News – EEJournal

OPEX Corporation Successfully Completes CRA Fast Start Readiness Assessment with ONEKEY

OPEX Corporation Successfully Completes CRA Fast Start Readiness Assessment with ONEKEY OPEX Corporation, a leading global provider of automation and manufacturing solutions, is working closely with ONEKEY to prepare for compliance with the Cyber Resilience Act (CRA).

March 23, 2026

The European Union is introducing the Cyber Resilience Act (CRA), establishing comprehensive, binding cybersecurity requirements for connected products. For many organizations, this marks the beginning of a new phase of regulatory readiness. To support this transition, ONEKEY offers a structured Read More → "OPEX Corporation Successfully Completes CRA Fast Start Readiness Assessment with ONEKEY"

CEA-Leti and Fraunhofer IPMS Validate Wafer Exchange for Ferroelectric Memory Materials Within the FAMES Pilot Line

Successful HZO Ferroelectric Wafer Loops Confirm Functionality Across FAMES Sites, And Advance Europe’s Collaborative Platform for Next-Generation Non-Volatile Memory

March 23, 2026

CEA-Leti and Fraunhofer IPMS have successfully completed the first exchange of ferroelectric memory wafers within the FAMES Pilot Line, marking a pivotal milestone in establishing a shared European platform for advanced embedded non-volatile memory (NVM) technologies. Launched in December 2023 and coordinated by CEA-Leti, the five-year initiative has demonstrated the viability of circulating complex material stacks across some of its leading research fabs.

The collaboration initially focused on the processing and electrical characterization of hafnium-zirconium oxide (HZO) ferroelectric capacitor stacks. Utilizing the combined 300 mm CMOS cleanroom capabilities of both institutes, they circulated the wafers … Read More → "CEA-Leti and Fraunhofer IPMS Validate Wafer Exchange for Ferroelectric Memory Materials Within the FAMES Pilot Line"

1200 V QSiC™ Dual3 Modules Enable Power Converters with Industry-Leading Conversion Efficiency and Power Density

Half-bridge series for data center cooling and industrial drivers includes 1, 1.4 and 2 mΩ RDSon SiC MOSFETs and parallel SiC diodes for best-in-class high power conversion efficiency

March 23, 2026

SemiQ Inc, a designer, developer, and global supplier of superior silicon carbide (SiC) solutions for ultra-efficient, high-performance, and high-voltage … Read More →

Renesas Unveils First Bidirectional 650V-Class GaN Switch For Solar Power Inverters, AI Data Centers and More

March 23, 2026

First-of-its kind bidirectional GaN technology with DC blocking dramatically reduces switch count needed for power conversion topologies
Compatible with standard gate drivers
Soft- and hard-switching capable, with fast, clean transitions

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the industry’s first bidirectional switch using depletion-mode (d-mode) GaN technology, capable of blocking both positive and negative currents in a single device with integrated DC blocking. Targeting single-stage solar microinverters, AI data centers and onboard electric vehicle chargers, the high-voltage TP65B110HRU dramatically simplifies power … Read More → "Renesas Unveils First Bidirectional 650V-Class GaN Switch For Solar Power Inverters, AI Data Centers and More"

New superconducting chip could enable breakthrough Nondestructive terahertz imaging

View in Browser News Release Monday 23 March 2026 New superconducting chip could enable breakthrough Nondestructive terahertz imaging A tiny crystal chip which uses terahertz radiation to see clearly through a wide range of materials could find applications in healthcare, biological research, and security screening.

March 23, 2026

Researchers from Scotland and Japan have developed the lightweight superconducting chip, which they say could unlock the full potential of terahertz imaging technologies and lead to the development of more poweful and portable devices.

Terahertz radiation lies between the microwave and infrared frequencies of the electromagnetic spectrum. It passes easily and harmlessly through a wide range of materials, and can be used to identify the characteristic ‘fingerprint’ of molecules and biological materials as it does so, allowing them to be detected and analysed.

