San Jose, CA, March 27, 2012 – Super Micro Computer, Inc. (NASDAQ: SMCI), a global leader in high-performance, high-efficiency server technology and green computing showcases its latest embedded building block solutions this week at Embedded Systems Conference (ESC) 2012 in San Jose, CA. Supermicro’s offers a wide range of high-reliability, long life cycle, ruggedized and expandable solutions for embedded applications. New products feature higher I/O bandwidth with PCI-E 3.0 and USB 3.0 support, lower power consumption through our high-efficiency (95%+) digital switching power supplies, highest availability and reliability with N+N+N Redundant Battery Backup Power Supply (BBP) modules and higher-performance with integration of new generation Intel® Xeon® E5, and future generation Core™ processors. New high-end Dual Processor (DP) and Uni-Processor (UP) motherboards are available in industry standard Mini-ITX, Micro-ATX, ATX, Extended ATX and other form factors, delivering cost and application optimized solutions for a variety of embedded applications.
“Supermicro’s latest product releases bring our best in class server technologies to the embedded appliance market,” said Charles Liang, President and CEO of Supermicro. “Outstanding features of our latest embedded solutions deliver maximum I/O expandability with 11 PCI-E slots and increased performance and bandwidth for memory, storage and networking. In addition we provide greater energy efficiency with our digital onboard VRM technology, new high-efficiency 95%+ digital power supplies and 99.9% efficient BBP modules as well as support for Intel’s next generation processor technologies. With extended life cycle, legacy I/O, open standards and multi OS support, Supermicro’s embedded server building block solutions offer our customers the robust feature sets they require for their unique applications.”
For high-end, memory intensive applications embedded DP series motherboards offer up to 512GB in 16 DIMM slots and UP (X9SRL-F and X9SRE) series offer up to 256GB in 8 DIMM slots, each supporting DDR3 1600MHz Reg. ECC. Storage expansion is enabled with onboard RAID functionality and support for higher speed 6Gb/s SATA3 drives. For maximized I/O, Supermicro introduces a premiere DP motherboard (X9DRX+-F) that provides an extreme 11x PCI-E slots optimized for display wall control and high-performance PCI-E based SSD applications. This class of embedded motherboards is ideal for Image Processing, Digital Surveillance, Communication Infrastructure, Virtual Desktop Infrastructure (VDI), Media Servers, Industrial Controls (PAC) and a wide variety other embedded applications.
Addressing mid-range applications, Supermicro offers cost-effective Intel Xeon E3-1200 based UP motherboards (X9SCM-F, X9SCL-F). DP solutions include the popular X9DRL-iF an E5-2600 based motherboard in a small form factor with legacy PCI slot support. These solutions offer the best value in cutting edge technology making them a perfect fit for cost optimized servers, I/O and networking expansion, communication, storage, medical equipment, kiosk and a variety of mainstream embedded server applications.
For low power, energy efficient solutions, Supermicro is expanding its line of mini-ITX embedded motherboards (X9SCV-Q, X9SCV-QV4) supporting Intel® 2nd Generation Core™ processors with Mobile Chipsets. These high-density, energy efficient motherboards consume a typical 65W and feature optimal memory, storage and networking in a small footprint. Additional expansion is available with 11 USB 2.0 ports, 1x PCI-E x16 slot, HDMI graphics and HD audio. With support for both DC and AC supplies, TPM 1.2 for system security and Disk On Module (DOM) fast boot capability, these boards are optimized for Kiosk, Point-of-Sale (POS) and Digital Signage types of embedded applications. They also support vPro and AMT for remote client and server management and are ideally suited for use as SMB micro servers and head units for storage, networking and security systems.
Adding to Supermicro’s embedded building block solutions is the introduction of several IPC Chassis in 1U, 2U and 4U (SC842XTQ-R606B) available in rackmountable and short-depth configurations for space constrained applications. IPC solutions are ruggedized for industrial environments and feature enhanced cooling and airflow to operate in high dust and extreme temperature conditions. IPC solutions offer expansion capability for storage bay modules, LCD system status displays, slim drives and extreme I/O expansion slots. The 4U short-depth IPC (6047R-TXRF) provides 11x PCI-E slots making it ideal for applications with extreme I/O expansion needs.
Supermicro continues to lead the market with innovative computing solutions for embedded applications. Visit our exhibit at ESC 2012 in San Jose, CA, March 27th-29th at booth 2024 in McEnery Convention Center. For more information about Supermicro’s complete embedded computing and server platforms go to www.supermicro.com/Embedded.
About Super Micro Computer, Inc.
Supermicro® (NASDAQ: SMCI), the leading innovator in high-performance, high-efficiency server technology is a premier provider of advanced server Building Block Solutions® for Embedded Systems, Enterprise IT, Data Center, HPC, and Cloud Computing worldwide. Supermicro is committed to protecting the environment through its “We Keep IT Green®” initiative and provides customers with the most energy-efficient, environmentally-friendly solutions available on the market.
Supermicro, Building Block Solutions and We Keep IT Green are trademarks and/or registered trademarks of Super Micro Computer, Inc.
Intel, Intel Xeon, the Intel Xeon logo and Intel Core are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.
