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Libelium to demonstrate wireless sensor platform Waspmote and multi-protocol wireless router Meshlium at key sensor industry events starting with CeBIT 2010

Zaragoza, Spain – February 23rd, 2010 – Libelium, a technology leader in distributed wireless networks, announces their participation in three major wireless industry events. The exhibitions include CeBIT 2010 in Hannover, Germany, from 2nd-6th March; Sensor+Test 2010 in Nuremberg, Germany, from 18th-20th May; and Sensors Expo & Conference 2010 in Rosemont, Illinois, USA from 7th-9th June. Libelium will demonstrate the Waspmote wireless sensor … Read More → "Libelium to demonstrate wireless sensor platform Waspmote and multi-protocol wireless router Meshlium at key sensor industry events starting with CeBIT 2010"

Cards on the Table

It’s that time again.  

The process calendar has struck two, Gordon Moore’s little hand is pointing to the 28nm, and his big hand is pointing to sometime later this year.  The usual competitors are strapped into their seats. They’ve donned their rhetoric helmets, engaged their marketing drives, and shifted their gearboxes into “disclose”.  

Instead of re-publishing our popular “45nm Chicken” article with 45 scratched out and 28 written in in crayon, we’ll just give you a link so you … Read More → "Cards on the Table"

Android… Android… Android…

Just one short year ago, developers were scratching their heads over this curiosity called Android. Today it appears developers can’t wait to get their mitts on it. Programmers and major device manufacturers alike are showing a great appetite for Android. This feeding frenzy has spilled over to the smart phone user as well. When market-research firm ComScore polled smart phone users in late summer of 2009, seven percent of current users said they would be switching over to an Android phone. A few months later, the same polling found 17 percent of the … Read More → "Android… Android… Android…"

RFMD® Introduces PowerSmart™ Power Platforms

BARCELONA, SPAIN – February 15, 2010 – RF Micro Devices, Inc. (Nasdaq GS: RFMD), a global leader in the design and manufacture of high-performance radio frequency components and compound semiconductor technologies, today introduced PowerSmart™ power platforms, a new product category designed to reshape the future of multimode, multi-band cellular RF architectures. RFMD’s PowerSmart™ platforms feature a revolutionary new RF Configurable Power Core™, which leverages industry-leading functional efficiency and delivers state-of-the-art processing of all known cellular communications modulation schemes, including GSM/GPRS, EDGE, EDGE Evolution, CDMA, 3G (TD-SCDMA or WCDMA/HSPA+) and 4G (LTE or WiMAX). With PowerSmart< … Read More → "RFMD® Introduces PowerSmart™ Power Platforms"

Xilinx Picks 28nm High–Performance, Low-Power Process to Accelerate Platforms for Driving the Programmable Imperative

SAN FRANCISCO, Calif. Feb. 22, 2010 – Xilinx Inc. (Nasdaq: XLNX) today announced the foundation for a next-generation of Xilinx programmable platforms that will give system designers FPGAs that consume half the power at twice the capacity than previously possible for addressing the Programmable Imperative. Xilinx is maximizing the value of the 28nm technology node by choosing a high-performance, low-power process technology, a common scalable architecture across product ranges, and tool innovations so customers will have FPGAs that deliver the ASIC-class capabilities they need to meet their cost and power budgets, while improving their … Read More → "Xilinx Picks 28nm High–Performance, Low-Power Process to Accelerate Platforms for Driving the Programmable Imperative"

Silicon Frontline Technology Improves Performance and Capacity of Flagship EDA Products for Post-Layout Verification, 3D Extraction, Nanometer Design

Los Gatos, CA – February 18, 2010 – Silicon Frontline Technology, Inc. (SFT), an Electronic Design Automation (EDA) company in the post-layout verification market, announced today that new versions of its flagship post-layout verification products, </ … Read More → "Silicon Frontline Technology Improves Performance and Capacity of Flagship EDA Products for Post-Layout Verification, 3D Extraction, Nanometer Design"

OneSpin Solutions Announces Customizable Integration Between 360 MV Verification Solution and Platform LSF Infrastructure

MUNICH, Germany and SUNNYVALE, Calif.  — February 22, 2010 — OneSpin Solutions, an electronic design automation (EDA) company that provides innovative functional RTL verification solutions, today announced the customizable integration between OneSpin’s 360 MV formal assertion-based verification (ABV) solution and Platform Computing’s LSF infrastructure, the industry’s leading workload management solution for high-performance computing environments. The integration enables 360 MV users to transparently distribute assertion proofs onto multiple heterogeneous computers, slashing turnaround times in complex chip verification. Platform Computing is a leader in cluster, grid and cloud management software and has welcomed OneSpin … Read More → "OneSpin Solutions Announces Customizable Integration Between 360 MV Verification Solution and Platform LSF Infrastructure"

OneSpin Solutions Announces Customizable Integration Between 360 MV Verification Solution and Platform LSF Infrastructure

MUNICH, Germany and SUNNYVALE, Calif.  — February 22, 2010 — OneSpin Solutions, an electronic design automation (EDA) company that provides innovative functional RTL verification solutions, today announced the customizable integration between OneSpin’s 360 MV formal assertion-based verification (ABV) solution and Platform Computing’s LSF infrastructure, the industry’s leading workload management solution for high-performance computing environments. The integration enables 360 MV users to transparently distribute assertion proofs onto multiple heterogeneous computers, slashing turnaround times in complex chip verification. Platform Computing is a leader in cluster, grid and cloud management software and has welcomed OneSpin … Read More → "OneSpin Solutions Announces Customizable Integration Between 360 MV Verification Solution and Platform LSF Infrastructure"

EASii IC Working With Jasper To Promote Formal Innovations In Europe

MOUNTAIN VIEW, Calif. – Feb. 18, 2010 –  Jasper Design Automation, provider of advanced formal technology solutions, today announced it is working with France’s EASii IC, a well-known European electronic-design consulting company, to accelerate the adoption of formal verification methods and increase understanding of how they apply across the entire spectrum of chip design, from architecture to signoff, with its customers.

“At EASii IC we are proud to collaborate with the leading supplier of formal verification,” said Francois Cerisier, IC Verification Expert, EASii IC.  “We believe our combined efforts to provide expert … Read More → "EASii IC Working With Jasper To Promote Formal Innovations In Europe"

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