WHO

Jasper Design Automation, provider of advanced formal technology solutions, and its distributor in Japan, CyberTec.

WHAT

Introduction of the latest release of the JasperGold®/JasperCore™ formal verification system with formal verification power for unprecedented deep-proof capacity, and applications across the spectrum of design and verification.

WHEN

January 28-29, 2010.

WHERE

EDSF, Yokohama, Japan, Booth 304 – for more information, or to register for a product demo, e-mail < … Read More → "Newest Jasper Formal Technology Coming to EDSF, January 28-29, Yokohama"

ACTON, Mass.–(BUSINESS WIRE)–Carbon Design Systems

Who: Carbon Design Systems™, the leading supplier of tools for the automatic creation, validation and deployment of system-level models

What: Will exhibit in Booth #203 at … Read More → "Carbon Design Systems to Focus on Deploying Virtual Systems Using ARM Processors, Fabric at 2010 EDS Fair"

WINSTON-SALEM, N.C.–(BUSINESS WIRE)–Triad Semiconductor Inc., the industry’s leading supplier of via-configurable mixed-signal ASICs, today announced the first system-on-chip (SoC) to integrate the world-class ARM® Cortex™-M0 with the via-configurable analog and digital functions needed … Read More → "Triad Semiconductor Announces Availability of World’s First Configurable ARM® Cortex™-M0 Mixed-signal ASIC Solution"

MOUNTAIN VIEW, Calif – Jan 12, 2010 — Synopsys, Inc. (NASDAQ: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, today announced the availability of SuperSpeed USB 3.0 transaction-level models (TLM) supporting the Open SystemC™ Initiative (OSCI) TLM-2.0 API specification. The models are TLM representations of the Synopsys DesignWare^®Read More → "Synopsys Introduces Industry’s First SystemC TLM-2.0 SuperSpeed USB 3.0 Models"

LAS VEGAS, Nev., January 9, 2010 – At the International Consumer Electronics Show (CES) today, Xilinx, Inc. (NASDAQ: XLNX) demonstrated a new Consumer Video Enhancement Reference Design that bundles advanced digital video algorithms with a low-cost Xilinx® Spartan® field programmable gate array (FPGA) for rapid ‘plug-and-play’ design of high-definition digital televisions (HDTVs). Xilinx is featuring the new reference design at CES this week from January 7th through January 10th in Xilinx Booth 35162MP, located in South Hall 4 of the Las Vegas Convention Center.

Developed in collaboration with Vestek Electronics Research and Development, an internationally recognized provider of … Read More → "Xilinx Demonstrates Plug-and-Play HDTV Reference Design at CES 2010"

DÜSSELDORF (Germany), January 11, 2010 — NEC Electronics Europe announces the release of the 78K0R/Lx3 — SENSE IT! development kit. SENSE IT! is a single-board, LCD control development platform designed specifically for the evaluation of NEC Electronics’ 16-bit 78K0R/Lx3 microcontroller. It includes an on-chip liquid crystal display (LCD) driver circuit, optimized especially for the fields of handheld healthcare diagnostic instruments such as blood glucose meter, … Read More → "NEC Electronics Europe Announces 78K0R – SENSE IT! Development Kit"

San Diego, California, January 11, 2010 * * * congatec AG extends its COM Express product family with the highest performance module conga-BM57. It features the latest Intel® CoreT i7-620M processor with a core speed of 2.66 GHz, with 4 MByte L2 cache and up to 8 GByte fast (1066 MT/s) dual channel DDR3 memory. The conga-BM57 is a two-chip solution which utilizes the powerful Mobile Intel® QM57 Express Chipset. The integrated graphics controller is supporting the Intel® Flexible Display Interface (FDI) in order to allow for two independent video channels on VGA, LVDS, HDMI, DisplayPort or SDVO interfaces.

The … Read More → "congatec Announces New COM Express Small Form Factor Module Based on Latest Intel® CoreT i7 Processor"

MILPITAS, CA – January 11, 2010 – Linear Technology Corporation introduces the LTM2882, a 2-channel isolated RS232 µModule® transceiver that guards against large ground-to-ground differentials and common mode transients. In practical RS232 systems, ground potentials may vary widely from node to node, often exceeding the tolerable range, resulting in an interruption of communications or destruction of a transceiver. The LTM2882 breaks ground loops by isolating the logic level interface and line transceiver using internal inductive signal isolation. This allows for a much larger common mode voltage range plus superior common mode rejection >30kV/µs. A low EMI DC-DC converter … Read More → "Dual Isolated RS232 µModule Transceiver Integrates Isolated Power"

WILSONVILLE, Ore.–(BUSINESS WIRE)–Mentor Graphics Corporation (NASDAQ:MENT) today announced that Freescale Semiconductor (NYSE:FSL) (NYSE:FSL.B) has selected Mentor as an ideal partner in the silicon test, yield analysis, physical verification and DFM technology areas.

The collaboration enables Freescale’s deployment of Mentor’s Read More → "Freescale Semiconductor Collaborates with Mentor Graphics on Tessent Silicon Test, Yield Analysis, Calibre Physical Verification and DFM"