a next-generation design environment and IP to serve a broad range of customer needs, from programmable logic to programmable systems integration. For more information, visit www.xilinx.com.
