IMEC sets major step towards 3D integration of DRAM on logic
Leuven, Belgium — September 30, 2009 — IMEC and its 3D integration partners have taped-out Etna, a new 3D chip integrating a commercial DRAM chip on top of a logic IC. The new 3D stack resembles as close as possible to future commercial chips. It consists of a 25µm thick logic die on top of which a commercial DRAM is stacked using through-silicon vias (TSVs) and micro-bumps.
The 3D demonstrator mimics all aspects of the approach by stacking an advanced commercial DRAM product chip on IMEC’s proprietary CMOS logic IC. As an example, heaters are … Read More → "IMEC sets major step towards 3D integration of DRAM on logic"

