TAIPEI, Taiwan, Aug. 30, 2011 – Xilinx, Inc. (NASDAQ: XLNX) today announced that senior company executives will present at the e-Manufacturing & Design Collaboration Symposium 2011 in Hsinchu, in addition to the SiP Global Summit 3D IC Technology Forum and DigiTimes Presents: What if? The Benefits of TSV at its Most Feasible seminar during SEMICON Taiwan 2011 in Taipei. Xilinx executives Vincent Tong, Senior Vice President of Quality and New Product Introductions and Victor Peng, Senior Vice President of Programmable Platforms Development will share success factors for riding the process technology curve at 28nm and beyond, and recent innovations in 2.5D and 3D IC design.
Tuesday, September 6, 2011
e-Manufacturing & Design Collaboration Symposium 2011
Riding the Process Curve at 28nm and Beyond
1:30-5:00 p.m. session
1:30-2:15 p.m. Xilinx keynote
The Ambassador Hotel, Ballroom B 10/F – Hsinchu, Taiwan
The e-Manufacturing & Design Collaboration Symposium 2011, a joint symposium with ISSM (International Symposium on Semiconductor Manufacturing) 2011 focuses on cross-industrial operations, alliance strategies, technological innovations, and business partnerships. Tong will deliver a keynote titled Riding the Process Curve at 28nm and Beyond from 1:30 to 2:15 p.m., which will take a look at Xilinx’s strategy for being at the forefront of the industry at each new process node, as well as the successes that led to the delivery of the PLD industry’s first and largest 28nm FPGAs.
Wednesday, September 7, 2011
DigiTimes Presents: What if? The Benefits of TSV at its Most Feasible at SEMICON Taiwan 2011
3:00-7:00 p.m. session
3:30-4:00 p.m. Xilinx speech
Grand Hyatt, Magpie Room – Taipei, Taiwan
Peng will join industry leaders and Nobunaga Chai, Senior Analyst of DigiTimes’ research center in a seminar hosted by DigiTimes during SEMICON Taiwan 2011, where executives will deliver presentations and participate in a roundtable discussion moderated by DigiTimes’ Coco Chen.
Thursday, September 8, 2011
8:30 a.m.-5:30 p.m. session
9:40-10:10 a.m. Xilinx speech
Taipei World Trade Center – Taipei, Taiwan
Taipei International Convention Center (TICC), Room 201 ABC
In this symposium, leaders representing key segments of the ecosystem will share their experiences in 2.5D and 3D ICs with a focus on technology roadmaps, supply chain manufacturing readiness, business models and standardization. See SiP Program for agenda and speaker line-up. Peng’s speech titled Realizing a Two Million Logic Cell 28nm FPGA with Stacked Silicon Interconnect Technology is set to take place at 9:40 a.m. and will cover recent advances in 28nm 2.5D and 3D IC technology.
About e-Manufacturing & Design Collaboration Symposium 2011
The e-Manufacturing & Design Collaboration Symposium 2011 theme focuses on cross-industrial operations, alliance strategies, technological innovations, and business partnerships. Not only do these themes share some common technologies but rather than their centering on a core of green objectives for sustainable development.
About SEMICON Taiwan
SEMICON Taiwan 2011, held simultaneously with the SiP Global Summit, will feature the Advanced Packaging/Testing Gallery sponsored by ASE and KYEC. The pavilion will feature cutting-edge testing/packaging technologies and applications.
Both the SiP Global Summit and SEMICON Taiwan are now open for registration and exhibitor signup. Please visit: http://www.semicontaiwan.org/en/.
About Xilinx
Xilinx is the world’s leading provider of programmable platforms. For more information, visit: http://www.xilinx.com/.
