FORTEC United Kingdom is introducing the new CFM600S Series from Cincon, a 600W AC-DC power supply designed to directly address the key challenges faced by today’s design and system engineers: space constraints, thermal management, regulatory compliance and long-term reliability.
As power requirements increase and enclosures shrink, engineers are under growing pressure to deliver higher performance without compromising safety, efficiency or service life. The CFM600S responds with a compact 3” × 5” form factor, integrated PFC and a power density of up to 25.97 W/in³, enabling high-power designs without costly mechanical … Read More → "Cincon’s 600W CFM Series: Addressing Today’s Engineering Challenges"
Rohde & Schwarz will exhibit its latest advancements in test and measurement technology at DesignCon 2026, booth #949. Attendees can participate in a full-day technical workshop open to all DesignCon visitors, experience hands-on demonstrations of cutting-edge solutions, and enter a drawing to win the new MXO 3 oscilloscope.
Rohde & Schwarz has announced comprehensive plans for DesignCon 2026, the premier high-speed communications and system design conference and exposition, taking place February 24 to 26 in Santa Clara, California, in the heart of Silicon Valley. This year’s program for the conference reflects the commitment of Rohde & Schwarz to delivering technical expertise directly … Read More → "Rohde & Schwarz at DesignCon 2026 to deliver the latest in T&M solutions and a chance to win an MXO 3 oscilloscope"
LOS ANGELES (Jan. 28, 2026) – EMASS, a Nanoveu subsidiary specializing in next-generation semiconductor technology, today announced the successful tape-out of its 16nm ECS-DoT system-on-chip (SoC). The device has entered fabrication at TSMC, marking the transition of EMASS’s next-generation ultra-low-power edge AI architecture from final design into production silicon.
The 16nm ECS-DoT represents a process-node and architectural scaling of EMASS’s proven 22nm ECS-DoT platform, increasing compute density, memory bandwidth and system integration while preserving the ultra-low-power design principles that define the ECS-DoT family. The move to 16nm enables higher logic density … Read More → "EMASS Tapes Out 16nm ECS-DoT, Advancing Always-On Edge AI"
Las Vegas, CES 2026 – RealMan Robotics, a system-level infrastructure platform company for the era of embodied intelligence, unveiled its latest advancements at CES 2026, showcasing a comprehensive technology stack spanning hardware, data, and remote operations.
At the exhibition, RealMan presented three core innovations:
A fully integrated joint module
Ultra-lightweight humanoid robotic arms
The Global Labor Network (GLN), powered by RealBOT wheel-foldable robots and the Humanoid Robot Data Training Center
Read More → "RealMan Robotics Showcases Embodied Intelligence Infrastructure at CES 2026"
WHAT’S NEW: Synopsys, in collaboration with AMD, has been selected for the World Economic Forum’s MINDS (Meaningful, Intelligent, Novel, Deployable Solutions) AI program. This recognition places both companies among a distinguished global group of pioneers advancing artificial intelligence solutions that are not only technically advanced but also deployed with measurable real-world impact.
The MINDS awards and program, part of the World Economic Forum’s AI Global Alliance initiative, identifies organizations that are leading the way in applying AI to complex, high-stakes challenges. Synopsys and AMD were specifically recognized for their work applying reinforcement learning, generative … Read More → "Synopsys and AMD Honored by World Economic Forum for Generative and Agentic AI Vision, Leadership, and Impact"
Keysight Technologies, Inc. (NYSE: KEYS) and Point2 Technology today announced a strategic collaboration to validate next-generation, multi-terabit interconnects designed to eliminate scale-up connectivity bottlenecks in artificial intelligence (AI) and machine learning (ML) data centers. Using Keysight’s high-speed digital test solutions, including theRead More → "Keysight and Point2 Technology Collaborate to Advance Next-Generation AI Scale-Up Interconnects"
Germany, Düsseldorf, 28 January 2026 – Read More → "KIOXIA Introduces QLC UFS 4.1 Embedded Flash Memory Devices for High-Capacity Mobile Storage"
Plainview, N.Y. (U.S.A) and Leuven (Belgium), January 28, 2026 – Veeco
Instruments Inc. (Nasdaq: VECO) and imec announced today that they have
collaboratively developed a 300mm high volume manufacturing compatible
process that enables the integration of barium titanate (BaTiO3 or BTO)
on a silicon photonics platform. BTO is a promising material with unique
electro-optical properties that can be used for high-speed and low-power
light modulation in emerging applications such as high-speed optical
transceivers, quantum computing, light detection and ranging (LiDAR),
and AR/VR applications. Historically, approaches to integrate BTO have
… Read More → "Veeco and imec develop 300mm compatible process to enable integration of barium titanate on silicon photonics"
Taipei, Taiwan – January 28th, 2026 – Edge computing today faces competing demands, for computers which are affordable and power efficient, but also for computers which can take on more demanding roles when required. Now, NEXCOM’s new NDiS B340 Duro Edge Computer serves this large but challenging market in a single product, with a versatile base unit that can be upgraded at any time with a dockable PCIe expansion module (DockInfinity-E4X1).
This provides the best of both worlds: a compact and affordable base computer with a huge array of connectivity options, which can be extended on … Read More → "NEXCOM Unveils NDiS B340, a Cost-efficient and Expandable Edge Computing Platform"