Although terahertz imaging technologies are already in use in some research devices, … Read More → "New superconducting chip could enable breakthrough Nondestructive terahertz imaging"

Marvell Launches Industry’s First 260-lane PCIe 6.0 Switch for AI Data Center Scale-up Infrastructure

Marvell Structera S Delivers 2x the Lane Density of Competitive Offerings, Expanding Marvell End-to-End PCIe Product Portfolio and Redefining PCIe Scale-up Performance

March 20, 2026

Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced Marvell® Structera™ S 60260, the industry’s first 260-lane PCIe 6.0 switch. Leveraging industry-leading interconnect solutions through the recent acquisition of XConn Technologies, the new industry’s highest-radix PCIe switch extends the Marvell end-to-end PCIe portfolio, offering unique levels of scale-up AI data center performance and design flexibility.

As AI servers integrate increasing numbers of GPUs and accelerators, PCIe scale-up fabrics have become critical to maximizing compute density and resource utilization. Traditional switches require multiple devices to achieve scale, resulting in … Read More → "Marvell Launches Industry’s First 260-lane PCIe 6.0 Switch for AI Data Center Scale-up Infrastructure"

Qnity Collaborates with NVIDIA to Accelerate Innovation for Semiconductor and Advanced Electronics Materials

Collaboration brings accelerated computing to materials research across the semiconductor value chain

March 20, 2026

WILMINGTON, Del.–(BUSINESS WIRE)–Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today announced a collaboration with NVIDIA to accelerate AI-driven innovation using open NVIDIA Nemotron 3 Nano, ALCHEMI BMD NIM, LAMMPS Kokkos, and CUDA-X accelerated Abaqus for modeling and simulation technologies. The collaboration is focused on advancing materials research and development to support next-generation AI, high-performance computing, and advanced packaging technologies. Maintaining signal integrity at higher speeds and densities is critical to system performance and reliability.

Teradyne Introduces Photon 100

Comprehensive Automated Test Platform Accelerates High-Volume Silicon Photonics and Co-Packaged Optics Manufacturing

March 20, 2026

Teradyne, Inc. (NASDAQ: TER), a leading provider of automated test equipment and advanced robotics, today announced the launch of the Photon 100, a comprehensive opto-electric automated test platform purpose-built to accelerate high-volume silicon photonics (SiPh) and co-packaged optics (CPO) manufacturing.

As demand for high-speed, energy-efficient optical interconnects surges, driven by AI and next-generation data centers, manufacturers face challenges in scaling SiPh and CPO to high volume manufacturing. By integrating industry-leading optical and electrical instrumentation with Teradyne’s proven Read More → "Teradyne Introduces Photon 100"

Infineon accelerates deployment of robots with improved safety and security features using digital twins in collaboration with NVIDIA

March 20, 2026

Infineon to accelerate next-generation humanoid robots enabled by digital twins in collaboration with NVIDIA
Scalable deployment of humanoid robots through reference designs integrating Infineon smart actuators with NVIDIA Jetson Thor and NVIDIA Halos AI Systems Inspection Lab to advance safety and security for robots
Infineon enables the key functional blocks in humanoid robots with a broad portfolio of dedicated products, and an estimated per-unit semiconductor content of USD 500

Infineon Technologies AG (FSE: IFX / … Read More → "Infineon accelerates deployment of robots with improved safety and security features using digital twins in collaboration with NVIDIA"

STMicroelectronics’ single-chip buck converter packs 3A power for appliances and industrial loads

Tiny footprint, low BOM, 93% efficiency, with light-load and noise-sensitive options

March 19, 2026

Capable of supplying 3A from a 3mm x 1.6mm footprint, STMicroelectronics’ DCP3603 monolithic buck converter simplifies design, saves PCB space, accelerates time to market, and enhances system reliability. With a 3.3V-to-36V input-voltage range, this convenient miniature converter can power equipment such as smart meters, domestic appliances, and industrial 24 … Read More → "STMicroelectronics’ single-chip buck converter packs 3A power for appliances and industrial loads"

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What the FAQ are Perceptive, Enhancive, Generative, Agentic, and Physical AI (and Vibe Coding)

Mar 20, 2026

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