Ultra-thin chip packages could lead to intelligent clothing

by Laura Domela

Imec claims it has integrated an ultra-thin, flexible chip with bendable and stretchable interconnects into a package that adapts to curving and bending surfaces.

According to a statement, the resulting circuitry can be embedded in medical and lifestyle applications where user comfort and unobtrusiveness is key, such as wearable health monitors or smart clothing.

The researchers presented their results at this week’s 2012 Electronics System Integration Technology Conference (ESTC) in Amsterdam.
via the engineer UK

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Ultra-thin chip packages could lead to intelligent clothing

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