featured blogs
Dec 8, 2023
Read the technical brief to learn about Mixed-Order Mesh Curving using Cadence Fidelity Pointwise. When performing numerical simulations on complex systems, discretization schemes are necessary for the governing equations and geometry. In computational fluid dynamics (CFD) si...
Dec 7, 2023
Explore the different memory technologies at the heart of AI SoC memory architecture and learn about the advantages of SRAM, ReRAM, MRAM, and beyond.The post The Importance of Memory Architecture for AI SoCs appeared first on Chip Design....
Nov 6, 2023
Suffice it to say that everyone and everything in these images was shot in-camera underwater, and that the results truly are haunting....
featured paper
 3D-IC Design Challenges and RequirementsSponsored by Cadence Design Systems While there is great interest in 3D-IC technology, it is still in its early phases. Standard definitions are lacking, the supply chain ecosystem is in flux, and design, analysis, verification, and test challenges need to be resolved. Read this paper to learn about design challenges, ecosystem requirements, and needed solutions. While various types of multi-die packages have been available for many years, this paper focuses on 3D integration and packaging of multiple stacked dies. |
featured chalk talk
Challenges of Multi-Connectivity Asset Tracking
Sponsored by Mouser Electronics and STMicroelectronics
Multi-connectivity asset tracking is a critical element of our modern supply chain. In this episode of Chalk Talk, Colin Ramrattan and Manuel Cantone from STMicroelectronics and Amelia Dalton discuss the common needs required for asset tracking today, why low power processing is vital for these kind of applications, and how STMicroelectronics ASTRA platform can help you get started on your next asset tracking design.