Design Challenges Flow Downstream
Innovations within one domain of electronic product design typically have an unforeseen impact on other areas. For instance, innovation within FPGA devices that has enabled increased functional complexity and I/O performance has introduced challenges downstream during PCB design. Increased functional complexity has resulted in increased I/O pins per device and increased package pin density. In addition, increased I/O performance has resulted in a tighter set of PCB interconnect constraints to minimize degradation of high-speed signals as they travel between devices. The ability to leverage FPGA I/O flexibility to optimize FPGA/PCB performance offers significant value, … Read More → "Design Challenges Flow Downstream"

