SANTA CLARA, Calif., Jan. 13, 2010 — Agilent Technologies Inc. (NYSE: A) today announced that Yamagata University in Japan, has selected Agilent’s SystemVue software for use in its emerging communications, physical layer (PHY) research. The electronic system-level software will play a critical role in the university’s ongoing investigations and reduce by up to 30 percent the time required for design and verification of the Yamagata team’s communication PHY
system.

The research at Yamagata University is led by Associate Professor Katsumi Takano and is supported by the Strategic Information and … Read More → "Agilent Technologies’ SystemVue Selected by Yamagata University for OFDM for Optical Fiber Communications Research"

WILSONVILLE, Ore.–(BUSINESS WIRE)–Mentor Graphics Corp. (NASDAQ:MENT), the leader in high-performance system verification solutions, today announced a hardware-assisted solution to accelerate the verification of Universal Serial Bus (USB) 2.0 products, including hard disk drives and other mass storage devices. This new solution enables designers to test the System-on-Chip (SoC) design that controls a hard disk drive or similar mass storage device, by providing an accurate, hardware-based model of the real disk drive connected to their SoC.

This Read More → "Mentor Graphics Delivers Hardware-Assisted Solution for the Accelerated Verification of USB 2.0 Products"

SANTA CLARA, Calif., Jan. 13, 2010 — Agilent Technologies Inc. (NYSE: A) today introduced a 12-GHz differential wafer probing solution. The fine-wire probe tip is a high-fidelity, high-bandwidth solution that allows R&D and test engineers to debug and test high-speed active ICs using an oscilloscope.

The N2884A InfiniiMax differential fine-wire probe tip uses Agilent’s low-cost, ZIF probe head technology, which provides a flat frequency response over the entire 12-GHz bandwidth specification. The tip eliminates the distortion and loading that affect probes with in-band resonance. The N2884A measures … Read More → "Agilent Technologies Introduces 12-GHz Differential Wafer Probing Solution for Better Signal Integrity"

SAN JOSE, Calif., Jan. 12, 2010 – Xilinx, Inc. (NASDAQ: XLNX) today announced the first shipments and availability of its Virtex®-6 LX760 device. As the industry’s largest FPGA available for delivery with immediate design tool support, the Virtex-6 LX760 device enables Xilinx customers who need raw logic density and industry-leading I/O performance to get started on their projects today using the Xilinx ISE® Design Suite 11.4.

“The Virtex-6 LX760 device offers more than two and a half times the density of the largest Virtex-5 device, so it was a natural choice for us as we transition … Read More → "Industry’s Biggest, Highest Performance FPGA Now Shipping from Xilinx"

Kirchheim/Teck, 11th January 2010 – Dialog Semiconductor plc (FWB: DLG), a leading provider of highly integrated innovative power management semiconductor solutions, has announced its DA9035 IC for power management and audio has been designed into the GW880 Smartphone from LG.

This design-in is the latest in a series of LG 3G mobile platforms to benefit from Dialog ICs over the past 12 months.

The 3G Smartphone is currently available on the China Mobile network and features a 3.5″ (800X480) WVGA touch screen, GPS, Bluetooth, TD-SCDMA / TD-HSPA connectivity, a 5 MP camera and Mobile TV supporting CMMB (China Multimedia Broadcasting).< … Read More → "Dialog Semiconductor Power Management IC selected by LG for Android Smartphone"

San Jose, Calif, January 12, 2010 – ADLINK Technology, Inc., a global provider of trusted embedded products, presented the Express-CB, the newest and most powerful member of the ADLINK Computer-on-Module (COM) family. The Express-CB is a COM Express™ Type 2 module supporting the 64-bit Intel® Core™ i7 / i5 processor with CPU, memory controller, and graphics processor on the same chip. Based … Read More → "ADLINK Announces COM Express® Module with Intel® Core™ i7 / i5 Processor featuring Integrated Graphics and Memory Controller"

NEWARK, Calif., January 12, 2010-SMART Modular Technologies (WWH), Inc. (“SMART” or the “Company”) (NASDAQ: SMOD), a leading independent manufacturer of memory modules and solid-state storage products, including SSDs, has expanded its lineup of DDR3 small modules. The new products include unbuffered and registered error-correction code (ECC) mini-DIMMs in very-low-profile (VLP) and standard heights as well as unbuffered and registered ECC SO-DIMMs. Serving a wide variety of applications in the networking, telecom, storage, and industrial markets, SMART’s DDR3 ECC small modules are optimized for space savings, high density, lower power, and high performance.

Available in a broad range … Read More → "SMART Modular Technologies Expands Lineup of DDR3 High Density, Small Modules for Networking, Telecom, Storage, and Industrial Applications"

MOUNTAIN VIEW, Calif. – January 13, 2010 – Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, today announced the DesignWare(R) USB 3.0 Protocol Analyzer, a new graphical debugger for SuperSpeed USB 3.0, the latest generation of the USB interface that delivers 10 times the speed of Hi-Speed USB 2.0.  The DesignWare USB 3.0 Protocol Analyzer simplifies debug for engineers verifying SuperSpeed USB 3.0 and USB 2.0 interfaces in their systems-on-chip (SoCs) by providing a graphical view of the protocol traffic. It helps users quickly identify unexpected patterns in the design traffic and then switches to a detailed view … Read More → "Synopsys announces DesignWare Protocol Analyzer for verification of SuperSpeed USB 3.0-based designs"

MOUNTAIN VIEW, Calif. – January 13, 2010 – Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, today announced the DesignWare(R) USB 3.0 Protocol Analyzer, a new graphical debugger for SuperSpeed USB 3.0, the latest generation of the USB interface that delivers 10 times the speed of Hi-Speed USB 2.0.  The DesignWare USB 3.0 Protocol Analyzer simplifies debug for engineers verifying SuperSpeed USB 3.0 and USB 2.0 interfaces in their systems-on-chip (SoCs) by providing a graphical view of the protocol traffic. It helps users quickly identify unexpected patterns in the design traffic and then switches to a detailed view … Read More → "Synopsys announces DesignWare Protocol Analyzer for verification of SuperSpeed USB 3.0-based designs"

Ottawa, Canada and Bristol, UK – January 13, 2010 – Sidense Corp., a leading developer of Logic Non-Volatile Memory (LNVM) IP cores, and Audium Semiconductor, a developer of highly efficient audio power amplifier integrated circuits, have announced the use of Sidense’s ultra-low-power SLP one-time programmable (OTP) memory in Audium’s recently announced high efficiency AS1001 audio power amplifier chip.  The Sidense OTP macro is used to predefine … Read More → "Sidense OTP Memory IP Helps “Green Up” Audium’s Power Amplifier"